Fuel cell system and method for operating the process
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01M-008/04
H01M-008/12
출원번호
US-0658994
(2000-09-11)
우선권정보
DE-0043248 (1999-09-10)
발명자
/ 주소
Schuessler, Martin
출원인 / 주소
Ballard Power Systems AG
인용정보
피인용 횟수 :
4인용 특허 :
6
초록▼
In a process for operating a fuel cell system with a water balance, a hydrogen-containing medium or a mixture of mediums is reformed in a reforming reactor with a water requirement, by adding water to a hydrogen rich reformate. The reformate is fed to an anode region of a fuel cell and reacts with o
In a process for operating a fuel cell system with a water balance, a hydrogen-containing medium or a mixture of mediums is reformed in a reforming reactor with a water requirement, by adding water to a hydrogen rich reformate. The reformate is fed to an anode region of a fuel cell and reacts with oxygen from a cathode region of the fuel cell, forming water in the fuel cell. The the water required for the reforming reaction and/or the water balance of the fuel cell system is coupled directly to the oxidation rate of the partial combustion of the hydrogen-containing medium or the mixture of mediums in an oxidizing unit upstream of the reforming reactor.
대표청구항▼
In a process for operating a fuel cell system with a water balance, a hydrogen-containing medium or a mixture of mediums is reformed in a reforming reactor with a water requirement, by adding water to a hydrogen rich reformate. The reformate is fed to an anode region of a fuel cell and reacts with o
In a process for operating a fuel cell system with a water balance, a hydrogen-containing medium or a mixture of mediums is reformed in a reforming reactor with a water requirement, by adding water to a hydrogen rich reformate. The reformate is fed to an anode region of a fuel cell and reacts with oxygen from a cathode region of the fuel cell, forming water in the fuel cell. The the water required for the reforming reaction and/or the water balance of the fuel cell system is coupled directly to the oxidation rate of the partial combustion of the hydrogen-containing medium or the mixture of mediums in an oxidizing unit upstream of the reforming reactor. of Mg in terms of amount of MgO. 8. The silicon nitride ceramic substrate according to claim 1, wherein said silicon nitride ceramic substrate contains 0.3 to 3.0% by weight of at least one of Hf and Mg in terms of the amount of oxide thereof, and at most 0.5% by weight of Al, Li, Na, K, Fe, Ba, Mn and B as impurity cationic elements in terms of total amount thereof. 9. The silicon nitride ceramic substrate according to claim 1, wherein said silicon nitride ceramic substrate contains at most 2% by weight of at least one element selected from the group consisting of Ti, Zr, W, Mo, Ta, Nb, V and Cr in terms of oxide thereof. 10. A silicon nitride ceramic circuit board comprising: a silicon nitride ceramic substrate as set forth in any one of claims 1 to 8 and 9; and a metal circuit plate provided on said silicon nitride ceramic substrate. 11. A method of manufacturing the silicon nitride ceramic substrate of claim 1, comprising the steps of: preparing a material mixture by adding 2.0 to 17.5% by weight of a rare earth element in terms of the amount of an oxide thereof to a silicon nitride powder; molding said material mixture to form a compact; degreasing said compact; heating and holding said compact at a temperature of 1,300-1,600 C. for a predetermined period of time on the way to a sintering step; sintering the compact at a temperature of 1,700-1,900° C. thereby to form a sintered body; and moderately cooling the sintered body at a cooling rate of at most 100° C. per hour until the temperature is reduced to a point at which a liquid phase formed by the rare earth element during the sintering step solidifies. 12. The method of manufacturing a silicon nitride ceramic substrate according to claim 11, wherein said silicon nitride powder contains at most 1.5% by weight of oxygen, at most 0.5% by weight of Al, Li, Na, K, Fe, Ba, Mn and B as impurity cationic elements in terms of total amount thereof, and 75 to 97% by weight of alpha-phase type silicon nitride, and which has an average grain size of at most 1.0 μm. 13. The method of manufacturing a silicon nitride ceramic substrate according to claim 11, wherein 0.3 to 3.0% by weight of at least one of Hf and Mg in terms of oxide thereof is added to said silicon nitride powder. 14. The method of manufacturing a silicon nitride ceramic substrate according to claim 11, wherein at most 2% by weight of at least one element selected from the group consisting of Ti, Zr, W, Mo, Ta, Nb, V and Cr in terms of oxide thereof is added to said silicon nitride powder. 