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Method for making electro-optical devices using a hydrogenion splitting technique 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/30
  • H01L-021/46
출원번호 US-0985958 (2001-10-29)
발명자 / 주소
  • Kub, Francis J.
  • Hobart, Karl D.
출원인 / 주소
  • The United States of America as represented by the Secretary of the Navy
대리인 / 주소
    Karasek, John J.Kap, George A.
인용정보 피인용 횟수 : 28  인용 특허 : 28

초록 ▼

A method is provided for transferring an electro-optical layer grown on a growth substrate to a handle substrate. The method includes implanting hydrogen ions in the transfer substrate to form an intermediate hydrogen ion implant layer and bonding the transfer substrate to the handle substrate to fo

대표청구항 ▼

A method is provided for transferring an electro-optical layer grown on a growth substrate to a handle substrate. The method includes implanting hydrogen ions in the transfer substrate to form an intermediate hydrogen ion implant layer and bonding the transfer substrate to the handle substrate to fo

이 특허에 인용된 특허 (28)

  1. Sengupta Louise (Woburn MA) Ngo Eric (Brighton MA) Stowell Steven (Jamaica Plain MA) O\Day Michelina (Andover MA) Lancto Robert (Wakefield MA), Ceramic ferroelectric composite material - BSTO-ZrO2 .
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  2. Henley Francois J. ; Cheung Nathan, Controlled cleavage process using pressurized fluid.
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  3. Hays Ken Maxwell, Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas.
    상세보기
  4. Kub Francis J. ; Hobart Karl D., Fabrication ultra-thin bonded semiconductor layers.
    상세보기
  5. Yano Yoshihiko,JPX ; Noguchi Takao,JPX, Film structure, electronic device, recording medium, and process of preparing ferroelectric thin films.
    상세보기
  6. Yuen Wupen ; Li Gabriel S. ; Chang-Hasnian Constance J., Lattice-relaxed verticle optical cavities.
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  7. Lakin Kenneth M. (Redmond OR), Method and apparatus for fabricating a piezoelectric resonator to a resonant frequency.
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  8. Kub Francis J. ; Hobart Karl D., Method for fabricating singe crystal materials over CMOS devices.
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  9. Aspar Bernard,FRX ; Bruel Michel,FRX, Method for making a thin film of solid material.
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  10. Matsui Masaki,JPX ; Yamauchi Shoichi,JPX ; Ohshima Hisayoshi,JPX ; Onoda Kunihiro,JPX ; Asai Akiyoshi,JPX ; Sasaya Takanari,JPX ; Enya Takeshi,JPX ; Sakakibara Jun,JPX, Method for manufacturing a semiconductor substrate.
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  11. Nakahata Hideaki (Hyogo JPX) Shikata Shinichi (Hyogo JPX) Hachigo Akihiro (Hyogo JPX) Fujimori Naoji (Hyogo JPX), Method for manufacturing a surface acoustic wave device.
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  12. Goesele Ulrich M. ; Tong Q.-Y., Method for the transfer of thin layers of monocrystalline material to a desirable substrate.
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  13. Doyle Brian S., Method of delaminating a pre-fabricated transistor layer from a substrate for placement on another wafer.
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  14. Aspar Bernard,FRX ; Biasse Beatrice,FRX ; Bruel Michel,FRX, Method of obtaining a thin film of semiconductor material.
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  15. Aspar Bernard,FRX ; Bruel Michel,FRX ; Poumeyrol Thierry,FRX, Method of producing a thin layer of semiconductor material.
    상세보기
  16. Nathan W. Cheung ; Xiang Lu ; Chenming Hu, Method of separation films from bulk substrates by plasma immersion ion implantation.
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  17. Sullivan Gerard J. (Thousand Oaks CA) Szwed Mary K. (Huntington Beach CA) Chang Mau-Chung F. (Thousand Oaks CA), Method of transferring a thin film to an alternate substrate.
    상세보기
  18. Lea Di Cioccio FR, Process for fabricating a structure of semiconductor-on-insulator type in particular SiCOI.
    상세보기
  19. Sakaguchi Kiyofumi,JPX ; Yonehara Takao,JPX, Process for producing semiconductor article.
    상세보기
  20. Bruel Michel,FRX, Process for the manufacture of thin films of semiconductor material.
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  21. Bruel Michel (Veurey FRX), Process for the production of thin semiconductor material films.
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  22. Biasse Beatrice,FRX ; Bruel Michel,FRX ; Zussy Marc,FRX, Process for transferring a thin film from an initial substrate onto a final substrate.
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  23. Henley Francois J. ; Cheung Nathan W., Reusable substrate for thin film separation.
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  24. Kub Francis J. ; Hobart Karl D., Single-crystal material on non-single-crystalline substrate.
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  25. Srikrishnan Kris V., Smart-cut process for the production of thin semiconductor material films.
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  26. Simon Randy Wayne ; Platt Christine Elizabeth ; Lee Alfred Euinam ; Lee Gregory Steven, Superconductor Josephson junction.
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  27. Eda Kazuo (Nara JPX) Taguchi Yutaka (Settsu JPX) Onishi Keiji (Settsu JPX) Seki Shun-ichi (Osaka JPX), Surface acoustic wave device having a lamination structure.
    상세보기
  28. Eda Kazuo (Nara JPX) Taguchi Yutaka (Ibaraki JPX), Surface acoustic wave-semiconductor composite device.
    상세보기

