초록 ▼

An optical device includes a package consisting of a lead frame and a molded resin integrally molded with the lead frame. The package has a cavity in which an optical element is installed. The opening of the cavity is closed by a cap defining a light transmission window. An ultraviolet-light-setting

An optical device includes a package consisting of a lead frame and a molded resin integrally molded with the lead frame. The package has a cavity in which an optical element is installed. The opening of the cavity is closed by a cap defining a light transmission window. An ultraviolet-light-setting type adhesive is used to fix the cap to the package so as to close the opening of the cavity. When fixing the cap to the package, a ultraviolet-tray is irradiated toward an adhesion area between the cap and the package to solidify the ultraviolet-light-setting type adhesive to fix the cap to the package. The cap is provided with a UV light impermeable, protective film except for a peripheral area thereof and the cap is fixed to the package in such a manner the UV light impermeable, protective film faces outside of the cavity.

대표청구항 ▼

1. A process for manufacturing an optical device comprising the following steps of: preparing a package consisting of a lead frame and a molded resin integrally molded with said lead frame, said package being provided with a cavity having an opening; installing an optical element in said cavity

1. A process for manufacturing an optical device comprising the following steps of: preparing a package consisting of a lead frame and a molded resin integrally molded with said lead frame, said package being provided with a cavity having an opening; installing an optical element in said cavity of the package; coating an ultraviolet-light-setting type adhesive along a periphery of said opening of the package; applying a cap for defining a light transmission window to said package, said cap being provided with a light permeable protective film attached to one surface of said cap, so that said opening of the cavity is closed in such a manner that said light permeable protective film faces outside of the cavity; irradiating a ultraviolet-light toward an adhesion area between said cap and said package, through said cap except for an area to which said light permeable protective film is attached, to solidify said ultraviolet-light-setting type adhesive to fix said cap to said package; and removing said light permeable protective film from said cap after said cap is fixed to said package. 2. A process as set forth in claim 1, wherein said UV light impermeable, protective film is attached in advance to said one surface of the cap except for an outer peripheral area of the cap, which is exposed from said protective film. 3. A process for manufacturing an optical device comprising the following steps of: preparing a package consisting of a lead frame and a molded resin integrally molded with said lead frame, said package being provided with a cavity having an opening, said lead frame comprising a stage exposed on a bottom surface of said cavity and a plurality of leads, each lead having an inner lead exposed on said bottom surface of the cavity and arranged around said stage and an outer lead extending outward from said molded resin of the package; and installing said optical element in said cavity so that said optical element is mounted on said stage; and electrically connecting said optical element to said inner leads, before said cap is applied to the package; coating an ultraviolet-light-setting type adhesive along a periphery of said opening of the package; applying a cap for defining a light transmission window to said package so as to close said opening of the cavity; and irradiating a ultraviolet-light toward an adhesion area between said cap and said package to solidify said ultraviolet-light-setting type adhesive to fix said cap to said package.