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Airflow system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0052014 (2002-01-16)
발명자 / 주소
  • Nguyen, Hiep X.
  • Guy, Maurice M.
  • Garcia, Osvaldo
출원인 / 주소
  • Cisco Technology, Inc.
대리인 / 주소
    Campbell Stephenson Ascolese LLP
인용정보 피인용 횟수 : 65  인용 특허 : 5

초록

A high efficiency multi-directional airflow system for a telecommunications equipment assembly used for housing electronic apparatuses which facilitate telecommunications functionality. The equipment assembly defines an internal cavity which can be divided into a plurality of air flow channels. Each

대표청구항

A high efficiency multi-directional airflow system for a telecommunications equipment assembly used for housing electronic apparatuses which facilitate telecommunications functionality. The equipment assembly defines an internal cavity which can be divided into a plurality of air flow channels. Each

이 특허에 인용된 특허 (5)

  1. Hiroyuki Otaguro JP; Takayuki Ashida JP; Hitoshi Yokemura JP; Hidenao Nakajima JP; Yoshimi Watanabe JP; Shuuhei Fujita JP, Circuit board packaging structure.
  2. Lee Mario J. ; Eberhardt Anthony N. ; Eberhardt Eric R., Compact computer having a redundant air moving system and method thereof.
  3. Swensen Michael W. (Austin TX) Martin William C. (Austin TX) Kight Henry H. (Austin TX), Computer cooling system using recycled coolant.
  4. Koike Norihiro (Tokyo JPX), Cooling system for cooling electronic apparatus.
  5. Greenspan Stephen B. (Boca Raton FL) Gupta Omkarnath R. (Boca Raton FL), Cooling system with counter flow of coolant.

이 특허를 인용한 특허 (65)

