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특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Feedthrough devices

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01J-005/00   
미국특허분류(USC) 174/050.56; 174/050.56; 607/036
출원번호 US-0557336 (2000-04-24)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Kilpatrick Stockton LLP
인용정보 피인용 횟수 : 46  인용 특허 : 19
초록
▼

A feedthrough device having a ground wire that is coupled to both a metallic ferrule and to an insulating material and methods of making the device are provided. The ground wire is coupled or brazed between, adjacent to, or otherwise in direct contact with the metallic ferrule and the insulating material, for example, in a gap between the insulating material and the ferrule, or directly to the side of the insulating material and abutting the surface of the ferrule. If the ground wire is coupled or brazed in a gap, the gap may be formed by a notch in eith...

대표
청구항
▼

A feedthrough device having a ground wire that is coupled to both a metallic ferrule and to an insulating material and methods of making the device are provided. The ground wire is coupled or brazed between, adjacent to, or otherwise in direct contact with the metallic ferrule and the insulating material, for example, in a gap between the insulating material and the ferrule, or directly to the side of the insulating material and abutting the surface of the ferrule. If the ground wire is coupled or brazed in a gap, the gap may be formed by a notch in eith...

이 특허에 인용된 특허 (19)

  1. Kraska Robert E. (Minneapolis MN) Lessar Joseph F. (Anoka MN). Alloy composition and brazing therewith, particularly for _ceramic-metal seals in electrical feedthroughs. USP1979124180700.
  2. Nakata Hirohiko (Hyogo JPX) Nishioka Takao (Hyogo JPX) Oooka Nobuya (Hyogo JPX) Motoyoshi Kenya (Hyogo JPX). Ceramics-metal jointed body. USP1991065023147.
  3. Loeb Gerald E.,CAX ITX K7L 3E5. Cochlear electrode array employing tantalum metal. USP1998115833714.
  4. Kaun Thomas D. (320 Willow St. New Lenox IL 60451). Corrosion resistant ceramic materials. USP1996075538810.
  5. Etheridge David R. (1733 Hiawatha Dr. Glendora CA 91208). De-ionized fluid heater and control system. USP1989054835365.
  6. Duva Frank A. ; Azodi-Kazerooni Mansoor. Feed-through filter capacitor assembly. USP1998105825608.
  7. Hittman Fred (Baltimore MD) Gelb Allan S. (Baltimore MD) Gelb Marcia J. (Baltimore MD) Foreman Thomas N. (Ellicott City MD). Filtered feedthrough assembly having a mounted chip capacitor for medical implantable devices and method of manufacture. USP1997075650759.
  8. Byers Charles L. (Canyon Country CA) Beazell James W. (Rancho Palos Verdes CA) Schulman Joseph H. (Granada Hills CA) Rostami Ali (Santa Monica CA). Hermetically sealed ceramic and metal package for electronic devices implantable in living bodies. USP1991024991582.
  9. Schulman Joseph H. ; Canfield Lyle Dean. Hermetically sealed electrical feedthrough for use with implantable electronic devices. USP1998055750926.
  10. Shipe Gary (Cambridge MD). Hermetically sealed package for a high power hybrid circuit. USP1997125700724.
  11. Shipman Thomas W. (Rochester MA) Bealka David J. (East Freetown MA) Brown Timothy J. (Mattapoisett MA). High temperature feed-through system and method for making same. USP1995085440447.
  12. Taylor William J. ; Seifried Lynn M. ; Weiss Douglas ; Lessar Joseph F.. Implantable medical device with multi-pin feedthrough. USP1999025866851.
  13. Taylor William J. ; Seifried Lynn M ; Weiss Douglas ; Lessar Joseph F.. Implantable medical device wtih multi-pin feedthrough. USP1998105817984.
  14. Taylor William J. (Anoka MN) Weiss Douglas (Plymouth MN) Lessar Joseph F. (Coon Rapids MN). Implantable pulse generator feedthrough. USP1990074940858.
  15. Brendel Richard L. ; Stevenson Robert A.. Internally grounded feedthrough filter capacitor. USP1999055905627.
  16. Kuzma Janusz (Stanmore AUX). Method of making feedthrough assemblies having hermetic seals between electrical feedthrough elements and ceramic carrie. USP1991095046242.
  17. Moldenhauer David William (Goldsboro NC). Multi-pole electrical connector with ground continuity. USP1997105681172.
  18. Mizuhara Howard (Hillsborough CA) Smith P. C. (Burlingame CA). Sealed conductive active alloy feedthroughs. USP1994115368220.
  19. Hittman Fred ; Gelb Allan S. ; Gelb Marcia J. ; Foreman Thomas N. ; Kutniewski Paul E.. Substrate mounted filter for feedthrough devices. USP1999045896267.

