초록 ▼

A capacity estimation method for a Li-ion cell is provided. In the method, according to a first aspect, an elapsed time from the time when charge voltage in constant current charge reaches a predetermined voltage to the time when charge condition is changed to a constant voltage mode is used for cal

A capacity estimation method for a Li-ion cell is provided. In the method, according to a first aspect, an elapsed time from the time when charge voltage in constant current charge reaches a predetermined voltage to the time when charge condition is changed to a constant voltage mode is used for calculating an estimated capacity of said Li-ion cell. According to a second aspect, a charge current after a lapse of a predetermined time from the time when charge condition is changed to a constant voltage mode is used. According to a third aspect an elapsed time from the time when charge condition is changed to a constant voltage mode to the time when charge current becomes α (0<α<1) times is used.

대표청구항 ▼

A capacity estimation method for a Li-ion cell is provided. In the method, according to a first aspect, an elapsed time from the time when charge voltage in constant current charge reaches a predetermined voltage to the time when charge condition is changed to a constant voltage mode is used for cal

A capacity estimation method for a Li-ion cell is provided. In the method, according to a first aspect, an elapsed time from the time when charge voltage in constant current charge reaches a predetermined voltage to the time when charge condition is changed to a constant voltage mode is used for calculating an estimated capacity of said Li-ion cell. According to a second aspect, a charge current after a lapse of a predetermined time from the time when charge condition is changed to a constant voltage mode is used. According to a third aspect an elapsed time from the time when charge condition is changed to a constant voltage mode to the time when charge current becomes α (0<α<1) times is used. st is placed, for applying a test pattern signal to an input terminal of the IC under test, and comparators each provided in correspondence with a respective pin of the IC socket for capturing a logical value of a response output signal obtained from an output terminal of the IC under test, and decides whether the response output signal coincides with a predetermined expected value to determine whether said IC under test is a defective article, wherein said IC tester has a calibration function and comprises: a probe for selectively contacting respective pins of said IC socket; a reference comparator mounted in said probe for capturing respective calibration pulses applied to respective pins of said IC socket while in contact with said probe at a reference timing of a reference strobe pulse; a reference driver mounted in said probe for applying reference calibration pulses to respective pins of said IC socket while in contact with said probe; driver variable delay circuits each provided in a signal path of a respective driver for adjusting a delay time of the calibration pulse to be applied through said respective driver to a corresponding pin of said IC socket; strobe variable delay circuits each provided in a signal path of a strobe pulse to be applied to a respective comparator for adjusting a delay time of said strobe pulse; and calibration control means for calibrating the drivers by comparing a logical value of the calibration pulse captured by said reference comparator with an expected value, and controlling each driver variable delay circuit so that phases of calibration pulses applied to respective pins of said IC socket from each of said drivers coincide with the reference timing of said reference strobe pulse, and for calibrating the comparators by controlling each said strobe variable delay circuit so that the timings of strobe pulses to be applied to the respective comparators coincide with the timing of said reference calibration pulse to be applied to respective pins of said IC socket. 3. The IC tester as claimed in claim 2, which further comprises: a reference calibration pulse variable delay circuit provided in the signal path of said reference driver for adjusting the timing of said reference calibration pulse; and a reference strobe pulse variable delay circuit provided in the signal path of said reference strobe pulse for adjusting the timing of said reference strobe pulse. 4. The IC tester as claimed in claim 3, wherein said probe is supported by an automatic positioning device movable in X, Y and Z directions above a test head with said IC socket placed thereon, and automatically contacts each pin of said IC socket to perform timing calibration of driver- and comparator-associated signal paths. 5. The IC tester as claimed in claim 4, wherein a plurality of such probes are provided, which are automatically contacted with a plurality of IC sockets, respectively, to simultaneously perform timing calibration of driver- and comparator-associated signal paths connected to said IC sockets. 6. The IC tester as claimed in claim 4, which has a construction in which an output terminal of the reference driver and an input terminal of the reference comparator mounted in said probe are connected to separately provided contacts and the output of the reference driver and the input of the reference comparator are contacted with each pin of said IC socket through said independent contacts to perform timing calibration. 