IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0025449
(2001-12-19)
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발명자
/ 주소 |
- Marshall, Albert C.
- Kravitz, Stanley H.
- Tigges, Chris P.
- Vawter, Gregory A.
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
7 인용 특허 :
4 |
초록
▼
A highly effective, micron-scale micro heat barrier structure and process for manufacturing a micro heat barrier based on semiconductor and/or MEMS fabrication techniques. The micro heat barrier has an array of non-metallic, freestanding microsupports with a height less than 100 microns, attached to
A highly effective, micron-scale micro heat barrier structure and process for manufacturing a micro heat barrier based on semiconductor and/or MEMS fabrication techniques. The micro heat barrier has an array of non-metallic, freestanding microsupports with a height less than 100 microns, attached to a substrate. An infrared reflective membrane (e.g., 1 micron gold) can be supported by the array of microsupports to provide radiation shielding. The micro heat barrier can be evacuated to eliminate gas phase heat conduction and convection. Semi-isotropic, reactive ion plasma etching can be used to create a microspike having a cusp-like shape with a sharp, pointed tip (-6to 10-7W/m-K. Multiple layers of reflective membranes can be used to increase thermal resistance.
대표청구항
▼
A highly effective, micron-scale micro heat barrier structure and process for manufacturing a micro heat barrier based on semiconductor and/or MEMS fabrication techniques. The micro heat barrier has an array of non-metallic, freestanding microsupports with a height less than 100 microns, attached to
A highly effective, micron-scale micro heat barrier structure and process for manufacturing a micro heat barrier based on semiconductor and/or MEMS fabrication techniques. The micro heat barrier has an array of non-metallic, freestanding microsupports with a height less than 100 microns, attached to a substrate. An infrared reflective membrane (e.g., 1 micron gold) can be supported by the array of microsupports to provide radiation shielding. The micro heat barrier can be evacuated to eliminate gas phase heat conduction and convection. Semi-isotropic, reactive ion plasma etching can be used to create a microspike having a cusp-like shape with a sharp, pointed tip (-6to 10-7W/m-K. Multiple layers of reflective membranes can be used to increase thermal resistance. comprising from about 20 to about 70 percent copper oxalate hemi-hydrate and a fuel selected from the group consisting of from about 10 to about 55 percent guanidine nitrate; from about 10 to about 55 percent nitroguanidine; from about 5 to about 25 percent cellulose; from about 5 to about 25 percent cellulose acetate; from about 3 to about 15 percent hexamine from about 5 to about 35 percent 5-aminotetrazole; from about 5 to about 35 percent 5-nitrouracil; from about 5 to about 35 percent guanidine salt of 5-nitrouracil, and mixtures thereof. 33. A method of generating a gas with low-solids, the method comprising: preparing a mixture comprising a fuel and an oxidizer, wherein the mixture is within about 4 percent of stoichiometric balance; mixing the oxidizer-fuel mixture with a cupric oxalate hemi-hydrate coolant; and combusting the mixture of oxidizer, fuel, and coolant, thereby producing a gas and no more than about 0.085 cubic centimeters of solids per gram of gas generating composition on combustion; wherein the fuel is selected from the group consisting of guanidine nitrate, nitroguanidine, cellulose, cellulose acetate, hexamine, 5 amino-tetrazole, 5 nitro-uracil, guanidine salt of 5 nitro-uracil, and mixtures thereof; and the oxidizer is selected from the group consisting of ceric ammonium nitrate, strontium nitrate, basic copper nitrate, a mixture of ammonium perchlorate and at least one alkali metal salt, and mixtures thereof. 34. The method of claim 33, further comprising adding sub-micron fumed silica as a desiccant to the mixture of oxidizer, fuel, and coolant. 35. The gas generating composition of claim 1, wherein the cupric oxalate hemi-hydrate coolant is present in an amount of at least about 50 percent. 36. The gas generating composition of claim 35, comprising ammonium perchlorate, sodium nitrate, cupric oxalate hemi-hydrate, and cellulose. 37. The gas generating compositio
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