이 특허를 인용한 특허 (28)

  1. Cohen, Daniel A.; DenBaars, Steven P.; Nakamura, Shuji, (Al,Ga,In)N diode laser fabricated at reduced temperature.
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  2. Cohen, Daniel A.; DenBaars, Steven P.; Nakamura, Shuji, (Al,Ga,In)N diode laser fabricated at reduced temperature.
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  3. Schubert, Martin F.; Basceri, Cem; Odnoblyudov, Vladimir; Kurth, Casey; Gehrke, Thomas, Engineered substrates for semiconductor devices and associated systems and methods.
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  4. Sumida,David S.; Narayanan,Authi A.; Bruesselbach,Hans W., Method for fabricating and using a light waveguide.
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  5. Yohannes, Daniel; Kirichenko, Alexander F.; Vivalda, John; Hunt, Richard, Method for increasing the integration level of superconducting electronics circuits, and a resulting circuit.
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  6. Deguet, Chrystel; Clavelier, Laurent, Method for making a thin-film element.
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  7. Aspar, Bernard; Lagahe, Christelle; Ghyselen, Bruno, Method for making thin layers containing microcomponents.
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  8. Tauzin, Aurélie; Dechamp, Jérôme; Mazen, Frédéric; Madeira, Florence, Method for preparing thin GaN layers by implantation and recycling of a starting substrate.
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  9. Maleville,Christophe; Neyret,Eric; Ben Mohamed,Nadia, Method for producing a high quality useful layer on a substrate utilizing helium and hydrogen implantations.
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  10. Nguyen, Nguyet-Phuong; Cayrefourcq, Ian; Lagahe-Blanchard, Christelle; Bourdelle, Konstantin; Tauzin, Aurélie; Fournel, Franck, Method for self-supported transfer of a fine layer by pulsation after implantation or co-implantation.
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  11. Nguyen, Nguyet-Phuong; Cayrefourcq, Ian; Lagahe-Blanchard, Christelle, Method of catastrophic transfer of a thin film after co-implantation.
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  12. Cayrefourcq,Ian; Mohamed,Nadia Ben; Lagahe Blanchard,Christelle; Nguyen,Nguyet Phuong, Method of detaching a thin film at moderate temperature after co-implantation.
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  13. Tauzin, Aurélie; Faure, Bruce; Garnier, Arnaud, Method of detaching a thin film by melting precipitates.
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  14. Brüderl, Georg; Eichler, Christoph; Strauss, Uwe, Method of fabricating a quasi-substrate wafer and semiconductor body fabricated using such a quasi-substrate wafer.
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  15. Deguet, Chrystel; Clavelier, Laurent; Dechamp, Jerome, Method of transferring a thin film onto a support.
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  16. Fournel, Franck, Method of transferring a thin layer onto a target substrate having a coefficient of thermal expansion different from that of the thin layer.
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  17. Jain, Ajaykumar R., Methods of fabricating optoelectronic devices using layers detached from semiconductor donors and devices made thereby.
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  18. Jain, Ajaykumar R., Optoelectronic devices made using layers detached from inherently lamellar semiconductor donors.
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  19. Morrow, Patrick; Jun, Kimin; Son, Il-Seok; Baskaran, Rajashree; Fischer, Paul B., Partial layer transfer system and method.
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  20. Akiyama,Shoji; Kimerling,Lionel C.; Wada,Kazumi, Photonic bandgap modulator, amplifier, demux, and TDM devices.
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  21. Jun, Kimin; Morrow, Patrick, Planar heterogeneous device.
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  22. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Process for the transfer of a thin film.
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  23. Moriceau,Hubert; Bruel,Michel; Aspar,Bernard; Maleville,Christophe, Process for the transfer of a thin film.
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  24. Moriceau, Hubert; Bruel, Michel; Aspar, Bernard; Maleville, Christophe, Process for the transfer of a thin film comprising an inclusion creation step.
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  25. Moriceau, Hubert; Aspar, Bernard; Margail, Jacques, Stacked structure and production method thereof.
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  26. Tauzin,Aur��lie, Thin film splitting method.
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  27. Ben Mohamed,Nadia; Nguyen,Nguyet Phuong; Akatsu,Takeshi; Boussagol,Alice; Suciu,Gabriela, Thin layer transfer method utilizing co-implantation to reduce blister formation and to surface roughness.
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  28. White,John M., Vacuum elastomer bonding apparatus and method.
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