초록 ▼

A novel adhesive formed in situ in a microcapsule and method for forming such a pressure sensitive or flowable adhesive in situ in a microcapsule is disclosed. The method for forming the novel adhesive comprises providing an aqueous mixture of wall material in water; adding a substantially water ins

A novel adhesive formed in situ in a microcapsule and method for forming such a pressure sensitive or flowable adhesive in situ in a microcapsule is disclosed. The method for forming the novel adhesive comprises providing an aqueous mixture of wall material in water; adding a substantially water insoluble core material, free radical initiator, and a solvent for the pre-polymers to the aqueous mixture. The core material comprises a first addition polymerizable pre-polymer having a Tg of less than about 0° C., a flash point of at least 75° C., and a boiling point of at least 175° C. These are typically selected from acrylate or methacrylate type materials. Optionally included is a second addition polymerizable pre-polymer for providing cross-linking or interaction between polymer chains. High shear agitation is provided to the aqueous mixture to achieve a particle size of about 0.1 to 250 microns. Stirring at a first temperature effects capsule wall formation; and heating to a second temperature polymerizes the pre-polymers of the core material to form an adhesive in situ in the formed capsules.

대표청구항 ▼

A novel adhesive formed in situ in a microcapsule and method for forming such a pressure sensitive or flowable adhesive in situ in a microcapsule is disclosed. The method for forming the novel adhesive comprises providing an aqueous mixture of wall material in water; adding a substantially water ins

