초록 ▼

The invention relates to a ceramic cutting insert for cutting tools of the type which include a clamp with a nose intended to grip into a recess (5) in the cutting insert in order to keep the cutting insert firmly in place in an insert seat in a tool holder. The recess (5) has a rotationally symmetr

The invention relates to a ceramic cutting insert for cutting tools of the type which include a clamp with a nose intended to grip into a recess (5) in the cutting insert in order to keep the cutting insert firmly in place in an insert seat in a tool holder. The recess (5) has a rotationally symmetrical shape and comprises an inner cavity (18) which is delimited by a cylindrical or slightly conical wall surface (19) said cavity extends from the far end of the inner cavity and expands outwards by ever increasing its diameter in the direction from the inner cavity to the entrance opening in the said upper or lower sides.

대표청구항 ▼

The invention relates to a ceramic cutting insert for cutting tools of the type which include a clamp with a nose intended to grip into a recess (5) in the cutting insert in order to keep the cutting insert firmly in place in an insert seat in a tool holder. The recess (5) has a rotationally symmetr

The invention relates to a ceramic cutting insert for cutting tools of the type which include a clamp with a nose intended to grip into a recess (5) in the cutting insert in order to keep the cutting insert firmly in place in an insert seat in a tool holder. The recess (5) has a rotationally symmetrical shape and comprises an inner cavity (18) which is delimited by a cylindrical or slightly conical wall surface (19) said cavity extends from the far end of the inner cavity and expands outwards by ever increasing its diameter in the direction from the inner cavity to the entrance opening in the said upper or lower sides. ture solder alloy, in which the first solid component is present in a sufficient amount to dissolve the second solid component when the preform is heated above the melting temperature of the lower-temperature solder alloy but below the melting temperature of the higher-temperature solder alloy. Upon cooling, the preform yields a solder joint having a substantially homogenous composition, which bonds the lead to the circuit board. Preferred solder alloys for the first and second solid components are lead-free.