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Method of separating composite member and process for producing thin film 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/46
출원번호 US-0558657 (2000-04-26)
우선권정보 JP-0124744 (1999-04-30); JP-0122569 (2000-04-24)
발명자 / 주소
  • Ohmi, Kazuaki
  • Nakagawa, Katsumi
  • Sato, Nobuhiko
  • Sakaguchi, Kiyofumi
  • Yanagita, Kazutaka
  • Yonehara, Takao
출원인 / 주소
  • Canon Kabushiki Kaisha
대리인 / 주소
    Fitzpatrick, Cella, Harper & Scinto
인용정보 피인용 횟수 : 32  인용 특허 : 8

초록

To cause a crack at a fixed position in a separation layer, a method of separating a composite member includes the steps of forming a separation layer inside a composite member, forming inside the separation layer a stress riser layer in which an in-plane stress has concentratedly been produced to a

대표청구항

1. A method of separating a composite member, comprising the steps of; forming on a surface of a first substrate a first porous layer and a second porous layer having a higher porosity than the first porous layer, said first and second porous layers being in the single-crystalline state; oxidizi

이 특허에 인용된 특허 (8)

  1. Henley Francois J. ; Cheung Nathan W., Controlled cleaning process.
  2. Tayanaka Hiroshi,JPX, Method for making thin film semiconductor.
  3. Sato Nobuhiko,JPX ; Yonehara Takao,JPX ; Sakaguchi Kiyofumi,JPX, Method for producing semiconductor substrate.
  4. Yoshizawa, Katsuo; Sato, Tsutomu; Mitani, Kiyoshi; Katayama, Masatake, Method for production of SOI substrate.
  5. Sakaguchi Kiyofumi,JPX ; Yonehara Takao,JPX ; Atoji Tadashi,JPX, Method of manufacturing semiconductor article.
  6. Aspar Bernard,FRX ; Bruel Michel,FRX ; Poumeyrol Thierry,FRX, Method of producing a thin layer of semiconductor material.
  7. Sakaguchi Kiyofumi,JPX ; Yonehara Takao,JPX, Process for production of semiconductor substrate.
  8. Yonehara Takao (Atsugi JPX), Semiconductor member and process for preparing semiconductor member.

이 특허를 인용한 특허 (32)

  1. Harada, Seiji; Kobayashi, Satoshi; Yubira, Yasuyoshi, Laminated wafer processing method.
  2. Noda, Kosei; Takeuchi, Toshihiko; Ishikawa, Makoto, Method for manufacturing SOI substrate and semiconductor device.
  3. Ohnuma, Hideto; Hirose, Takashi, Method for manufacturing photoelectric conversion device.
  4. Yamazaki, Shunpei; Ohnuma, Hideto, Method for manufacturing semiconductor device.
  5. Kim, Myung Su; Song, Min Chul; Park, Soon Young; Kim, Dong Seop; Park, Sung Chan; Kang, Yoon Mook; Kim, Tae Jun; Shin, Min Ki; Lee, Sang Won; Lim, Heung Kyoon, Method for manufacturing solar cell including etching.
  6. Silverman, David E.; Stein, Alan, Method for treating morbid obesity.
  7. Silverman, David E.; Stein, Alan, Method for treating morbid obesity.
  8. Silverman, David E.; Stein, Alan, Method for treating morbid obesity.
  9. Silverman, David E.; Stein, Alan, Method for treating morbid obesity.
  10. Silverman, David E.; Stein, Alan, Method for treating morbid obesity.
  11. Silverman,David E.; Stein,Alan, Method for treating morbid obesity.
  12. Silverman,David E.; Stein,Alan, Method for treating morbid obesity.
  13. Isaka, Fumito; Kato, Sho; Dairiki, Koji, Method of manufacturing photoelectric conversion device.
  14. Isaka, Fumito; Kato, Sho; Dairiki, Koji, Method of manufacturing photoelectric conversion device.
  15. Isaka, Fumito; Kato, Sho; Dairiki, Koji, Method of manufacturing photoelectric conversion device.
  16. Isaka, Fumito; Kato, Sho; Nei, Kosei; Komatsu, Ryu; Shimomura, Akihisa; Dairiki, Koji, Method of manufacturing photoelectric conversion device.
  17. Haverfield, Maxwell E., Method of treating anal incontinence.
  18. Huang, Yongli, Methods for fabricating micro-electro-mechanical devices.
  19. Huang, Yongli, Micro-electro-mechanical transducer having an insulation extension.
  20. Huang, Yongli, Micro-electro-mechanical transducers.
  21. Huang, Yongli, Micro-electro-mechanical transducers.
  22. Huang, Yongli, Middle spring supported micro-electro-mechanical transducers.
  23. Chapelon, Laurent-Luc; Cuzzocrea, Julien, Process for fabricating integrated-circuit chips.
  24. Chapelon, Laurent-Luc; Cuzzocrea, Julien, Process for fabricating integrated-circuit chips.
  25. Matsukawa, Kazuhito; Koga, Tsuyoshi; Nishida, Akio; Higashide, Yoshiko; Shibata, Jun; Tobimatsu, Hiroshi, Semiconductor chip having gettering layer, and method for manufacturing the same.
  26. Sakaguchi, Kiyofumi, Substrate and manufacturing method therefor.
  27. Sakaguchi, Kiyofumi, Substrate and manufacturing method therefor.
  28. Yonehara,Takao, Substrate, manufacturing method therefor, and semiconductor device.
  29. Huang, Yongli, Through-wafer interconnection.
  30. Huang, Yongli, Through-wafer interconnection.
  31. Kerdiles, Sébastien; Maleville, Christophe; Letertre, Fabrice; Rayssac, Olivier, Transfer method with a treatment of a surface to be bonded.
  32. Kerdiles, Sébastien; Maleville, Christophe; Letertre, Fabrice; Rayssac, Olivier, Transfer method with a treatment of a surface to be bonded.
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