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Heat dissipating device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0155142 (2002-05-24)
발명자 / 주소
  • Tsai, Mei-Nan
  • Tsai, Cheng-Lung
대리인 / 주소
    Ladas and Parry
인용정보 피인용 횟수 : 37  인용 특허 : 9

초록

A heat dissipating device includes a heat dissipating fin unit, a heat dissipating fan unit, a heat exchanger, and a pump. The pump draws working fluid from the heat exchanger via a delivery pipe, and supplies the working fluid back to the heat exchanger via a supply pipe. The supply pipe is mounted

대표청구항

A heat dissipating device includes a heat dissipating fin unit, a heat dissipating fan unit, a heat exchanger, and a pump. The pump draws working fluid from the heat exchanger via a delivery pipe, and supplies the working fluid back to the heat exchanger via a supply pipe. The supply pipe is mounted

이 특허에 인용된 특허 (9)

  1. Sanjay K. Roy, Active cold plate/heat sink.
  2. Chien Chuan-Fu,TWX, CPU cooling system.
  3. Goldowsky Michael Philip ; Chiu George Liang-Tai ; Mok Lawrence Shungwei ; Ellis Arthur W., Contactless hermetic pump.
  4. Cheon Kioan, Cooling system for computer.
  5. Batchelder John Samuel, Heat exchange apparatus.
  6. Lian Bin ; Dishongh Terrance J. ; Searls Damion T. ; Dujari Prateek J., Heat sink with integrated fluid circulation pump.
  7. Hsiao Chieh-Jen,TWX, Heat-dissipating apparatus for an integrated circuit device.
  8. Chen Shiaw-Jong S. ; Hooey Roger J. ; Radke Robert E., Integrated active cooling device for board mounted electric components.
  9. Kerner James M. (779 Hillgrove Chico CA 95926), Thermoelectric closed-loop heat exchange system.

이 특허를 인용한 특허 (37)

  1. Chang, Neng Chao, Apparatus of water-cooled heat sink.
  2. Angelis,Walter Georg; Seidler,Siegfried; Laufer,Wolfgang, Arrangement and method for removing heat from a component which is to be cooled.
  3. Rojo Lulic, Francisco, Arrangement for conveying fluids.
  4. Seidler,Siegfried; Rojo Lulic,Francisco; Laufer,Wolfgang, Arrangement with an electronically commutated external rotor motor.
  5. Berroth, Hansjörg, Assembly for transporting fluids.
  6. Utsunomiya, Motoyasu, Circulation-type liquid cooling apparatus and electronic device containing same.
  7. Chen, Yung Cheng, Control structure fastened with the housing of an electronic device for regulating a cooler of the electronic device.
  8. Moore, David Allen; Franz, John P.; Cader, Tahir; Sabotta, Michael Lawrence, Cooling assembly.
  9. Van Lear,Brian T.; Whitaker,Jerad D., Cooling devices and systems.
  10. Fan, Jui-Chan; Lai, Jeng-Ming, Cooling system and server.
  11. Holahan, Maurice F.; Kline, Eric V.; Krystek, Paul N.; Rasmussen, Michael R.; Sinha, Arvind K.; Zins, Stephen M., Dual magnetically coupled rotor heat exchanger.
  12. Tsai, Shui-Fa, Electronic device and liquid cooling heat dissipation device thereof.
  13. Heydari,Ali; Gektin,Vadim, Gasketed field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components.
  14. Moore, David A; Franz, John P; Cader, Tahir; Sabotta, Michael L, Heat dissipating system.
  15. Lee, Kuo-Shao, Heat dissipation device comprised of multiple heat sinks.
  16. Lee,Hsieh Kun; Xia,Wan Lin; Li,Tao; Xiao,Min Qi, Heat dissipation device for multiple heat-generating components.
  17. Lai, Cheng-Tien; Lee, Tsung-Lung; Wang, Shenghua, Heat dissipation device with working liquid received in circulatory route.
  18. Chen,Wan Tien, Heat dissipation system with an air compressing mechanism.
  19. Huang, Bin-Juine; Wang, Chih-Hung; Huang, Huan-Hsiang; Yeh, Yu-Yuan, Heat pipe cooling system and thermal connector thereof.
  20. Chen, Yun Lung, Heat sink assembly with fan-driven fluid circulation.
  21. Fan, Wei-Feng, Heat sink assembly with heat pipe.
  22. Zoodsma,Randy J., Hybrid heat sink performance enhancement using recirculating fluid.
  23. Lee,Hsieh Kun; Chen,Chun Chi; Zhang,Jianjun, Integrated liquid cooling system for electrical components.
  24. Lee,Hsieh Kun; Lai,Cheng Tien; Zhou,Shi Wen, Integrated liquid cooling system for electrical components.
  25. Lee,Hsieh Kun; Lai,Cheng Tien; Zhou,Zhi Yong, Integrated liquid cooling system for electrical components.
  26. Shih, Shoei-Yuan, Liquid cooled radiation module for servers.
  27. Franz, John P; Cader, Tahir; Sabotta, Michael L; Moore, David A, Liquid cooling.
  28. Lee,Hsieh Kun; Lai,Cheng Tien; Zhou,Zhi Yong; Wen,Jiang Jian, Liquid cooling device.
  29. Matsushita,Shinji; Oikawa,Hironori, Liquid cooling module.
  30. Franz, John P.; Sabotta, Michael L.; Cader, Tahir; Moore, David A., Liquid temperature control cooling.
  31. Chen,Lee Long; Huang,Chien Hsiung; Lin,Yu Hsien; Huang,Wen Shi; Chen,Chin Ming, Liquid-cooled heat dissipation module.
  32. Chen,Lee Long; Huang,Chien Hsiung; Lin,Yu Hsien; Chen,Chin Ming, Liquid-cooling heat dissipation module.
  33. Ostwald, Timothy C.; Plutt, Daniel J.; Manes, Joseph P., Method and apparatus for liquid cooling computer equipment.
  34. Chou,Der Jeou; Nelson,Daniel Todd, Methods and apparatus for an integrated fan pump cooling module.
  35. Moore, David A; Franz, John P; Cader, Tahir; Sabotta, Michael L, Modular rack system.
  36. Cheng,Ruei Fu; Chen,Ts'ung Chin, Pump of liquid based cooling device.
  37. Lin, Shu-Ju, Radiation apparatus.
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