7. The IC tester as claimed in claim 6, which has a construction in which a short pad is provided on the surface of movement of said contacts; the contact connected to the output terminal of said reference driver and the contact connected to the input terminal of said reference comparator are contacted with said short pad to short them; and the reference calibration pulse from said reference driver is fed via said short pad to said reference comparator to calibrate the timing of either one of said reference driver and said reference comparator. 8. The IC tester as claimed in any one of claims 2 to 7, wherein there is provided means for adjusting the delay time difference between rise and fall of detection pulses that are output by said reference comparator. 9. The IC tester as claimed in claim 7, wherein said reference calibration pulse variable delay circuit and said reference strobe pulse variable delay circuit each comprises: a fractional delay time generating part formed by a phase locked loop and adding means for finely shifting oscillation phase of a voltage-controlled oscillator forming the phase locked loop; and an integral delay time generating part for generating a delay time that is an integral multiple of pulse period of a pulse train of a reference frequency that is applied to said phase locked loop. 10. The IC tester as claimed in any one of claims 3 to 7, wherein said probe has mounted therein a constant temperature chamber, in which said reference driver, said reference comparator, said reference calibration pulse variable delay circuit and said reference strobe pulse variable delay circuit are mounted to keep temperature constant. 11. A timing calibration method for an integrated circuit (IC) tester that comprises an IC socket having a plurality of pins to be calibrated, a plurality of comparators each connected to a respective one of the pins, and a probe including a reference driver, said method comprising the steps of: (a) applying a reference calibration pulse from said reference driver of said probe to a first selected pin of said IC socket while in contact with the probe; (b) capturing said reference calibration pulse applied from said reference driver to said first selected pin by one comparator of said plurality of comparators that is connected to said first selected pin at the timing of a strobe pulse that is provided to said one comparator; (c) calculating a deviation between the timing of said reference calibration pulse and the timing of said strobe pulse for said one comparator; (d) adjusting the delay time of a timing calibrating variable delay circuit provided in a signal path of said strobe pulse for said one comparator so that said deviation for said one comparator becomes a predetermined value for comparator; and (e) repeating steps (a) to (d) for a different first selected pin until the deviations for respective comparators become the same predetermined value for comparator to thereby calibrate said plurality of comparators. 12. The timing calibration method as claimed in claim 11, which further comprises a step of pre-adjusting the delay time of a timing calibrating variable delay circuit for the reference driver provided in the signal path of said reference calibration pulse so that the timing of the reference calibration pulse from said reference driver coincides with the timing of a strobe pulse that is provided to a comparator connected to a predetermined reference pin of said IC socket. 13. The timing calibration method according to claim 11, wherein the integrated circuit (IC) tester further comprises a plurality of drivers each connected to a respective one of said pins and said probe further includes a reference driver, said method further comprising the steps of: (f) applying a calibration pulse from one driver of the plurality of drivers to a second selected pin of said IC socket that is connected to said one driver while in contact with the probe; (g) capturing said calibration pulse from said one driver through said second selected pin by said reference comparator of said probe at the timing of a reference strobe pulse that is provided to said reference comparator; (h) calculating a deviation between the timing of said calibration pulse from said one driver and the timing of said reference strobe pulse; (i) adjusting the delay time of a timing calibrating variable delay circuit provided in a signal path of said one driver so that said deviation f or said one driver becomes a predetermined value for driver; (j) repeating steps (f) to (i) for a different second selected pin until the deviations for respective drivers become the same predetermined value for driver to thereby calibrate said plurality of drivers. 14. The timing calibration method as claimed in claim 13, wherein said first selected pin and said second selected pin are the same pin. 15. The timing calibration method as claimed in claim 13, which further comprises pre-adjusting the delay time of a timing calibrating variable delay circuit for the reference comparator provided in the signal path of said reference strobe pulse so that the timing of said reference strobe pulse coincides with the timing of a calibration pulse provided from a predetermined reference pin of said IC socket. 