  1. Shabany,Younes, Airflow system for electronics chassis.
  2. Boduch, Mark E.; Papakos, Kimon; Blakemore, Scott A.; Womac, David J., Apparatus and method for configuring a dual rack-mountable chassis.
  3. Womac, David J.; Papakos, Kimon; Blakemore, Scott A., Apparatus, system, and method for venting a chassis.
  4. Craddock, David; Gregg, Thomas A.; Lais, Eric N., Associating input/output device requests with memory associated with a logical partition.
  5. Phillips, Melvin Richard; Holt, Sr., Jefferson Logan; Meador, William C., Auto-discovery in a switch.
  6. Shaul, Kenneth Dale; Farshchian, Soheil; Bannon, Roy Micheal; Chen, Angela; Beck, Jonathan D., Blower tray.
  7. Shaul, Kenneth Dale; Farshchian, Soheil; Bannon, Roy Micheal; Chen, Angela; Beck, Jonathan D., Blower tray.
  8. Eckberg, Eric A.; Kamath, Vinod; Mahaney, Jr., Howard V.; Megarity, William M.; Steinke, Mark E., Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchanger.
  9. Schutte, Daniel J.; Helmink, Gary A.; Douglas, David W.; Dolcich, Benedict J.; Zhong, Anfu; Xu, Gang; Marton, Lewis; Anjos, Luis A.; Buckingham, Peter M., Computer room environmental conditioning unit with translatable blowers.
  10. Klein, David, Computer server heat regulation utilizing integrated precision air flow.
  11. Klein, David, Computer server heat regulation utilizing integrated precision air flow.
  12. Cheng, Hao-Der; Peng, Wen-Tang, Computer server system and fan module thereof.
  13. Bisson, Sylvio; Lotz, Willi Manfred, Cooling high performance computer systems.
  14. Yamada,Satoru, Cooling structure of electronic equipment and information processing equipment using the cooling structure.
  15. Gravina, Matteo B., Data center cooling system having electrical power generation.
  16. Gravina, Matteo B., Data center cooling system having electrical power generation.
  17. Carlson, Scott M.; Casper, Daniel F.; Compton, Scott B.; Driever, Patricia G.; Flanagan, John R.; Hathorn, Roger G.; Ricci, Louis W.; Riedy, Dale F.; Yudenfriend, Harry M., Discovery of logical images at storage area network endpoints.
  18. Tang, Xian-Xiu, Electronic device with heat dissipation apparatus.
  19. Osborn, Jay Kevin; Ely, Frazer, Electronics assembly.
  20. Vincent, William Hunt; Osborn, Jay Kevin, Electronics assembly.
  21. Yair, Andrew John; Schnabel, John David; Wrycraft, Sean Conor, Electronics assembly.
  22. Wrycraft,Sean Conor; Osborn,Jay Kevin, Electronics assembly with arrangement for air cooling.
  23. Hasse, Dirk; Bittner, Dirk, Enclosure element.
  24. Hopkins, Lawrence G., Fan array fan section in air-handling systems.
  25. Hopkins, Lawrence G., Fan array fan section in air-handling systems.
  26. Hopkins, Lawrence G., Fan array fan section in air-handling systems.
  27. Hopkins, Lawrence G., Fan array fan section in air-handling systems.
  28. Hopkins, Lawrence G., Fan array fan section in air-handling systems.
  29. Hopkins, Lawrence G., Fan array fan section in air-handling systems.
  30. Mease,Keith D.; Smith,Grant M.; Ruscitelli,John, Fan tray assembly.
  31. Moore, David A; Franz, John P; Cader, Tahir; Sabotta, Michael L, Heat dissipating system.
  32. Chen, Gang; Zhang, Shoukai; Shu, Liwen; Tang, Weidong, Heat dissipation system for communication device with box type chassis, box type chassis, and communication device.
  33. Jacques,Joseph; Nguyen,Hiep; Garcia,Osvalso, High efficiency counter-flow shelf cooling system.
  34. Shabany, Younes; Yum, Hans; Collis, Todd; Bisbikis, Steve; Koo, Steve; Miller, Kieran, Increasing air inlet/outlet size for electronics chassis.
  35. Gregg, Thomas A.; Craddock, David F.; Lais, Eric N., Input/output (I/O) expansion response processing in a peripheral component interconnect express (PCIE) environment.
  36. Gregg, Thomas A.; Craddock, David F.; Lais, Eric N., Input/output (I/O) expansion response processing in a peripheral component interconnect express (PCIe) environment.
  37. Gregg, Thomas A.; Craddock, David F.; Lais, Eric N., Input/output (I/O) expansion response processing in a peripheral component interconnect express (PCIe) environment.
  38. Yoshida, Toshihiro; Hatozaki, Yoshihisa, Inverter apparatus.
  39. Huang, Cheng Yu, Laptop cooling pad with heat-dissipating fan adjustable in position.
  40. Franz, John P.; Sabotta, Michael L.; Cader, Tahir; Moore, David A., Liquid temperature control cooling.
  41. Check, Mark A.; Craddock, David F.; Gregg, Thomas A.; Mak, Pak-kin; Strait, Gary E., Memory error isolation and recovery in a multiprocessor computer system.
  42. Hopkins, Lawrence G, Modular fan housing with multiple modular units having sound attenuation for a fan array for an air-handling system.
  43. Hopkins, Lawrence G., Modular fan housing with multiple modular units having sound attenuation for a fan array for an air-handling system.
  44. Hopkins, Lawrence G., Modular fan housing with multiple modular units having sound attenuation for a fan array for an air-handling system.
  45. Hopkins, Lawrence G., Modular fan units with sound attenuation layers for an air handling system.
  46. Walsh,Tim; O'Coimin,David, Noise proofed ventilated air intake chamber for electronics equipment enclosure.
  47. Walsh, Tim; O'Coimin, David, Noiseproofed and ventilated air intake chamber for electronics equipment enclosure.
  48. Walsh,Tim; O'Coimin,David, Noiseproofed and ventilated enclosure for electronics equipment.
  49. Gregg, Thomas A.; Bayer, Gerd K.; Craddock, David F.; Jung, Michael; Lais, Eric N.; Nass, Elke G., Non-standard I/O adapters in a standardized I/O architecture.
  50. Fricker, Jean-Philippe, Quick-disconnect translatable fan tray for electronics enclosure.
  51. DeCusatis, Casimer M.; Krishnamurthy, Rajaram B.; Onghena, Michael; Rao, Anuradha, Redundant power supply configuration for a data center.
  52. DeCusatis, Casimer M.; Krishnamurthy, Rajaram B.; Onghena, Michael; Rao, Anuradha, Redundant power supply configuration for a data center.
  53. Craddock, David F.; Gregg, Thomas A.; Lais, Eric N., Scalable I/O adapter function level error detection, isolation, and reporting.
  54. Craddock, David F.; Gregg, Thomas A.; Lais, Eric N., Scalable I/O adapter function level error detection, isolation, and reporting.
  55. Huang, Ying-Hui; Tung, Tien-Hsiung; Mo, Pao-Kang; Liu, Te-Wei, Server device.
  56. DeCusatis, Casimer M.; Krishnamurthy, Rajaram B.; Onghena, Michael; Rao, Anuradha; Neugebauer, Brian J., Spread spectrum wireless communication code for data center environments.
  57. DeCusatis, Casimer M.; Krishnamurthy, Rajaram B.; Onghena, Michael; Rao, Anuradha; Neugebauer, Brian J., Spread spectrum wireless communication code for data center environments.
  58. Papakos, Kimon; Blakemore, Scott A.; Boduch, Mark E., Stackable cable tray.
  59. Bayer, Gerd K.; Craddock, David F.; Gregg, Thomas A.; Jung, Michael; Kohler, Andreas; Nass, Elke G.; Schlag, Oliver G.; Szwed, Peter K., Switch failover control in a multiprocessor computer system.
  60. Lais, Eric N.; Craddock, David F.; Gregg, Thomas A., System and method for routing I/O expansion requests and responses in a PCIE architecture.
  61. Narasimhan, Susheela N.; Tran, Hang; Tasic, Branimir; Borg, John; Cheong, Wingo; Nguyen, Nguyen, Techniques utilizing thermal, EMI and FIPS friendly electronic modules.
  62. Gravina, Matteo B., Thermal energy accumulator for power generation and high performance computing center.
  63. Gregg, Thomas A.; Craddock, David F.; Lais, Eric N., Upbound input/output expansion request and response processing in a PCIe architecture.
  64. Gregg, Thomas A.; Craddock, David F.; Lais, Eric N., Upbound input/output expansion request and response processing in a PCIe architecture.
  65. Kruse, Thomas, Ventilation device.
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