A novel adhesive formed in situ in a microcapsule and method for forming such a pressure sensitive or flowable adhesive in situ in a microcapsule is disclosed. The method for forming the novel adhesive comprises providing an aqueous mixture of wall material in water; adding a substantially water insoluble core material, free radical initiator, and a solvent for the pre-polymers to the aqueous mixture. The core material comprises a first addition polymerizable pre-polymer having a Tg of less than about 0° C., a flash point of at least 75° C., and a boiling point of at least 175° C. These are typically selected from acrylate or methacrylate type materials. Optionally included is a second addition polymerizable pre-polymer for providing cross-linking or interaction between polymer chains. High shear agitation is provided to the aqueous mixture to achieve a particle size of about 0.1 to 250 microns. Stirring at a first temperature effects capsule wall formation; and heating to a second temperature polymerizes the pre-polymers of the core material to form an adhesive in situ in the formed capsules. cal material; directing the vaporized chemical material to the elongated tube; and heating the vaporized chemical material along the smaller second dimension of the passageway in the elongated tube to a higher second temperature sufficient to dissociate molecular clusters of vaporized chemical material. 2. The method of claim 1, further comprising directing the dissociated chemical material from the exit opening of the elongated tube to a vacuum chamber for deposition on a substrate. 3. The method of claim 2, wherein the substrate comprises a semiconductor material. 4. The method of claim 1, wherein the chemical material comprises a solid or liquid material. 5. The method of claim 1, wherein the chemical material is selected from the group consisting of phosphorus, arsenic, antimony, and combinations thereof. 6. The method of claim 1, further comprising monitoring the temperature in the heating chamber, and adjusting the temperature in the heating chamber for optimal vaporizing conditions. 7. The method of claim 1, wherein the elongated tube comprises a quartz tube. 8. The method of claim 1, wherein the heat source is a light bulb or a quartz lamp mounted within the heating chamber. 9. The method of claim 1, wherein the vaporization cell includes a valve section with an in-line valve for selectively sealing the heating chamber from the passageway in the tube. 10. The method of claim 1, wherein the chemical material is held by a container in the heating chamber. 11. The method of claim 1, further comprising monitoring the temperature in the heating chamber by a thermocouple device disposed in the vaporization cell. 12. The method of claim 1, wherein the heating element of the cracker cell comprises a heating coil disposed around an outside surface of the tube. 13. A method for vaporizing and cracking a chemical material, comprising: providing a vaporization and cracker cell apparatus comprising: a vaporization cell including an inlet section in communication with a valve section defining a heating chamber; a quartz container disposed in the heating chamber for holding a chemical material; a heat source positioned in the heating chamber adjacent to the container; a thermal cracker cell communicatively and removably connected to an outlet of the vaporization cell, the cracker cell including an elongated quartz tube having a passageway with a diameter of a larger first dimension that narrows to a smaller second dimension by way of a tapering section in the tube, the tapering section located distally apart from an inlet of the tube, the smaller second dimension of the tube being substantially maintained from the tapering section to an exit opening of the tube; an in-line valve disposed in the valve section for selectively sealing the heating chamber from the passageway in the tube; and a heating coil disposed around an outside surface of the tube toward the exit opening; placing a preselected amount of a chemical material into the heating chamber; heating the chemical material in the heating chamber to a first temperature sufficient to vaporize the chemical material; directing the vaporized chemical material to the elongated tube; and heating the vaporized chemical material along the smaller second dimension of the passageway in the elongated tube to a higher second temperature sufficient to dissociate molecular clusters of vaporized chemical material. 14. The method of claim 13, wherein the chemical material is selected from the group consisting of phosphorus, arsenic, antimony, and combinations thereof. 15. The method of claim 13, further comprising monitoring the temperature in the heating chamber by a thermocouple device disposed in the vaporization cell. 16. The method of claim 15, wherein the thermocouple device is operatively connected to a control device for monitoring and adjusting the temperature in the heating chamber. 17. The method of claim 16, wherein the heat source is operatively connected to a power source in operative communication with the control device. 18. The method of claim 17, wherein the heating coil is electrically connected to the power source. 19. The method of claim 13, wherein the exit opening of the tube is in sealing communication with a vacuum chamber. re dilution; c) obtaining a standard solution of the suppressor component of the organic addition agents having conventional concentrations of cupric ion, sulfuric acid and hydrochloric acid and having a known concentration of the suppressor at 1/X of its target value in the plating bath; obtaining a first stock solution having the same cupric sulfate, sulfuric acid, and hydrochloric acid concentrations as the diluted sample; obtaining a second stock solution having the same cupric sulfate, sulfuric acid, and hydrochloric acid concentrations as the diluted sample and also having a known amount of an electrochemically suppressing chemical; performing a dilution titration cyclic voltammetry stripping (CVS) technique for determining the concentration of said suppressor component of the additive in the plating bath using said first stock solution and standardizing the analysis with said standard solution of the suppressor; performing a standard-addition CVS technique for determining the concentration of said accelerator component of the additive in the plating bath, using said second stock solution and standard additions of the accelerator. 