초록 ▼

A MEMs microactuator can be positioned in an interior region of a frame having at least one opening therein, wherein the frame expands in response to a change in temperature of the frame. A load outside the frame can be coupled to the microactuator through the at least one opening. The microactuator

A MEMs microactuator can be positioned in an interior region of a frame having at least one opening therein, wherein the frame expands in response to a change in temperature of the frame. A load outside the frame can be coupled to the microactuator through the at least one opening. The microactuator moves relative to the frame in response to the change in temperature to remain substantially stationary relative to the substrate. Other MEMs structures, such as latches that can engage and hold the load in position, can be located outside the frame. Accordingly, in comparison to some conventional structures, temperature compensated microactuators according to the present invention can be made more compact by having the interior region of the frame free of other MEMs structures such as latches.

대표청구항 ▼

A MEMs microactuator can be positioned in an interior region of a frame having at least one opening therein, wherein the frame expands in response to a change in temperature of the frame. A load outside the frame can be coupled to the microactuator through the at least one opening. The microactuator

A MEMs microactuator can be positioned in an interior region of a frame having at least one opening therein, wherein the frame expands in response to a change in temperature of the frame. A load outside the frame can be coupled to the microactuator through the at least one opening. The microactuator moves relative to the frame in response to the change in temperature to remain substantially stationary relative to the substrate. Other MEMs structures, such as latches that can engage and hold the load in position, can be located outside the frame. Accordingly, in comparison to some conventional structures, temperature compensated microactuators according to the present invention can be made more compact by having the interior region of the frame free of other MEMs structures such as latches. first and second openings respectively. 8. A MEMs device according to claim 4 wherein the first anchor is coupled to the first portion adjacent to the first opening and the second anchor is coupled to the second portion adjacent to the first opening, the MEMs device further comprising: a third anchor on the substrate coupled to the first portion; and a fourth anchor on the substrate coupled to the second portion. 9. A MEMs device according to claim 8: wherein the first anchor is coupled to the first portion of the frame at a first position thereof; wherein the second anchor is coupled to the second portion of the frame at a first position thereof relative to the first opening; wherein the third anchor is coupled to the first portion of the frame at a second position thereof to define a first temperature compensation portion of the frame between the first and second positions of the first portion to which the microactuator is coupled; wherein the fourth anchor is coupled to the second portion of the frame at a second position thereof to define a second temperature compensation portion between the first and second positions of the second portion to which the microactuator is coupled; and wherein the first and second temperature compensation portions of the frame move in opposite directions in response to the change in temperature. 10. A MEMs device according to claim 1 further comprising: a latch on the substrate outside the interior region of the frame that is coupled to the microactuator by a member that extends through the at least one opening. 11. A MEMs device according to claim 10 wherein the latch holds the member in position when engaged therewith. 12. A MEMs device according to claim 10 wherein the latch comprises first and second latch portions that engage the member from opposite sides of the member. 13. A MEMs device according to claim 1: wherein the microactuator is coupled to a load that is outside the interior region of the frame. 14. A MEMs device according to claim 1 wherein the frame extends in at least two directions to define the interior portion. 15. A method of operating a MEMs device comprising: thermally actuating a temperature compensated latch within a first frame to a disengaged position that allows a load to move; thermally actuating a temperature compensated microactuator within a second frame to move the load from a first position to a second position; and thermally actuating the temperature compensated latch to an engaged position to hold the load in the second position. 16. A method according to claim 15 wherein the thermally actuating the temperature compensated latch to an engaged position comprises reducing heat applied to the temperature compensated latch. 17. A method according to claim 15 further comprising: reducing heat applied to the temperature compensated microactuator; and reducing heat applied to the temperature compensated latch.