A small-engine vehicle including a plurality of wheels, an internal combustion engine having a drive shaft interconnected to drive at least one of the wheels, and a generator. The generator includes a stator having a core disposed next to the engine and a winding disposed on the core. The generator
A small-engine vehicle including a plurality of wheels, an internal combustion engine having a drive shaft interconnected to drive at least one of the wheels, and a generator. The generator includes a stator having a core disposed next to the engine and a winding disposed on the core. The generator further includes a flywheel-rotor apparatus surrounding at least a portion of the stator and having an aperture that receives the drive shaft. The flywheel-rotor apparatus is operable to magnetically interact with the stator to produce a first high-voltage, alternating-current signal in the winding, and to provide an inertia to the internal combustion engine. The generator further includes power circuitry electrically connected to the winding. The power circuitry receives the high-voltage, alternating-current signal and controllably generates a second high-voltage, alternating-current signal.
대표청구항▼
A small-engine vehicle including a plurality of wheels, an internal combustion engine having a drive shaft interconnected to drive at least one of the wheels, and a generator. The generator includes a stator having a core disposed next to the engine and a winding disposed on the core. The generator
A small-engine vehicle including a plurality of wheels, an internal combustion engine having a drive shaft interconnected to drive at least one of the wheels, and a generator. The generator includes a stator having a core disposed next to the engine and a winding disposed on the core. The generator further includes a flywheel-rotor apparatus surrounding at least a portion of the stator and having an aperture that receives the drive shaft. The flywheel-rotor apparatus is operable to magnetically interact with the stator to produce a first high-voltage, alternating-current signal in the winding, and to provide an inertia to the internal combustion engine. The generator further includes power circuitry electrically connected to the winding. The power circuitry receives the high-voltage, alternating-current signal and controllably generates a second high-voltage, alternating-current signal. ated circuit according to claim 1, further comprising a resistor connected to the switching circuit in series. 3. A semiconductor integrated circuit according to claim 1, further comprising a signal control circuit for selectively outputting an output from one of the function circuits based on potentials of the power supply pads in the plurality Of units. 4. A semiconductor integrated circuit according to claim 1, wherein the power supply pad in one of the plurality of units is connected to a terminal having the prescribed operating potential via a conductive member. 5. A semiconductor integrated circuit according to claim 4, wherein the conductive member is a bonding wire. 6. A semiconductor integrated circuit according to claim 4, wherein the terminal includes a plurality of first terminal regions, the power supply pad includes a plurality of second terminal regions, and the conductive member is applied or caused to adhere by pressure to the plurality of first terminal regions and the plurality of second terminal regions. onding wire section for making electrical connection between the terminal section and the semiconductor chip; a resin sealing section for sealing a circuit forming surface of the semiconductor chip and the bonding wire section; and a conductive member, provided on the second land section, for connecting the semiconductor chip to outside. 15. The semiconductor device as set forth in claim 14, further comprising a heat resistant film for mounting the semiconductor chip which covers a second-surface opening of the opening section. 16. The semiconductor device as set forth in claim 14, further comprising a metallic foil for mounting the semiconductor chip, which is provided so as to cover an opening of the opening section on the second surface. 17. The semiconductor device set forth in claim 14, further comprising a support projection, provided on the insulating substrate, corresponding to the external connection terminal. 18. A semiconductor device comprising: an insulating substrate; a terminal section, provided on a first surface of the insulating substrate, for making flip-chip connection; a first land section, provided on the first surface, for an external connection terminal; a second land section, provided on a second surface on the other side of the first surface, for interconnecting semiconductor devices; wiring patterns, respectively provided on the first surface and the second surface, for making electrical connection between the terminal section, the first land section, and the second land section; a support pattern, provided on the second surface corresponding
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