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In order to be able to determine precisely a temperature of a semiconductor chip, in particular a semiconductor memory, during active operation, a temperature-dependent diode structure of the chip is connected to four chip terminals using four-conductor connection technology. In this manner, an inex

In order to be able to determine precisely a temperature of a semiconductor chip, in particular a semiconductor memory, during active operation, a temperature-dependent diode structure of the chip is connected to four chip terminals using four-conductor connection technology. In this manner, an inexpensive and accurate measuring mechanism is provided for measuring the temperature.

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1. A method for determining a temperature of a semiconductor chip, which comprises the steps of: impressing a defined current onto selected chip terminals; measuring a voltage occurring at least partially at a semiconductor diode structure disposed between the selected chip terminals using four-

1. A method for determining a temperature of a semiconductor chip, which comprises the steps of: impressing a defined current onto selected chip terminals; measuring a voltage occurring at least partially at a semiconductor diode structure disposed between the selected chip terminals using four-conductor connection technology, the voltage being tapped off directly at the semiconductor diode structure; determining the temperature of the semiconductor chip by reference to the voltage and the defined current; closing switches integrated on the semiconductor chip during the measuring of the voltage step, the switches being disposed between the selected chip terminals and the semiconductor diode structure; and opening the switches after a temperature measurement has been terminated, for making the selected chip terminals available again for normal operation of the semiconductor chip. 2. The method according to claim 1, wherein the semiconductor chip is a memory chip. 3. A semiconductor chip, comprising: a housing; chip terminals extending from said housing; a temperature measuring diode structure having terminals disposed in said housing; two connecting lines each connected between one of said chip terminals and one of said terminals of said diode structure; two voltage measuring lines each connected between further ones of said chips terminals and said terminals of said diode structure, said connecting lines and said voltage measuring lines connected to said diode structure using four-conductor connection technology; a control circuit disposed in said housing; and a switch connected to and activated by said control circuit, said switch connected to at least one of said connecting lines and said voltage measuring line. 4. The semiconductor chip according to claim 3, wherein said chip terminals are at least one of address terminals, input terminals and output terminals. 5. The semiconductor chip according to claim 3, wherein the semiconductor chip is a memory chip.