16. The timing calibration method as claimed in claim 13, which further comprises pre-adjusting the delay time of a timing calibrating variable delay circuit for the reference driver provided in the signal path of said reference calibration pulse so that the timing of the reference calibration pulse from said reference driver coincides with the timing of a strobe pulse that is provided to a comparator connected to a predetermined reference pin of said IC socket. 17. The timing calibration method as claimed in claim 13, which further comprises adjusting either the delay time of a timing calibrating variable delay circuit provided in the signal path of said reference calibration pulse or the delay time of a timing calibrating variable delay circuit provided in the signal path of said reference strobe pulse so that the timing of the reference calibration pulse from said reference driver coincides with the timing of the reference strobe pulse that is provided to said reference comparator. 18. An integrated circuit (IC) tester having an IC testing function for testing an IC under test and a calibration function, comprising: comparators each provided in correspondence with a respective pin of an IC socket on which the IC under test is placed for capturing a logical value of a response output signal obtained from an output terminal of the IC under test at a timing of a strobe pulse during the IC testing function; a probe for selectively contacting the pins of said IC socket one after another; a reference driver mounted in said probe for applying a reference calibration pulse to a selected pin of said IC socket; strobe variable delay circuits, wherein each strobe variable delay circuit is provided in a path of the strobe pulse to be applied to each of said comparators, for adjusting a delay time of said strobe pulse; and calibration control means for controlling each of said strobe variable delay circuits so that the timing of the strobe pulses to be applied to respective comparators coincide with the timing of said reference calibration pulse to be applied to respective pins of said IC socket. a plane comprising said X and said Y direction under a right angle, said test head X-direction and Y-direction and Z-direction coinciding respectively with said handler plate X-direction and Y-direction and Z-direction; receiver block assemblies being attached to said test head plate, said receiver block assemblies comprising a receiver block in addition to comprising a sliding block, each receiver block and each sliding block having a dimension of length in an X-direction in addition to having a dimension of width in an Y direction, said Y direction intersecting said X direction under a right angle, further having a dimension of height in an Z direction, said Z direction intersecting a plane comprising said X and said Y direction under a right angle, said receiver block and said sliding block X-direction and Y-direction and Z-direction coinciding respectively with said handler plate X-direction and Y-direction and Z-direction; an assemblage of second electrical contacts attached to said test head plate for purposes of semiconductor device testing; and a pivot linkage assembly, said pivot linkage assembly being attached to said test head plate, said pivot linkage assembly forming a mechanical linkage between said receiver block assemblies. 2. The apparatus of claim 1 wherein said dimension of height and said dimension of width and said dimension of height of said handler plate are essentially not the same as said dimension of height and said dimension of width and said dimension of height of said of said test head plate. 3. The apparatus of claim 1 wherein said dimension of height and said dimension of width and said dimension of height of said receiver block are smaller than said dimension of height and said dimension of width and said dimension of height of said test head plate by a measurable amount. 4. The apparatus of claim 1 wherein said dimension of length of said each of sliding block is about the same or longer as said dimension of length of each of said receiver block while said dimension of width of each of said sliding block is smaller that said dimension of width of each of said receiver block by an amount, said dimension of height of each of said sliding block being about equal to said dimension of height of each of said receiver block. 5. The apparatus of claim 1, a cross section of said handler plate in a plane parallel to a plane comprising said X and said Y directions of said handler plate being a rectangle or a square, said square having a geometric center being a point of intersection of two diagonals of said rectangle or said square of said handler plate, whereby said assemblage of first electrical contact points is attached to said handler base plate. 6. The apparatus of claim 5, said assemblage of first electrical contacts attached to said handler base plate having cross section in a plane parallel to a plane comprising said X and said Y directions of said handler plate being a rectangle or a square, said rectangle or square having a geometric center being a point of intersection of two diagonals of said rectangle or said square of said assemblage of first electrical contacts, said geometric center of said assemblage of first electrical contacts aligning with said geometric center of said handler plate, furthermore said assemblage of first electrical contact points interfacing with said assemblage of second electrical contact points attached to said test head. 7. The apparatus of claim 6, said assemblage of second electrical contacts attached to said test head having a cross section in a plane parallel to a plane comprising said X and said Y directions of said test head plate being a rectangle or a square, said rectangle or square having a geometric center being a point of intersection of two diagonals of said rectangle or said square, said geometric center of said assemblage of second electrical contacts aligning with said geometric center of said assemblage of first electrical contacts. 