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Thermosiphon for electronics cooling with high performance boiling and condensing surfaces 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/00
출원번호 US-0198321 (2002-07-18)
발명자 / 주소
  • Reyzin, Ilya
  • Bhatti, Mohinder Singh
  • Ghosh, Debashis
  • Joshi, Shrikant Mukund
출원인 / 주소
  • Delphi Technologies, Inc.
대리인 / 주소
    Griffin, Patrick M.
인용정보 피인용 횟수 : 53  인용 특허 : 8

초록 ▼

A thermosiphon for cooling an electronic device having a mean width of dimension "b" comprises a boilerplate having a top surface and including a plurality of pyramid shaped fins projecting upwardly from the top surface. The boilerplate also has a bottom surface for receiving the electronic device t

대표청구항 ▼

A thermosiphon for cooling an electronic device having a mean width of dimension "b" comprises a boilerplate having a top surface and including a plurality of pyramid shaped fins projecting upwardly from the top surface. The boilerplate also has a bottom surface for receiving the electronic device t

이 특허에 인용된 특허 (8)

  1. Hisano Katsumi (Kanagawa) Sasaki Tomiya (Kanagawa) Ishizuka Masaru (Kanagawa JPX), Cooling apparatus.
    상세보기
  2. Kobayashi Kazuo,JPX ; Kawaguchi Kiyoshi,JPX, Cooling apparatus boiling and condensing refrigerant.
    상세보기
  3. Terao Tadayoshi,JPX ; Kobayashi Kazuo,JPX ; Tanaka Hiroshi,JPX ; Kawaguchi Kiyoshi,JPX, Cooling apparatus for high-temperature medium by boiling and condensing refrigerant.
    상세보기
  4. Osakabe Hiroyuki,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Matsui Kazuma,JPX, Cooling apparatus using boiling and condensing refrigerant.
    상세보기
  5. Hiroshi Tanaka JP; Tadayoshi Terao JP; Eitaro Tanaka JP; Takahide Ohara JP; Kiyoshi Kawaguchi JP, Cooling device boiling and condensing refrigerant.
    상세보기
  6. Hiroshi Tanaka JP; Tadayoshi Terao JP; Kiyoshi Kawaguchi JP; Takahide Ohara JP; Akihiro Maeda JP, Cooling device boiling and condensing refrigerant.
    상세보기
  7. Mochizuki Masataka (Tokyo JPX) Ono Motoyuki (Tokyo JPX) Mashiko Koichi (Tokyo JPX) Saito Yuji (Tokyo JPX) Hasegawa Masashi (Tokyo JPX) Nagata Masakatsu (Tokyo JPX), Heat pipe and process for manufacturing the same.
    상세보기
  8. Kobayashi Gai (Amagasaki JA) Shikano Yoshiro (Amagasaki JA) Yano Masao (Amagasaki JA), Vapor cooling device for semiconductor device.
    상세보기

이 특허를 인용한 특허 (53)