2. The method of claim 1 wherein said copper plating bath comprises at least about 0.4 molar concentration of said cupric salt; and said diluting reduces the cupric ion concentration to its conventional range. 3. The method of claim 2 wherein the concentration of the cupric salt is at least about 0.8 molar. 4. The method of claim 2 wherein the concentration of sulfuric acid is an amount up to about 0.5 molar; and said diluting increases said sulfuric acid to its conventional range. 5. The method of claim 2 wherein the concentration of the sulfuric acid is about 0.1 to about 0.25 molar. 6. The method of claim 1 wherein the cupric salt comprises CuSO4. 7. The method of claim 1 wherein the concentration of sulfuric acid is an amount up to about 0.5 molar; and said diluting increases said sulfuric acid to its conventional range. 8. The method of claim 7 wherein the concentration of the sulfuric acid is about 0.1 to about 0.25 molar. 9. The method of claim 1 wherein said bath has an acidic pH. 10. The method of claim 1 wherein the bath has a pH of about 5 or lower. 11. The method of claim 1 wherein X is at least about 1.5. 12. The method of claim 1 wherein X is about 1.5 to about 5. 13. The method of claim 1 wherein X is about 4. 14. The method of claim 1 wherein said first stock solution further comprises the accelerator component of the additive at 1/X its target concentration value, where X is the dilution factor. 15. The method of claim 1 which further comprises adjusting concentrations of said organic addition agents to desired concentrations based upon the concentrations determined by said addition CVS techniques and said dilution-titration CVS technique. 16. A method of monitoring organic addition agents according to claim 1 wherein said first stock solution also contains the accelerator at a concentration of 1/X of its target value in the plating bath. 4356074, 19821000, Johnson; US-4365637, 19821200, Johnson; US-4366033, 19821200, Richter et al.; US-4375399, 19830300, Havas et al.; US-4384586, 19830500, Christiansen; US-4392933, 19830700, Nakamura et al.; US-4401122, 19830800, Clark, Jr.; US-4404066, 19830900, Johnson; US-4407959, 19831000, Tsuji et al.; US-4418148, 19831100, Oberhardt; US-4420564, 19831200, Tsuji et al.; US-4427770, 19840100, Chen et al.; US-4431004, 19840200, Bessman et al.; US-4436094, 19840300, Cerami; US-4440175, 19840400, Wilkins; US-4444892, 19840400, Malmros; US-4450842, 19840500, Zick et al.; US-4461691, 19840700, Frank; US-4469110, 19840900, Slama; US-4477314, 19841000, Richter et al.; US-4483924, 19841100, Tsuji et al.; US-4484987, 19841100, Gough; US-4522690, 19850600, Venkatasetty; US-4524114, 19850600, Samuels et al.; US-4526661, 19850700, Steckhan et al.; US-4534356, 19850800, Papadakis; US-4538616, 19850900, Rogoff; US-4543955, 19851000, Schroeppel; US-4545382, 19851000, Higgins et al.; US-4552840, 19851100, Riffer; US-4560534, 19851200, Kung et al.; US-4571292, 19860200, Liu et al.; US-4573994, 19860300, Fischell et al.; US-4581336, 19860400, Malloy et al.; US-4595011, 19860600, Phillips; US-4619754, 19861000, Niki et al.; US-4633878, 19870100, Bombardieri; US-4637403, 19870100, Garcia et al.; US-4650547, 19870300, Gough; US-4654197, 19870300, Lilja et al.; US-4655880, 19870400, Liu; US-4655885, 19870400, Hill et al.; US-4671288, 19870600, Gough; US-4679562, 19870700, Luksha; US-4680268, 19870700, Clark, Jr.; US-4682602, 19870700, Prohaska; US-4684537, 19870800, Graetzel et al.; US-4685463, 19870800, Williams; US-4703756, 19871100, Gough et al.; US-4711245, 19871200, Higgins et al.; US-4717673, 19880100, Wrighton et al.; US-4721601, 19880100, Wrighton et al.; US-4726378, 19880200, Kaplan; US-4750496, 19880600, Reinhart et al.; US-4757022, 19880700, Shults et al.; US-4758323, 19880700, Davis et al.; US-4759371, 19880700, Franetski; US-4759828, 19880700, Young et al.; US-4764416, 19880800, Ueyama et al.; US-4776944, 19881000, Janata et al.; US-4781798, 19881100, Gough; US-4784736, 19881100, Lonsdale et al.; US-4795707, 19890100, Niiyama et al.; US-4805624, 19890200, Yao et al.; US-4813424, 19890300, Wilkins; US-4815469, 19890300, Cohen et al.; US-4820399, 19890400, Senda et al.; US-4822337, 19890400, Newhouse et al.; US-4830959, 19890500, McNeil et al.; US-4832797, 19890500, Vadgama et al.; US-4840893, 19890600, Hill et al.; US-4848351, 19890700, Finch; US-4871351, 19891000, Feingold; US-4871440, 19891000, Nagata et al.; US-4890620, 19900100, Gough; US-4894137, 19900100, Takizawa et al.; US-4897162, 19900100, Lewandowski et al.; US-4897173, 19900100, Nankai et al.; US-4909908, 19900300, Ross et al.; US-4911794, 19900300, Parce et al.; US-4919141, 19900400, Zier et al.; US-4919767, 19900400, Vadgama et al.; US-4923586, 19900500, Katayama et al.; US-4927516, 19900500, Yamaguchi et al.; US-4935105, 19900600, Churchouse; US-4935345, 19900600, Guilbeau et al.; US-4936956, 19900600, Wrighton; US-4938860, 19900700, Wogoman; US-4942127, 19900700, Wada et al.; US-4945045, 19900700, Forrest et al.; US-4950378, 19900800, Nagata; US-4953552, 19900900, DeMarzo; US-4968400, 19901100, Shimomura et al.; US-4970145, 19901100, Bennetto et al.; US-4974929, 19901200, Curry; US-4986271, 19910100, Wilkins; US-4994167, 19910200, Shults et al.; US-5034192, 19910700, Wrighton et al.; US-5037527, 19910800, Hayashi et al.; US-5059290, 19911000, Uchiyama et al., 205/778; US-5070535, 19911200, Hochmair et al.; US-5078854, 19920100, Burgess et al.; US-5082550, 19920100, Rishpon et al.; US-5082786, 19920100, Nakamoto; US-5089112, 19920200, Skotheim et al.; US-5094951, 19920300, Rosenberg; US-5096560, 19920300, Takai et al.; US-5096836, 19920300, Macho et al.; US-5101814, 19920400, Palti; US-5108564, 19920400, Szuminsky et al.; US-5109850, 19920500, Blanco et al.; US-5120420, 19920600, Nankai et al.; US-5120421, 19920600, Glass et al.; US-5126034, 19920600, Carter et al.; U