8. The ap paratus of claim 7 wherein a cross section of said test head plate in a plane parallel to a plane comprising said X and said Y directions of said test head plate is a rectangle or a square, said rectangle or square having a geometric center being a point of intersection of two diagonals of said rectangle or said square, said geometric center of said test head plate aligning with said geometric center of said assemblage of second electrical contacts. 9. The apparatus of claim 1 wherein a cross section of said receiver block in a plane parallel to a plane comprising said X and said Y directions is a rectangle or a square. 10. The apparatus of claim 1 wherein a cross section of said sliding block in a plane parallel to a plane comprising said X and said Y directions is a rectangle or square. 11. The apparatus of claim 1 wherein said roller assemblies are evenly spaced around a circumference of said handler plate whereby further said roller assembly are mounted on a surface of said handler plate such that said roller assemblies face said test head plate. 12. The apparatus of claim 1, wherein said receiver block assemblies are evenly spaced around a circumference of said test head plate, whereby furthermore each of said receiver block assemblies is mounted on a surface of said handler plate such that each of said receiver block assemblies faces said handler plate, whereby furthermore said receiver block assemblies align with said roller assemblies while one receiver block assembly is mounted on said test head plate for each roller assembly mounted on said handler plate. 13. The apparatus of claim 1 whereby: each of said receiver blocks have been provided with a cavity; each of said receiver blocks have a top surface, whereby said cavity that has been provided in each of said receiver blocks penetrates said top surface and further extends in said Z direction of each of said receiver blocks, whereby said cavity may or may not extend through each of said receiver blocks in said Z direction, whereby said penetration of said cavity through said top surface of each of said receiver blocks has a circumference forming a receiver block top surface profile; and each of said sliding blocks which are attached to said receiver blocks are attached to a receiver block in a X direction of said receiver block, whereby each of said sliding blocks have a groove provided in a surface, further having a pin like extrusion provided on a surface, whereby each of said sliding blocks further have a top surface, whereby said groove provided in said surface of each of said sliding blocks penetrates said top surface, said penetration having a circumference forming a sliding block top surface profile. 14. The apparatus of claim 13 wherein said cavity that has been provided in each of said receiver block is further extended into said test head plate in said Z-direction of said test head plate. 15. The apparatus of claim 13 wherein said groove is provided in a surface that forms an interface between each of said sliding block and a receiver block, whereby a center line of said groove in each of said sliding block initially and starting at said top surface of each of said sliding block penetrates said top surface and proceeds over a distance in a Z direction of each of said sliding block after which said center line of said groove continues over a distance in a direction under an angle of between 5 and 45 degrees with said top surface of each of said sliding block after which said center line of said groove continues over a distance in a direction parallel with said top surface of each of said sliding block. 16. The apparatus of claim 13 wherein each of said receiver block assemblies have a top surface, whereby said cavity that has been provided in each of said receiver blocks, said groove having been provided in a surface of each of said sliding blocks penetrates said top surface of each of said receiver block assembly, whereby said sliding block top surfa ce profile aligns with and forms an extension to at least one extremity of said receiver block top surface profile, thereby forming a receiver block assembly top surface profile, whereby said receiver block assemblies interfaces with said roller assemblies. 17. The apparatus of claim 16 wherein each of said roller assemblies comprises: a main body that extends lengthwise in a Z direction of said handler plate; and roller bearings that extend in radial direction from said main body of said roller assembly in a plane comprising said X and said Y directions of said handler plate. 18. The apparatus of claim 17 wherein said main body of each of said roller assembly has a cross section that is a circle, a square or a rectangle. 19. The apparatus of claim 17, said roller bearings being evenly spaced around a circumference of said main body of said roller assembly, said radial extensions of said roller bearings from said main body of said roller bearing assembly having a direction, a cross section of said roller bearings in a plane perpendicular to said direction being a circle. 