이 특허를 인용한 특허 피인용횟수: 46

  1. Lower, Nathan P.; Boone, Alan P.; Wilcoxon, Ross K.; Hillman, David D.. Alkali silicate glass based coating and method for applying. USP2017029565758.
  2. Capcelea, Edmond D.; Leigh, Charles R. A.. Braze join. USP2013108560079.
  3. Markham, Jacob; Hausch, Ulrich; Pavlovic, Goran. Ceramic feedthrough brazed to an implantable medical device housing. USP2017059653893.
  4. Byers,Charles L.; Jiang,Guangqiang; Schnittgrund,Gary D.. Ceramic to noble metal braze and method of manufacture. USP2006016989200.
  5. Troetzschel, Jens; Specht, Heiko. Cermet-containing bushing for an implantable medical device. USP2014068755887.
  6. Bealka, David Joseph; Vaillancourt, Christien Matthew; Kimock, Fred Michael; Gill, Emma Claire. Co-fired metal and ceramic composite feedthrough assemblies for use at least in implantable medical devices and methods for making the same. USP2014048698006.
  7. Markham, Jacob; Hausch, Ulrich. Direct integration of feedthrough to implantable medical device housing by sintering. USP2017049610452.
  8. Markham, Jacob; Hausch, Ulrich. Direct integration of feedthrough to implantable medical device housing using a gold alloy. USP2017049610451.
  9. Markham, Jacob; Hausch, Ulrich. Direct integration of feedthrough to implantable medical device housing with ultrasonic welding. USP2016119504841.
  10. Markham, Jacob; Hausch, Ulrich. Direct integration of feedthrough to implantable medical device housing with ultrasonic welding. USP2018019855008.
  11. Markham, Jacob; Hausch, Ulrich. Directly integrated feedthrough to implantable medical device housing. USP2017129849296.
  12. Troetzschel, Jens; Specht, Heiko. Electrical bushing for an implantable medical device. USP2015018929987.
  13. Troetzschel, Jens; Pavlovic, Goran; Manhardt, Harald; Staudt, Nicole. Electrical bushing with gradient cermet. USP2016089407076.
  14. Miltich, Tom; Yamamoto, Joyce; Thom, Andy; Reiterer, Markus; Munns, Gordon; Breyen, Mark. Electrical leads for a feedthrough. USP2017049627833.
  15. Barry, Patrick J.; Boettger, Derek John. Feedthrough assembly for an implantable device. USP2015018927862.
  16. Barry, Patrick J.; Boettger, Derek John. Feedthrough assembly for an implantable device. USP2013128604341.
  17. Morioka, Kengo; Knudsen, Arne; Satou, Shingo; Otomaru, Hidekazu; Makino, Hiroshi; Thom, Andrew; Reiterer, Markus; Munns, Gordon; Miltich, Thomas; Yamamoto, Joyce. Feedthrough configured for interconnect. USP2013118588916.
  18. Markham, Jacob; Hausch, Ulrich. Feedthrough with integrated brazeless ferrule. USP2017119814891.
  19. He,Tom Xiaohai. Feedthru assembly. USP2009037498516.
  20. Morioka, Kengo; Knudsen, Arne; Satou, Shingo; Otomaru, Hidekazu; Thom, Andrew; Makino, Hiroshi; Reiterer, Markus; Munns, Gordon; Miltich, Thomas; Yamamoto, Joyce. Hermetic feedthrough. USP2014098841558.
  21. Morioka, Kengo; Knudsen, Arne; Satou, Shingo; Otomaru, Hidekazu; Thom, Andrew; Makino, Hiroshi; Reiterer, Markus; Munns, Gordon; Miltich, Thomas; Yamamoto, Joyce; Hirata, Takahito. Hermetic feedthrough. USP2014108872035.
  22. He, Tom Xiaohai; Colvin, Michael S.. Hermetically bonding ceramic and titanium with a Ti-Pd braze interface. USP2010087771838.
  23. Xiaohai, Tom; Colvin, Michael S. Hermetically bonding ceramic and titanium with a palladium braze. USP2012128329314.
  24. Heeke, Neil. Hermetically sealed electrical feed-through device with a straight isolated pin in an offset oval glass seal. USP2005046874423.
