초록 ▼

A refrigeration system includes an evaporator housing sealed to a first side of a circuit board containing a logic module, the evaporator housing including an evaporator block in thermal communication with the logic module. The evaporator housing further includes at least a humidity sensor for detec

A refrigeration system includes an evaporator housing sealed to a first side of a circuit board containing a logic module, the evaporator housing including an evaporator block in thermal communication with the logic module. The evaporator housing further includes at least a humidity sensor for detecting a humidity within the evaporator housing. In another aspect of the invention, the refrigeration system includes a heater on a second side of the circuit board opposite the evaporator housing, the heater being in thermal communication with plated through-holes of the circuit board to maintain the circuit board above local ambient temperature. In another aspect of the invention, a source of dry pressurized air is provided into the sealed evaporator housing through a though-hole drilled directly under the logic module. In another aspect of the invention, a portion of the warm air exiting the processor cage is recirculated and caused to pass over the evaporator housing, thereby ensuring that the exterior surface of the evaporator housing is warming to above local dew point. In another aspect of the invention, two or more modular, interchangeable refrigeration units are concurrently connected to the evaporator and are controlled independently, providing backup capability to ensure the reliability of the system.

대표청구항 ▼

1. A refrigeration and condensation control system for cooling a logic module mounted to a first side of a circuit board, the system comprising: a processor cage housing the circuit board; an evaporator housing installed over the logic module, the evaporator housing being sealed to the circuit b

1. A refrigeration and condensation control system for cooling a logic module mounted to a first side of a circuit board, the system comprising: a processor cage housing the circuit board; an evaporator housing installed over the logic module, the evaporator housing being sealed to the circuit board; a blower for circulating air within the processor cage, said air drawing cool air from outside the processor cage through an air inlet and expel warmed air out of the cage through an outlet; and an air passageway connecting flows upstream and downstream of the blower, the evaporator housing being positioned in said air passageway so that a portion of said warmed air is recirculated to pass over the evaporator housing for warming the exterior surface of the evaporator housing to above the local dew point.