20. The apparatus of claim 17 wherein: said main body of each of said roller assembly has a geometric center line being a line created by interconnecting geometric centers of two different cross sections of said main body of each of said roller assemblies, whereby said cross sections of said main body of each of said roller assemblies are taken in a plane parallel to a plane comprising said X and said Y directions, said geometric centers of said cross sections being defined as a point of intersect of diagonals for square or rectangular cross sections and a center of a circle for a circular cross section; each of said roller bearings of said roller assembly have a geometric center line being a line created by interconnecting geometric centers of two different cross sections of said roller bearings of said roller assembly, whereby said cross sections of each of said roller bearings of each of said roller assembly are taken in a plane perpendicular to said radial direction under which each of said roller bearings extend from said main body of said roller assemblies, said geometric centers of said cross sections being defined as a center of a circle for a circular cross section; and said geometric center line of said main body of each of said roller assemblies intersecting with said geometric center lines of said roller bearings of said roller assembly, thereby forming a geometric center point of said roller bearing assembly. 21. The apparatus of claim 17 wherein a cross section of each of said roller assemblies taken in a plane parallel with a plane comprising said X and said Y directions of said handler plate and that further comprises said geometric center lines of each of said roller bearings has a roller assembly circumference, whereby said roller assembly circumference is about equal to said top surface receiver block assembly profile, whereby enough tolerance is provided between said roller assembly circumference and said top surface receiver block assembly profile such that said roller assembly can freely move inside said cavity provided in said receiver block in a Z-direction of said receiver block. 22. The apparatus of claim 13 wherein said pin like extrusion provided on a surface of each of said sliding block is provided opposite said surface in which said groove is provided in said sliding block, whereby said pin shaped extrusion serves as a mechanical link between said sliding block of said receiver block assembly and said pivot linkage assembly. 23. The apparatus of claim 22 wherein said pivot link assembly is mechanically coupled to said sliding block of said receiver block assembly and comprises: an insertion plate; a first cross link bar that connects to a first sliding block or interconnects first adjacent sliding blocks, whereby said first adjacent sliding blocks are mounted in an X-direction of said test head plate; a second c ross link bar that interconnects second adjacent sliding blocks, whereby said second adjacent sliding blocks are mounted in an Y-direction of said test head, whereby said second cross link bar rotationally connects to an extremity of said first cross link bar; and a third cross link bar that connects to a second sliding block or interconnects third adjacent sliding blocks in an X-direction of said test heat plate, whereby said third cross link bar rotationally connects to said second cross link bar. 24. The apparatus of claim 23 wherein said first and said third cross link bar have a cross section that is a rectangle or a square or a circle. 25. The apparatus of claim 23 wherein said second cross link bar have a cross section that is a rectangle whereby a longest side of said rectangle is parallel to a plane comprising said X and Y-direction of said test head plate. 26. The apparatus of claim 23, said insertion plate comprising: a slot that may or may not penetrate said insertion plate into which said pin like extrusion provided on a surface of said sliding block is entered; a point of rotation, whereby said insertion plate is rotationally connected to said test head plate; and a handle that allows rotation of said insertion plate, thereby transferring rotational movement of said insertion plate into sliding motion of said sliding block. 27. The apparatus of claim 23, said second cross link bar comprising an opening penetrating said second cross link bar, a pin being inserted through said opening, said pin being connected to said test head plate, allowing said second cross link bar to swivel around said pin. 28. A method for positioning a semiconductor device handler plate with respect to a semiconductor device test head plate for the purpose of docking and undocking said handler plate with said test head plate, comprising: providing a handler plate having a dimension of length in an X-direction in addition having a dimension of width in an Y direction whereby said Y directional intersects said X direction under a right angle further having a dimension of height in an Z direction whereby said Z direction intersects a plane comprising said X and said Y direction under a right angle; providing roller assemblies that are attached to said handler plate; providing an assemblage of first electrical contacts that is attached to said handler base plate for purposes of semiconductor device testing; providing a test head plate having a dimension of length in an