초록 ▼

A system for the thermal imaging of sonically or ultrasonically excited subsurface defects in a structure. The system includes a hand-held sound source, a thermal imaging camera and a control unit. The sound source emits pulses of sound energy into the structure, and the camera generates images of d

A system for the thermal imaging of sonically or ultrasonically excited subsurface defects in a structure. The system includes a hand-held sound source, a thermal imaging camera and a control unit. The sound source emits pulses of sound energy into the structure, and the camera generates images of defects in the structure that are heated by the sound energy. The control unit controls the operation of the sound source on the camera for timing purposes. The sound source includes a transducer that is positioned against the structure at a desirable location. The source further includes a pair of legs that are also positioned against the structure to define a plane in combination with the transducer. The length of each leg is adjustable relative to the length of the transducer so that the gun can be used against irregular surfaces. The legs include a rubber tip to further prevent the transducer from slipping on the structure. In an alternate embodiment, the gun includes three transducers that define a plane and act to stabilize the gun against movement.

대표청구항 ▼

A system for the thermal imaging of sonically or ultrasonically excited subsurface defects in a structure. The system includes a hand-held sound source, a thermal imaging camera and a control unit. The sound source emits pulses of sound energy into the structure, and the camera generates images of d

A system for the thermal imaging of sonically or ultrasonically excited subsurface defects in a structure. The system includes a hand-held sound source, a thermal imaging camera and a control unit. The sound source emits pulses of sound energy into the structure, and the camera generates images of defects in the structure that are heated by the sound energy. The control unit controls the operation of the sound source on the camera for timing purposes. The sound source includes a transducer that is positioned against the structure at a desirable location. The source further includes a pair of legs that are also positioned against the structure to define a plane in combination with the transducer. The length of each leg is adjustable relative to the length of the transducer so that the gun can be used against irregular surfaces. The legs include a rubber tip to further prevent the transducer from slipping on the structure. In an alternate embodiment, the gun includes three transducers that define a plane and act to stabilize the gun against movement. ty body covering the connection part area while providing a space part thereof from the hearing element, or the connection part area allows the space part to be present in a space thereof from the connection terminal and is covered by the cylindrical body or platy body covering the connection part area while providing the space part in a space thereof from the heating element, and hydrogen gas is led from the connection terminal side into the processing container through the space part, whereby the portion of the heating element near the connection part to the power supply mechanism can be prevented from being deteriorated by the material gas, the material gas can be prevented from reacting with cleaning gas during the cleaning for removing the film adhered to the inside of the processing container, the service life of the heating element can be increased, and a film forming environment can be stabilized. le barrier, wherein said modifying comprises oxidizing said wettable region of said leadframe, wherein said oxidizing said wettable region of said leadframe comprises firing a laser at said wettable region; and defining a wettable pad with said non wettable barrier. 3. The method of claim 2 wherein said wettable pad comprises copper and wherein said non wettable barrier comprises oxidized copper. 4. The method of claim 1 wherein a lead of said leadframe comprises said non wettable barrier and said wettable pad. 5. The method of claim 1 wherein a ground paddle of said leadframe comprises said non wettable barrier and said wettable pad. 6. The method of claim 1 further comprising forming a bump between a bond pad of an electronic component and said wettable pad from solder, wherein said solder wets only said wettable pad during said forming. 7. A method comprising: forming a leadframe comprising forming a wettable layer on a non wettable layer; modifying a wettable region of said leadframe to form a non wettable barrier; and defining a wettable pad with said non wettable barrier. 8. The method of claim 7 wherein said modifying comprises removing a wettable region of said wettable layer. 9. The method of claim 8 wherein said removing is performed with a laser. 10. The method of claim 8 wherein said removing exposes a barrier region of said non wettable layer. 11. The method of claim 10 wherein said barrier region of said non wettable layer forms said non wettable barrier. 12. A method comprising: forming a leadframe; defining wettable pads of said leadframe with a laser; forming solder balls on bond pads of an electronic component; and reflowing the solder balls to form bumps between said wettable pads and said bond pads. 13. The method of claim 12 wherein said defining comprises forming non wettable barriers, said non wettable barriers confining said bumps to said wettable pads. 14. The method of claim 12 further comprising, prior to said reflowing, moving said solder balls into abutting contact with said wettable pads. 15. The method of claim 12 wherein said leadframe is one of a plurality of leadframes integrally connected together in an array leadframe, said method further comprising singulating said array leadframe. 16. A method comprising: forming a leadframe from a copper sheet; oxidizing wettable regions of said leadframe to form non wettable barriers with a laser; and defining wettable pads with said non wettable barriers. 17. A method of forming a leadframe comprising: non selectively forming a non wettable layer on a base layer; non selectively forming a wettable layer on said non wettable layer; and exposing barrier regions of said non wettable layer, said barrier regions separating tip regions of said wettable layer from remainder regions of said wettable layer, said tip regions forming wettable pads of said leadframe. 18. The method of claim 17 wherein said exposing comprises removing wettable portions of said wettable layer to expose said barrier regions. 19. The method of claim 18 wherein said wettable portions are removed with a laser.