초록 ▼

Not all gas diffusion structures known to date can guarantee water balance compensation in the fuel cell, protection against drying and prevention of water deposits while simultaneously ensuring even distribution of reaction gases. In the gas diffusion structure, according to the invention, a gradie

Not all gas diffusion structures known to date can guarantee water balance compensation in the fuel cell, protection against drying and prevention of water deposits while simultaneously ensuring even distribution of reaction gases. In the gas diffusion structure, according to the invention, a gradient is produced in terms of gas permeability perpendicular to the membrane by way of a stratified system. This guarantees, at an appropriate operating temperature and appropriate stoichiometry of the reactants, constant and optimal humidification in all points of the membrane by the formed product water. Additional humidification systems can thus be discarded.

대표청구항 ▼

Not all gas diffusion structures known to date can guarantee water balance compensation in the fuel cell, protection against drying and prevention of water deposits while simultaneously ensuring even distribution of reaction gases. In the gas diffusion structure, according to the invention, a gradie

Not all gas diffusion structures known to date can guarantee water balance compensation in the fuel cell, protection against drying and prevention of water deposits while simultaneously ensuring even distribution of reaction gases. In the gas diffusion structure, according to the invention, a gradient is produced in terms of gas permeability perpendicular to the membrane by way of a stratified system. This guarantees, at an appropriate operating temperature and appropriate stoichiometry of the reactants, constant and optimal humidification in all points of the membrane by the formed product water. Additional humidification systems can thus be discarded. the thermoplastic resin material into a substrate, by stacking a layer composed of at least one substance selected from the group consisting of polyether ether ketone, polyether imide, polyethylene naphthalate and polyethylene terephthalate, on a polyimide base. 7. A bonding structure comprising: an adherend; a thermoplastic resin material to be adhered to the adherend; and an adhesion-improving layer formed in the thermoplastic resin material at the interface with the adherend by a dispersion of a dispersing substance into the thermoplastic resin material, the adhesion-improving layer having an elastic modulus lower than that of the thermoplastic resin material, wherein the thermoplastic resin material is bonded with the adherend through the adhesion-improving layer. 8. The bonding structure according to claim 7, wherein the dispersing substance is a hydrocarbon compound. 9. The bonding structure according to claim 8, wherein the hydrocarbon compound is any one of an alkane, alkene and alkyne. 10. The bonding structure according to claim 7, wherein the thermoplastic resin material includes at least one substance selected from the group consisting of polyether imide, polyether ether ketone, polyethylene naphthalate and polyethylene terephthalate. 11. The bonding structure according to claim 7, wherein the thermoplastic resin material is formed into a substrate, by stacking a layer composed of at least one substance selected from the group consisting of polyether ether ketone, polyether imide, polyethylene naphthalate and polyethylene terephthalate, on a polyimide base. 12. The bonding structure according to claim 7, wherein the adherend is a glass epoxy substrate. 13. The bonding structure according to claim 7, wherein the adherend is a metallic material. 14. The bonding structure according to claim 7, wherein the adhesion-improving layer is formed by heating the dispersing substance and the thermoplastic resin material. 15. A method for bonding a thermoplastic resin material onto an adherend, comprising: interspersing a film between the thermoplastic resin material and the adherend, the film including a dispersing substance that reduces an elastic modulus of the thermoplastic resin material when dispersed therein; disposing the thermoplastic resin material and the film on the adherend; and heating a position at which the thermoplastic resin material is to be adhered to the adherend and defined by overlapping portions of the film, the thermoplastic resin material and the adherend to a temperature not less than a glass transition point of the thermoplastic resin material, wherein during the heating, the dispersing substance is dispersed into the thermoplastic resin material to form an adhesion-improving layer by which the thermoplastic resin material is adhered to the adherend, the adhesion improving layer having an elastic modulus lower than that of the thermoplastic resin material.