초록 ▼

A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the photo-curable resin composition comprising (

A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the photo-curable resin composition comprising (A) a compound having oxetane ring, (B) a photoinitiator for cationic polymerization and (C) a silane coupling agent, wherein the composition has a viscosity in the range from 0.01 to 300 Pa.s at 25° C.

대표청구항 ▼

A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the photo-curable resin composition comprising (

A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the photo-curable resin composition comprising (A) a compound having oxetane ring, (B) a photoinitiator for cationic polymerization and (C) a silane coupling agent, wherein the composition has a viscosity in the range from 0.01 to 300 Pa.s at 25° C. gomeric material; ii) a photoinitiator; and iii) a diluent wherein said composition is a solid at room temperature; b) heating said composition to a temperature between about 50 to 140° C.; c) selectively dispensing said composition at a dispensing temperature from about 50 to about 140° C., said composition being selectively dispensed to correspond to said portion of the 3D model or image; and d) exposing said selectively dispensed composition to radiation to cure said composition. 19. The method of claim 18 wherein the semi-crystalline or crystalline, low-shrinkage, radiation curable material is selected from the group consisting of polyester oligomers containing end methacrylyl groups and methacrylated urethane oligomers and said diluent is a monofunctional, difunctional or tri-functional monomeric material. 20. The method of claim 18 wherein said radiation curable composition has a viscosity between about 10 to about 50 centipoise at said dispensing temperature. 21. The method of claim 20 wherein said radiation curable composition has a viscosity between about 10 to about 15 centipoise at said dispensing temperature. 22. The method of claim 21 wherein said dispensing temperature is from about 125 to about 135° C. 23. The method of claim 18 wherein said radiation used in step (d) is ultraviolet radiation. 24. The method of claim 18 further comprising: e) repeating steps c) and d) to form additional portions of the 3D model or image. 25. The method of claim 18 wherein said radiation curable composition comprises: from about 10 to about 40% by weight of the semi-crystalline or crystalline radiation curable oligomeric material; from about 0.05 to about 5% by weight of the photoinitiator; and from about 60 to about 90% by weight of the diluent. 26. The method of claim 25 wherein said semi-crystalline or crystalline material is a polyester oligomer containing end methacrylic groups; said photoinitiator is a free-radical type photoinitiator; and said diluent is a reactive diluent. 27. The method of claim 26 wherein said reactive diluent is selected from the group consisting of tris (2-hydroxy ethyl) isocyanurate triacrylate, triethyline glycol dimethacrylate and alkoxylated cyclohexane dimethanol diacrylate.