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Method of efficiently laser marking singulated semiconductor devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-019/00
출원번호 US-0440820 (1999-11-15)
발명자 / 주소
  • Canella, Robert L.
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    TraskBritt
인용정보 피인용 횟수 : 9  인용 특허 : 95

초록

A laser marking apparatus and method for marking the surface of a singulated article such as a semiconductor chip are described herein. Semiconductor chips are fed along inclined, parallel tracks to a laser marking field where they are subsequently marked by a laser beam. As the laser beam is markin

대표청구항

A laser marking apparatus and method for marking the surface of a singulated article such as a semiconductor chip are described herein. Semiconductor chips are fed along inclined, parallel tracks to a laser marking field where they are subsequently marked by a laser beam. As the laser beam is markin

이 특허에 인용된 특허 (95)

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이 특허를 인용한 특허 (9)

  1. Cohn, John M.; Flemming, Mark J.; Malinowski, John C.; Swanke, Karl V., Fabricating product chips and die with a feature pattern that contains information relating to the product chip.
  2. Peterson,Darin L.; Slaughter,Michael R.; McCall,Keith P., Methods and apparatus for retaining a tray stack having a plurality of trays for carrying microelectric devices.
  3. Peterson, Darin L.; Slaughter, Michael R.; McCall, Keith P., Methods and apparatus for retaining a tray stack having a plurality of trays for carrying microelectronic devices.
  4. Peterson,Darin L.; Slaughter,Michael R.; McCall,Keith P., Methods and apparatus for retaining a tray stack having a plurality of trays for carrying microelectronic devices.
  5. Cohn, John M.; Flemming, Mark J.; Malinowski, John C.; Swanke, Karl V., Methods for reading a feature pattern from a packaged die.
  6. Cohn, John M.; Flemming, Mark J.; Malinowski, John C.; Swanke, Karl V., Product chips and die with a feature pattern that contains information relating to the product chip.
  7. Kim, Yeongseok, Semiconductor package and method of fabricating the same.
  8. Kim, Yeongseok, Semiconductor package and method of fabricating the same.
  9. Kim, Yeongseok, Semiconductor package and method of manufacturing the same.
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