IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
|
출원번호 |
US-0999158
(2001-11-30)
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발명자
/ 주소 |
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인용정보 |
피인용 횟수 :
6 인용 특허 :
8 |
초록
▼
A power failure transfer switching system for monitoring incoming line voltages and switching to auxiliary sources as required. The power failure transfer switching system includes a voltage monitoring assembly designed for monitoring the levels of an incoming ac supply circuit, a power generating a
A power failure transfer switching system for monitoring incoming line voltages and switching to auxiliary sources as required. The power failure transfer switching system includes a voltage monitoring assembly designed for monitoring the levels of an incoming ac supply circuit, a power generating assembly for supplying an auxiliary source of ac power when the voltage monitoring assembly detects an inadequacy in supply from the incoming ac supply circuit, and a control assembly operationally coupled to the voltage monitoring assembly and to the power generating assembly for operating the power generating assembly when the voltage monitoring assembly detects an inadequacy in supply.
대표청구항
▼
A power failure transfer switching system for monitoring incoming line voltages and switching to auxiliary sources as required. The power failure transfer switching system includes a voltage monitoring assembly designed for monitoring the levels of an incoming ac supply circuit, a power generating a
A power failure transfer switching system for monitoring incoming line voltages and switching to auxiliary sources as required. The power failure transfer switching system includes a voltage monitoring assembly designed for monitoring the levels of an incoming ac supply circuit, a power generating assembly for supplying an auxiliary source of ac power when the voltage monitoring assembly detects an inadequacy in supply from the incoming ac supply circuit, and a control assembly operationally coupled to the voltage monitoring assembly and to the power generating assembly for operating the power generating assembly when the voltage monitoring assembly detects an inadequacy in supply. ectrical contact with said intermediate connection region. 11. A device according to claim 10 wherein said pad region has a third contact portion extending through said insulating region and in electrical contact with said peripheral portion of said protection structure. 12. A device according to claim 1, further comprising electrical interconnection lines connected to said electronic component; said interconnection lines comprising discontinuous sections having respectively a first and a second distance from said semiconductor material body and connected to each other by intermediate portions extending through said insulating region. 13. A device according to claim 1, further comprising first and second conductive regions in contact with said electronic component and electrically insulated from each other, each of said conductive regions comprising a plurality of line portions, said line portions of the first conductive region electrically connected to each other and interleaved with said line portions of said second conductive region, each line portion of the first conductive region being formed by discontinuous sections having respectively a first and a second distance from said semiconductor material body and being connected to each other by intermediate portions extending through said insulating region. 14. An integrated electronic device comprising: a semiconductor material body; an electronic component positioned at a surface of the semiconductor material body; a contact pad positioned above and electrically connected to the electronic component; and a protection structure having an annular peripheral portion in contact with and supporting the contact pad on the semiconductor material body. 15. The device of claim 14, further comprising an electrically insulating region completely covering the electronic component and surrounded by the peripheral portion of the protection structure. 16. The device of claim 14, wherein the protection structure electrically connects the contact pad to the electronic component. 17. The device of claim 14, further comprising field oxide regions contacting and supporting the protection structure on the semiconductor material body, the field oxide regions being positioned on opposite sides of the electronic component. 18. The device of claim 14, further comprising an intermediate connection region positioned externally to the peripheral portion of the protection structure, the intermediate connection region electrically connecting the contact pad to the electronic component. Mizutani, 357/042; US-4808545, 19890200, Balasubramanyam et al., 437/041; US-4859630, 19890800, Josquin, 437/203; US-4866291, 19890900, Shimada et al., 250/578; US-5229307, 19930700, Vora et al., 437/031; US-5420061, 19950500, Manning; US-5478761, 19951200, Komori et al.; US-5519240, 19960500, Suzuki, 257/315; US-5668755, 19970900, Hidaka; US-5679981, 19971000, Kuwajima, 257/383; US-5696016, 19971200, Chen et al.; US-5702968, 19971200, Chen, 438/253; US-5705426, 19980100, Hibino, 438/627; US-5831313, 19981100, Han et al.; US-5855826, 19990100, Lee et al.; US-5915179, 19990600, Etou et al., 438/268; US-6043552, 20000300, Miwa, 257/587; US-6274416, 20010800, Kim et al., 438/199; US-6388278, 20020500, Suzuki et al., 257/222
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