Toy airplane assembly having a microprocessor for assisting flight
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
A63H-027/00
출원번호
US-0015696
(2001-12-17)
발명자
/ 주소
Rehkemper, Jeffrey G.
Grisolia, Nicholas
Johnson, Keith
Gould, Bret
Florov, Alexey
출원인 / 주소
Spin Master Ltd.
대리인 / 주소
Mickney, Marcus R.Roylance, Abrams, Berdo & Goodman LLP
인용정보
피인용 횟수 :
37인용 특허 :
7
초록▼
A toy airplane assembly is provided that is easy to fly, inexpensive, and durable. The toy plane assembly includes a plane having a radio receiver and a microprocessor. Batteries housed in the fuselage power the printed circuit board to which the microprocessor and radio receiver are attached. The r
A toy airplane assembly is provided that is easy to fly, inexpensive, and durable. The toy plane assembly includes a plane having a radio receiver and a microprocessor. Batteries housed in the fuselage power the printed circuit board to which the microprocessor and radio receiver are attached. The radio receiver receives signals from a hand-held remote control radio transmitter and are transmitted to the microprocessor. The microprocessor decodes the signals and, in response thereto, distributes power to the motors for driving the propellers. All movement of the plane is controlled by the microprocessor, thereby providing microprocessor assisted flight. The plane fuselage is a one-piece molded part, made of a foam material to provide a durable plane.
대표청구항▼
A toy airplane assembly is provided that is easy to fly, inexpensive, and durable. The toy plane assembly includes a plane having a radio receiver and a microprocessor. Batteries housed in the fuselage power the printed circuit board to which the microprocessor and radio receiver are attached. The r
A toy airplane assembly is provided that is easy to fly, inexpensive, and durable. The toy plane assembly includes a plane having a radio receiver and a microprocessor. Batteries housed in the fuselage power the printed circuit board to which the microprocessor and radio receiver are attached. The radio receiver receives signals from a hand-held remote control radio transmitter and are transmitted to the microprocessor. The microprocessor decodes the signals and, in response thereto, distributes power to the motors for driving the propellers. All movement of the plane is controlled by the microprocessor, thereby providing microprocessor assisted flight. The plane fuselage is a one-piece molded part, made of a foam material to provide a durable plane. first lead, the first lead having an end which extends out of the package, and wherein the central cavity is dimensioned to receive an electronic device. 14. The method of claim 1 further comprised of the steps of providing a feeder that includes feed pins, engaging holes provided in each of the first lead frame segment and the second heat sink segment with the feeder pins, moving the feeder pins to feed the lead frame segments to a molder, depositing a flowable molding material from the molder onto the lead frame segments, and hardening the molding material. 15. The method of claim 1 wherein the first lead and the second lead are each provided with arms extending from the side portions prongs which extend in a direction substantially perpendicular to the first lead and the second lead. 16. The method of claim 15 further comprised of the steps of providing a feeder that includes feed pins, engaging holes provided in each of the first lead frame segment and the second heat sink segment with the feeder pins, moving the feeder pins to feed the lead frame segments to a molder, depositing a flowable molding material from the molder onto the lead frame segments, and hardening the molding material. 17. An electronic packaging unit comprising a first substantially planar lead frame defining a first aperture and at least one first lead extending into the aperture, a second heat sink lead frame segment which includes a second lead defining a second aperture and including at least one second lead extending into said second lead frame aperture, wherein the second lead is provided with at least one hole extending therethrough; the first lead and the second heat sink lead positioned in an overlaying arrangement in which the first and second leads are spaced apart from each other; a molded body including a hardened molding material that, when deposited in a flowable state, enters the space between the first lead and the second heat sink lead, and flows though the at least one hole in the second heat sink lead frame portion, thereby fixing the first and second leads within the molded body, wherein the molded body is structured to expose contact surfaces for each of the first lead and second lead. 18. The electronic packaging unit of claim 17 wherein the second lead further includes an edge portion having raised step portions. 19. The electronic packaging unit of claim 18 wherein the edge is provided with a notch. 20. The electronic packaging unit of claim 19 wherein, during the deposit of the flowable molding material, the material flows around the step portions of the second lead to facilitate the fixing of the second lead frame portion within the molded body. 21. The electronic packaging unit of claim 20 wherein, during the deposit of the flowable molding material, the material flows around the step portions of the second lead frame heat sink portion to facilitate the fixing of the second lead frame portion within the molded body. 22. The electronic packaging unit of claim 17 wherein the first lead is substantially rectangular and includes a side provided with a flared portion. 23. The electronic packaging unit of claim 22 wherein the first lead is substantially rectangular and includes a side provided with a flared portion. 24. The electronic packaging unit of claim 17 wherein the space between the first and second leads is bounded by the flared portion of the first lead and the through holes and step portions of the second lead. 25. The electronic packaging unit of claim 17 wherein the first and second leads are positioned in an overlapping arrangement. 26. The electronic packaging unit of claim 17 wherein the first and second leads are positioned in a tiered arrangement. 27. The electronic packaging unit of claim 17 wherein the first and second lead frame segments include side rails having guide holes positioned therein. 28. The electronic packaging unit of claim 17 wherein the molded body has a substantially rectangular shape defining a
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