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Sputtering target, method of making same, and high-melting metal powder material 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B22F-003/12
출원번호 US-0612561 (2000-07-07)
우선권정보 JP-0192994 (1999-07-07)
발명자 / 주소
  • Han, Gang
  • Murata, Hideo
  • Nakamura, Hideki
출원인 / 주소
  • Hitachi Metals Ltd.
대리인 / 주소
    Sughrue Mion, PLLC
인용정보 피인용 횟수 : 37  인용 특허 : 16

초록

There is provided a method of making a high-melting metal powder which has high purity and excellent formability and, particularly, of a metal powder of spherical particles made of Ta, Ru, etc. having a higher melting point than iron. There is also provided a target of high-melting metal or its allo

대표청구항

1. A sputtering target obtained by performing pressure sintering of a powder obtained by introducing a powder material mainly composed of a refractory metal into a thermal plasma into which a hydrogen gas has been introduced, said powder material being mainly composed of Ta or Ru and the shape of pa

이 특허에 인용된 특허 (16)

  1. Matsuzawa Yasuo (Bedford NH) Wallsten Hans I. (Denens MO CHX) Yasuda Hirotsugu K. (Columbia MO), Apparatus and process for the treatment of powder particles for modifying the surface properties of the individual parti.
  2. Kopatz Nelson E. (Sayre PA) Johnson Walter A. (Towanda PA), Hydrometallurgical process for producing finely divided copper and copper alloy powders.
  3. Johnson Walter A. (Towanda PA) Kopatz Nelson E. (Sayre PA) Ritsko Joseph E. (Towanda PA), Hydrometallurgical process for producing spherical maraging steel powders with readily oxidizable alloying elements.
  4. Nishimura Eiji (Saitama JPX) Kuroki Masami (Saitama JPX) Kikutake Naoyuki (Tokyo JPX) Shindou Yuuichiro (Saitama JPX), Method and apparatus for producing a high-purity titanium.
  5. Volotinen Heikki J. (Lahti FIX) Talja Jyri J. (Espoo FIX) Taskinen Pekka A. (Espoo FIX), Method for producing metal powders.
  6. Frind Gerhard (Altamont NY) Savkar Sudhir D. (Schenectady NY), Method for reducing plasma constriction by intermediate injection of hydrogen in RF plasma gun.
  7. Lo Chi-Fung ; Gilman Paul S. ; Draper Darryl, Method of making high-density, high-purity tungsten sputter targets.
  8. Inoue Kiyoshi (16-8 3-CHOME Kamiyoga ; Setagaya ; Tokyo JA), Powder activation in an inert atmosphere.
  9. Paliwal Muktesh (Sayre PA) Holland ; Sr. Robert J. (Sayre PA), Process for producing fine powders by hot substrate microatomization.
  10. Kopatz Nelson E. (Sayre PA) Pruyne Lori S. (Sayre PA), Process for producing fine spherical particles having a low oxygen content.
  11. Kopatz Nelson E. (Sayre PA) Ritsko Joseph E. (Towanda PA) Johnson Walter A. (Towanda PA), Process for producing finely divided spherical metal powders containing an iron group metal and a readily oxidizable met.
  12. Cheney Richard F. (Towanda PA) Moscatello Charles L. (Sayre PA) Mower Frederick J. (Towanda PA), Process for producing free flowing powder and product.
  13. Shindo Yuichiro,JPX ; Suzuki Tsuneo,JPX, Process for producing high-purity ruthenium.
  14. Johnson Walter A. (Towanda PA) Kemp ; Jr. Preston B. (Athens PA) Kopatz Nelson E. (Sayre PA), Process for producing tungsten heavy alloy sheet using high temperature processing techniques.
  15. Dunn Paul S. ; Korzekwa Deniece R., Purification of tantalum by plasma arc melting.
  16. Hiraki Akitoshi (Yasugi JPX), Titanium-tungsten target material for sputtering and manufacturing method therefor.