  25. Morioka, Kengo; Fujii, Keiichi; Knudsen, Arne; Satou, Shingo; Otomaru, Hidekazu; Makino, Hiroshi; Thom, Andrew; Reiterer, Markus; Munns, Gordon; Miltich, Thomas; Yamamoto, Joyce. Insulator for a feedthrough. USP2015049008779.
  26. Morioka, Kengo; Fujii, Keiichi; Knudsen, Arne; Satou, Shingo; Otomaru, Hidekazu; Makino, Hiroshi; Thom, Andrew; Reiterer, Markus; Munns, Gordon; Miltich, Thomas; Yamamoto, Joyce. Insulator for a feedthrough. USP2014038670829.
  27. Lower, Nathan P.; Wilcoxon, Ross K.; Boone, Alan P.. Integrated circuit protection and ruggedization coatings and methods. USP2015119196555.
  28. Breyen, Mark; Miltich, Tom; Munns, Gordon. Interconnection of conductor to feedthrough. USP2017089724524.
  29. Imani,Reza; Hawkins,Rodney J.. Internally grounded filtering feedthrough. USP2006057046499.
  30. Markham, Jacob; Hausch, Ulrich; Pavlovic, Goran. Laser welding a feedthrough. USP2016109478959.
  31. Pretzlaff, Bernd; Kuehl, Hans-Juergen. Lead feedthrough and electrical functional unit. USP2015018941020.
  32. Iyer, Rajesh V.; Koch, Daniel J.; Goldman, Simon E.; Knowles, Shawn D.; Taylor, William J.; Yamamoto, Joyce K.; Haubrich, Gregory J.; Nowak, Michael; Nghiem, David; Hubing, Roger L.; Twetan, Len D.. Method and apparatus for minimizing EMI coupling in a feedthrough array having at least one unfiltered feedthrough. USP2012048160707.
  33. Boone, Alan P.; Lower, Nathan P.; Wilcoxon, Ross K.. Method for providing near-hermetically coated integrated circuit assemblies. USP2015018935848.
  34. Troetzschel, Jens; Pavlovic, Goran; Manhardt, Harald; Wollenberg, Norbert; Guebler, Nicole. Method for sintering electrical bushings. USP2013078494635.
  35. Markham, Jacob; Hausch, Ulrich; Pavlovic, Goran. Method of coupling a feedthrough assembly for an implantable medical device. USP2016089431801.
  36. Markham, Jacob; Hausch, Ulrich. Method of forming feedthrough with integrated brazeless ferrule. USP2016089403023.
  37. Morioka, Kengo; Fujii, Keiichi; Knudsen, Arne; Satou, Shingo; Otomaru, Hidekazu; Makino, Hiroshi; Thom, Andrew; Reiterer, Markus; Munns, Gordon; Miltich, Thomas; Yamamoto, Joyce. Method of manufacturing a feedthrough. USP2016089418778.
  38. Troetzschel, Jens; Specht, Heiko. Method of producing a cermet-containing bushing for an implantable medical device. USP2016109480168.
  39. Troetzschel, Jens; Pavlovic, Goran; Manhardt, Harald; Guebler, Nicole. Method of producing an electrical bushing with gradient cermet. USP2013098528201.
  40. Lower, Nathan P.; Brower, David M.; Wilcoxon, Ross K.. Method of reinforcing a hermetic seal of a module. USP2015119197024.
  41. Brosnan, William M.; Iyer, Rajesh V.; Johnstone, George C.; Tettemer, Susan A.; Thom, Andrew J.. Methods for simultaneously brazing a ferrule and lead pins. USP2015099138821.
  42. Noujeim, Leesa; Hockanson, David; Novak, Istvan. Power integrity circuits with EMI benefits. USP2011067969712.
  43. Troetzschel, Jens; Pavlovic, Goran; Manhardt, Harald; Wollenberg, Norbert; Staudt, Nicole. Sintered electrical bushings. USP2014118886320.
  44. VandenEynden, Brian; Khadkikar, Prasad S.; Schuckmann, Scott; Sun, Jian; Lakner, Gabe. Solid core glass bead seal with stiffening rib. USP2014128921700.
  45. Jarvik, Robert. Sub-miniature electromechanical medical implants with integrated hermetic feedthroughs. USP2015059033863.
  46. Jarvik, Robert. Sub-miniature electromechanical medical implants with integrated hermetic feedthroughs. USP2013108550974.

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