X-direction in addition having a dimension of width in an Y direction, whereby said Y direction intersects said X direction under a right angle, further having a dimension of height in an Z direction, whereby said Z direction intersects a plane comprising said X and said Y direction under a right angle, whereby said test head X-direction and Y-direction and Z-direction coincide respectively with said handler plate X-direction and Y-direction and Z-direction; providing receiver block assemblies attached to said test heat plate, said receiver block assemblies having a top surface having a top surface receiver assembly profile, whereby said receiver block assemblies are attached to said test head plate, whereby said receiver block assemblies comprise a receiver block having a top surface having a receiver block top surface profile, further having a cavity, whereby a sliding block having a groove provided in a surface, further having a pin line extrusion provided on a surface, further having a top surface having a sliding block top surface profile, whereby said sliding block is attached to said receiver block, whereby said receiver block and said sliding block each having a dimension of length in an X-direction in addition to having a dimension of width in an Y direction, whereby said Y direction intersects said X direction under a right angle, further having a dimension of height in an Z direction, whereby said Z direction intersects a plane comprising said X and sa id Y direction under a right angle, whereby said receiver block and said sliding block X-direction and Y-direction and Z-direction coincide respectively with said handler plate X-direction and Y-direction and Z-direction; providing an assemblage of second electrical contacts attached to said test head plate for purposes of semiconductor device testing; visually positioning and aligning said roller assemblies with said receiver block assemblies; partially entering said roller assemblies into said cavity provided in said receiver blocks; and engaging a pivot linkage assembly, said pivot linkage assembly being attached to said test head plate, said pivot linkage assembly forming a mechanical linkage between said receiver block assemblies, thereby docking and locking said handler plate with respect to said test head plate while at the same time establishing electrical contact between said assemblage of first electrical contacts and said assemblage of second electrical contacts for purposes of semiconductor device testing. 29. The method of claim 28 wherein said dimension of height and said dimension of width and said dimension of height of said handler plate are not the same as said dimension of height and said dimension of width and said dimension of height of said of said test head plate. 30. The method of claim 28 wherein said dimension of height and said dimension of width and said dimension of height of said receiver block are smaller than said dimension of height and said dimension of width and said dimension of height of said test head plate by a measurable amount. 31. The method of claim 28 wherein said dimension of length of said sliding block is about the same or longer as said dimension of length of said receiver block while said dimension of width of said sliding block is smaller that said dimension of width of said receiver block by a measurable amount while said dimension of height of said sliding block is essentially the same as said dimension of height of said receiver block. 32. The method of claim 28 wherein a cross section of said handler plate in a plane parallel to a plane comprising said X and said Y directions of said handler plate is a rectangle or a square, whereby said square has a geometric center being a point of intersection of two diagonals of said rectangle or said square of said handler plate, whereby said assemblage of first electrical contact points is attached to said handler base plate for purposes of semiconductor device testing. 33. The method of claim 32 whereby said assemblage of first electrical contacts attached to said handler base plate has a cross section in a plane parallel to a plane comprising said X and said Y directions of said handler plate that is a rectangle or a square, said rectangle or square having a geometric center being a point of intersection of two diagonals of said rectangle or said square of said assemblage of first electrical contacts, said geometric center of said assemblage of first electrical contacts aligning with said geometric center of said handler plate, whereby furthermore said assemblage of first electrical contact points interfaces with said assemblage of second electrical contact points attached to said test head. 34. The method of claim 33 whereby said assemblage of second electrical contacts attached to said test head has a cross section in a plane parallel to a plane comprising said X and said Y directions of said test head plate that is a rectangle or a square, said rectangle or square having a geometric center being a point of intersection of two diagonals of said rectangle or said square, said geometric center of said assemblage of second electrical contacts aligning with said geometric center of said assemblage of first electrical contacts. 35. The method of claim 34 wherein a cross section of said test head plate in a plane parallel to a plane comprising said X and said Y directions of said test head plate is a rectangle or a square, said re