  1. Rockenfeller,Uwe, Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection.
    상세보기
  2. Brewer,Richard Grant; Upadhya,Girish; Zhou,Peng; McMaster,Mark; Tsao,Paul, Apparatus and method of efficient fluid delivery for cooling a heat producing device.
    상세보기
  3. Kenny,Thomas; McMaster,Mark; Lovette,James, Apparatus and method of forming channels in a heat-exchanging device.
    상세보기
  4. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Apparatus for conditioning power and managing thermal energy in an electronic device.
    상세보기
  5. Upadhya,Girish; Herms,Richard; Zhou,Peng; Goodson,Kenneth, Channeled flat plate fin heat exchange system, device and method.
    상세보기
  6. Ghosh, Debashis; Bhatti, Mohinder Singh; Reyzin, Ilya, Compact thermosiphon for dissipating heat generated by electronic components.
    상세보기
  7. Reyzin, Ilya; Bhatti, Mohinder Singh; Ghosh, Debashis, Cooling assembly.
    상세보기
  8. Sugito,Hajime; Tanaka,Hiroshi, Cooling device boiling and condensing refrigerant.
    상세보기
  9. Liu,Tay Jian, Cooling device incorporating boiling chamber.
    상세보기
  10. Shook,James Gill; Lovette,James, Decoupled spring-loaded mounting apparatus and method of manufacturing thereof.
    상세보기
  11. Correa, Adrian; Lin, Tien Chih (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
    상세보기
  12. Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
    상세보기
  13. Munch, Mark; Werner, Douglas E., Gimballed attachment for multiple heat exchangers.
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  14. Hao, Mingliang; Zhao, Jun, Heat dissipation device.
    상세보기
  15. Bhatti,Mohinder Singh; Reyzin,Ilya; Ghosh,Debashis; Joshi,Shrikant Mukund, Heat dissipation element for cooling electronic devices.
    상세보기
  16. Malone,Christopher G.; Simon,Glenn C., Heat exchanger including flow straightening fins.
    상세보기
  17. Gilliland,Don A., Heat sinks for dissipating a thermal load.
    상세보기
  18. Gilliland,Don A., Heat sinks for dissipating a thermal load.
    상세보기
  19. Mochizuki, Masataka; Takenaka, Eiji; Nguyen, Thang; Kaviany, Massoud, Heat transfer device.
    상세보기
  20. Mochizuki,Masataka; Takenaka,Eiji; Nguyen,Thang; Kaviany,Massoud, Heat transfer device.
    상세보기
  21. Werner,Douglas; Munch,Mark; Kenny,Thomas, Hermetic closed loop fluid system.
    상세보기
  22. Bhatti, Mohinder Singh; Reyzin, Ilya; Rusch, David P; Joshi, Shrikant Mukund, High performance compact thermosiphon with integrated boiler plate.
    상세보기
  23. Hegde, Shankar, High performance cooling device with vapor chamber.
    상세보기
  24. Yang, Chih-Hao; Hu, Che-Cheng, Integrated cooling system with multiple condensing passages for cooling electronic components.
    상세보기
  25. Hom, James; Upadhya, Girish; Werner, Douglas E.; Munch, Mark; Tsao, Paul; Conway, Bruce; Zhou, Peng; Brewer, Richard, Integrated liquid to air conduction module.
    상세보기
  26. Hom, James; Choi, Hae-won; Lin, Tien Chih (Eric); Werner, Douglas E.; Chow, Norman; Correa, Adrian; Leong, Brandon; Gopalakrishnan, Sudhakar; Brewer, Richard Grant; McMaster, Mark; Upadhya, Girish, Internal access mechanism for a server rack.
    상세보기
  27. Bhatti,Mohinder Singh; Ghosh,Debashis; Reyzin,Ilya, Liquid cooled thermosiphon for electronic components.
    상세보기
  28. Bhatti, Mohinder Singh; Reyzin, Ilya; Joshi, Shrikant Mukund, Liquid cooled thermosiphon with condenser coil running in and out of liquid refrigerant.
    상세보기
  29. Reyzin,Ilya; Bhatti,Mohinder Singh; Joshi,Shrikant Mukund, Low profile thermosiphon.
    상세보기
  30. Goodson,Kenneth; Kenny,Thomas; Zhou,Peng; Upadhya,Girish; Munch,Mark; McMaster,Mark; Horn,James, Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device.
    상세보기
  31. Upadhya,Girish; Brewer,Richard Grant; McMaster,Mark, Method and apparatus for controlling freezing nucleation and propagation.
    상세보기
  32. Kenny,Thomas W.; Munch,Mark; Zhou,Peng; Shook,James Gill; Upadhya,Girish; Goodson,Kenneth; Corbin,Dave; McMaster,Mark; Lovette,James, Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device.
    상세보기
  33. Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
    상세보기
  34. Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
    상세보기
  35. Corbin, David; Goodson, Kenneth; Kenny, Thomas; Santiago, Juan; Zeng, Shulin, Micro-fabricated electrokinetic pump.
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  36. Corbin,David; Goodson,Kenneth; Kenny,Thomas; Santiago,Juan; Zeng,Shulin, Micro-fabricated electrokinetic pump.
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  37. Kenny,Thomas W.; Shook,James Gill; Zeng,Shulin; Lenehan,Daniel J.; Santiago,Juan; Lovette,James, Micro-fabricated electrokinetic pump with on-frit electrode.
    상세보기
  38. Lovette,James; Zhou,Peng; Shook,James Gill, Multi-level microchannel heat exchangers.
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  39. Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
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  40. Zhou,Peng; van Der Heide,Dolf; Goodson,Kenneth; Upadhya,Girish, Optimized multiple heat pipe blocks for electronics cooling.
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  41. Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Power conditioning module.
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  42. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
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  43. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
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  44. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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  45. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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  46. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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  47. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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  48. Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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  49. Khalili, Kaveh; Rockenfeller, Uwe, Spot cooler for heat generating electronic components.
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  50. Sone, Kazuya, Thermosiphon.
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  51. Sone,Kazuya, Thermosiphon.
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  52. Ghosh, Debashis; Joshi, Shrikant Mukund; Reyzin, Ilya; Bhatti, Mohinder Singh, Thermosiphon for electronics cooling with nonuniform airflow.
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  53. Zhou,Peng; Goodson,Kenneth; Suntiago,Juan, Vapor escape microchannel heat exchanger.
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