15. The method of manufacturing a silicon nitride ceramic substrate according to claim 11, wherein said material mixture is molded at a molding pressure of 120 MPa or more thereby to form said compact. 16. The method of manufacturing a silicon nitride ceramic substrate according to claim 15, wherein said molding pressure is within a range of 120-200 MPa. 17. The method of manufacturing a silicon nitride ceramic substrate according to claim 11, wherein a residual carbon content in said silicon nitride sintered body after the sintering step is 500 ppm or less. . 4. The composition according to claim 1, wherein the alkoxy silane (b) is a vinyl-trimethoxy silane, γ-methacryloxypropyl trimethoxy silane, 3-glycidoxypropyl triethoxy silane or aminoethylaminopropyl trimethoxy silane. 5. A material comprising metal, ceramic, glass ceramic or glass, which has a bond layer made from applying the composition according to claim 1, to the surface of the material and hydrolyzing the at least one alcoholate (a). 6. The composition according to claim 1, further comprising a solvent (c). 7. The composition according to claim 6, wherein the solvent (c) is acetone, acetic acid ethyl ester, isopropanol or hexane. 8. A process for bonding a first material to a second material comprising: applying an anhydrous composition comprising (a) at least one alcoholate of titanium, zirconium, or hafnium and (b) at least one alkoxy silane having at least one further functional group to a first material, wherein the first material is a metal, ceramic, glass ceramic, glass, or dental metal alloy; and bonding the first material to a second material, wherein the second material is a plastic material having a matched functionality with the functionality of the at least one alkoxy silane. 9. The process according to claim 8, wherein the plastic material is acrylate plastic or methacrylate plastic. 10. The process according to claim 8, further comprising subjecting the coated first material to a heat treatment. 11. The process according to claim 10, wherein the heat treatment is carried out at a temperature of from 100° C. to 200° C. 12. The process according to claim 8, wherein the anhydrous composition further comprises a solvent. 13. The process according to claim 12, wherein the solvent is acetone, acetic acid ethyl ester, isopropanol, or hexane. 14. The process according to claim 8, wherein the alcoholate is tetrabutyl titanate, tetrapropyl titanate, tetraisopropyl titanate, or zirconium (IV) propylate. 15. The process according to claim 8, wherein the at least one further functional group of the alkoxy silane comprises a vinyl, methacryl, acryl, glycidyl, or amino group. 16. The process according to claim 8, wherein the alkoxy silane is a vinyl-trimethoxy silane, γ-methacryloxypropyl trimethoxy silane, 3-glycidoxypropyl triethoxy silane, or aminoethylaminopropyl trimethoxy silane. 17. The product produced according to the process of claim 8. 18. A process for bonding a first material to a second material comprising: applying an anhydrous composition comprising (a) at least one alcoholate of titanium, zirconium, or hafnium and (b) at least one alkoxy silane having at least one further functional group to a first material, wherein the first material is a metal, ceramic, glass ceramic, glass, or dental metal alloy; and bonding the first material to a second material using a dental adhesive, wherein the second material is a metal, ceramic, glass ceramic, glass, or dental metal alloy. 19. The process according to claim 18, further comprising subjecting the coated first material to a heat treatment. 20. The process according to claim 19, wherein the heat treatment is carried out at a temperature of from 100° C. to 200° C. 21. The process according to claim 18, wherein the anhydrous composition further comprises a solvent. 22. The process according to claim 21, wherein the solvent is acetone, acetic acid ethyl ester, isopropanol, or hexane. 23. The process according to claim 18, wherein the alcoholate is tetrabutyl titanate, tetrapropyl titanate, tetraisopropyl titanate, or zirconium (IV) propylate. 24. The process according to claim 18, wherein the at least one further functional group of the alkoxy silane comprises a vinyl, methacryl, acryl, glycidyl, or amino group. 25. The process according to claim 18, wherein the alkoxy silane is a vinyl-trimethoxy silane, γ-methacryloxypropyl trimethoxy silane, 3-glycidoxypropyl triethoxy silane, or aminoethylaminopropyl trimethoxy silane. 26. The product produc
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이 특허에 인용된 특허 (6)
Reiser Carl Anthony ; Yang Deliang ; Margiott Paul Richard, Fuel cell power supply with exhaust recycling for improved water management.
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