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Apparatus for removal of material in reactions having limited solubility and diffusion. An exemplary system removes unwanted material from the surface of a semiconductor wafer. A flow apparatus is provided for removal of material from a work piece having at least one reaction region containing remov

Apparatus for removal of material in reactions having limited solubility and diffusion. An exemplary system removes unwanted material from the surface of a semiconductor wafer. A flow apparatus is provided for removal of material from a work piece having at least one reaction region containing removable material. The apparatus may include first and second assemblies positionable in spaced-apart relation to form a zone extending between the two assemblies for movement of gaseous material. The first assembly may include a fixture positioned to receive the work piece with the reaction region of the work piece disposed in the zone to allow movement of the gaseous material thereover. A flow assembly is configured to transfer into the zone a gas comprising a condensable material and a reacting species. In another embodiment a system for removal of material from a workpiece includes a chamber, a flow component and a support apparatus. The flow component is configured to pass gaseous material into the chamber at a selectable rate and allow exit of liquid and gaseous materials from the chamber. The support apparatus is configured to position the workpiece thereon with the surface region of the work piece oriented for contact with gaseous material passed into the chamber by the flow component. The system may further include a thermal control configured to provide a differential temperature between a portion of a work piece and gaseous material passed into the chamber.

대표청구항 ▼

Apparatus for removal of material in reactions having limited solubility and diffusion. An exemplary system removes unwanted material from the surface of a semiconductor wafer. A flow apparatus is provided for removal of material from a work piece having at least one reaction region containing remov

Apparatus for removal of material in reactions having limited solubility and diffusion. An exemplary system removes unwanted material from the surface of a semiconductor wafer. A flow apparatus is provided for removal of material from a work piece having at least one reaction region containing removable material. The apparatus may include first and second assemblies positionable in spaced-apart relation to form a zone extending between the two assemblies for movement of gaseous material. The first assembly may include a fixture positioned to receive the work piece with the reaction region of the work piece disposed in the zone to allow movement of the gaseous material thereover. A flow assembly is configured to transfer into the zone a gas comprising a condensable material and a reacting species. In another embodiment a system for removal of material from a workpiece includes a chamber, a flow component and a support apparatus. The flow component is configured to pass gaseous material into the chamber at a selectable rate and allow exit of liquid and gaseous materials from the chamber. The support apparatus is configured to position the workpiece thereon with the surface region of the work piece oriented for contact with gaseous material passed into the chamber by the flow component. The system may further include a thermal control configured to provide a differential temperature between a portion of a work piece and gaseous material passed into the chamber.