이 특허를 인용한 특허 (37)

  1. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  2. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  3. Miller, Steven A.; Gaydos, Mark; Shekhter, Leonid N.; Gulsoy, Gokce, Dynamic dehydriding of refractory metal powders.
  4. Zhang, Wenjun, Fabrication of B/C/N/O/Si doped sputtering targets.
  5. Zhang,Wenjun, Fabrication of B/C/N/O/Si doped sputtering targets.
  6. Miller, Steven A.; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Fine grained, non banded, refractory metal sputtering targets with a uniformly random crystallographic orientation, method for making such film, and thin film based devices and products made therefrom.
  7. Hogan, Patrick; Aimone, Paul; Flanigan, Joseph; Hagymasi, Marcel; Haas, Helmut, High purity refractory metal powders and their use in sputtering targets which may have random texture.
  8. Kanou, Gaku; Shindo, Yuichiro, High-purity Ru alloy target, process for producing the same, and sputtered film.
  9. Shindo, Yuichiro; Hisano, Akira, High-purity Ru powder, sputtering target obtained by sintering the same, thin film obtained by sputtering the target and process for producing high-purity Ru powder.
  10. Dary, Francois-Charles; Gaydos, Mark; Loewenthal, William; Miller, Steven A.; Rozak, Gary; Volchko, Scott Jeffrey; Zimmermann, Stefan; Stawovy, Michael Thomas, Large-area sputtering targets.
  11. Miller, Steven A.; Kumar, Prabhat, Low-energy method of manufacturing bulk metallic structures with submicron grain sizes.
  12. Crawley, John; Cherednichenko, Vladimir Semenovitch; Fife, James Allen, Method and an apparatus of plasma processing of tantalum particles.
  13. Zimmermann, Stefan; Papp, Uwe; Kreye, Heinrich; Schmidt, Tobias, Method for coating a substrate surface and coated product.
  14. Nanis, Leonard, Method for fabricating sputter targets.
  15. Nanis,Leonard, Method for fabricating sputter targets.
  16. Miller, Steven A.; Schmidt-Park, Olaf; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmermann, Stefan, Methods of forming sputtering targets.
  17. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Methods of joining metallic protective layers.
  18. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  19. Miller, Steven A.; Shekhter, Leonid N.; Zimmermann, Stefan, Methods of joining metallic protective layers.
  20. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Methods of joining protective metal-clad structures.
  21. Volchko, Scott Jeffrey; Zimmermann, Stefan; Miller, Steven A.; Stawovy, Michael Thomas, Methods of manufacturing high-strength large-area sputtering targets.
  22. Loewenthal, William; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets.
  23. Miller, Steven A.; Dary, Francois-Charles; Gaydos, Mark; Rozak, Gary, Methods of manufacturing large-area sputtering targets by cold spray.
  24. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  25. Volchko, Scott Jeffrey; Loewenthal, William; Zimmermann, Stefan; Gaydos, Mark; Miller, Steven Alfred, Methods of manufacturing large-area sputtering targets using interlocking joints.
  26. Miller, Steven A.; Kumar, Prabhat; Wu, Rong-chein Richard; Sun, Shuwei; Zimmermann, Stefan; Schmidt-Park, Olaf, Methods of rejuvenating sputtering targets.
  27. Miller, Steven A.; Schmidt-Park, Olaf; Kumar, Prabhat; Wu, Richard; Sun, Shuwei; Zimmerman, Stefan, Methods of rejuvenating sputtering targets.
  28. Michaluk, Christopher A.; Yuan, Shi; Maguire, James, Powder metallurgy sputtering targets and methods of producing same.
  29. Michaluk, Christopher A.; Yuan, Shi; Maguire, Jr., James D., Powder metallurgy sputtering targets and methods of producing same.
  30. Michaluk,Christopher A.; Yuan,Shi; Maguire,James, Powder metallurgy sputtering targets and methods of producing same.
  31. Shekhter, Leonid N.; Miller, Steven A.; Haywiser, Leah F.; Wu, Rong-Chein Richard, Process for preparing metal powders having low oxygen content, powders so-produced and uses thereof.
  32. Takashima, Hiroshi; Han, Gang; Uesaka, Shujiroh; Ueno, Tomonori, Process for producing low-oxygen metal powder.
  33. Miller, Steven A.; Shekhter, Leonid N.; Zimmerman, Stefan, Protective metal-clad structures.
  34. Oda, Kunihiro, Ruthenium-alloy sputtering target.
  35. Suzuki, Ryo, Sintered sputtering target made of refractory metals.
  36. Zhang,Wenjun, Sputter target and method for fabricating sputter target including a plurality of materials.
  37. Nagatsu, Kotaro; Senda, Shinichiro, Tantalum sputtering target, method for manufacturing same, and barrier film for semiconductor wiring formed by using target.
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