Porous power and ground planes for reduced PCB delamination and better reliability
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B32B-003/10
B32B-015/00
B32B-003/00
B32B-007/00
H05K-001/11
H05K-001/23
H05K-001/09
H05K-001/02
H05K-001/14
H05K-007/02
H05K-007/06
H05K-007/08
출원번호
US-0300762
(1999-04-26)
발명자
/ 주소
Japp, Robert M.
Poliks, Mark D.
출원인 / 주소
International Business Machines Corporation
대리인 / 주소
Schmeiser, Olsen & Watts
인용정보
피인용 횟수 :
32인용 특허 :
12
초록▼
Power and ground planes used in Printed Circuit Boards (PCBs) having porous, conductive materials allow liquids (e.g., water and/or other solvents) to pass through the power and ground planes, thus decreasing failures in PCBs (or PCBs used as laminate chip carriers) caused by cathodic/anodic filamen
Power and ground planes used in Printed Circuit Boards (PCBs) having porous, conductive materials allow liquids (e.g., water and/or other solvents) to pass through the power and ground planes, thus decreasing failures in PCBs (or PCBs used as laminate chip carriers) caused by cathodic/anodic filament growth and delamination of insulators. Porous conductive materials suitable for use in PCBs may be formed by using metal-coated organic cloths (such as polyester or liquid crystal polymers) or fabrics (such as those made from carbon/graphite or glass fibers), using metal wire mesh instead of metal sheets, using sintered metal, or making metal sheets porous by forming an array of holes in the metal sheets. Fabrics and mesh may be woven or random. If an array of holes is formed in a metal sheet, such an array may be formed with no additional processing steps than are performed using conventional PCB assembly methods.
대표청구항▼
Power and ground planes used in Printed Circuit Boards (PCBs) having porous, conductive materials allow liquids (e.g., water and/or other solvents) to pass through the power and ground planes, thus decreasing failures in PCBs (or PCBs used as laminate chip carriers) caused by cathodic/anodic filamen
Power and ground planes used in Printed Circuit Boards (PCBs) having porous, conductive materials allow liquids (e.g., water and/or other solvents) to pass through the power and ground planes, thus decreasing failures in PCBs (or PCBs used as laminate chip carriers) caused by cathodic/anodic filament growth and delamination of insulators. Porous conductive materials suitable for use in PCBs may be formed by using metal-coated organic cloths (such as polyester or liquid crystal polymers) or fabrics (such as those made from carbon/graphite or glass fibers), using metal wire mesh instead of metal sheets, using sintered metal, or making metal sheets porous by forming an array of holes in the metal sheets. Fabrics and mesh may be woven or random. If an array of holes is formed in a metal sheet, such an array may be formed with no additional processing steps than are performed using conventional PCB assembly methods. 682, 19900500, Nagura et al., 428/088; US-5021275, 19910600, Kim, 428/042; US-5026584, 19910600, Logan, 428/041; US-5047103, 19910900, Abrams, 156/072; US-5073423, 19911200, Johnson et al., 428/040; US-5098772, 19920300, ef Strom, 428/211; US-5112423, 19920500, Liebe, 156/234; US-5143672, 19920900, Kuwahara, 264/132; US-5167750, 19921200, Myers, 156/583.9; US-5196080, 19930300, Mizobuchi et al., 156/234; US-5200268, 19930400, Hamada, 428/354; US-5207851, 19930500, Abrams, 156/230; US-5312645, 19940500, Dressler 00, 19921000, Weder et al.; US-5181364, 19930100, Weder; US-D335105, 19930400, Ottenwalder et al.; US-5199242, 19930400, Weder et al.; US-5200253, 19930400, Yamaguchi et al.; US-5205108, 19930400, Weder et al.; US-5228234, 19930700, de Klerk et al.; US-5235782, 19930800, Landau; US-5239775, 19930800, Landau; US-5249407, 19931000, Stuck; US-5259106, 19931100, Weder et al.; US-5307606, 19940500, Weder; US-5315785, 19940500, Avot et al.; US-5345745, 19940900, Weder; US-5350240, 19940900, Billman et al.; US-5353575, 19941000, Stepanek; US-5361482, 19
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