초록 ▼

The lead frame has a spring element, which can be compressed during the injection molding of the package by an injection mold. The resultant resilience has the effect that a contact surface of the lead is pressed against an inside wall of the injection mold. The biasing of the contact surface agains

The lead frame has a spring element, which can be compressed during the injection molding of the package by an injection mold. The resultant resilience has the effect that a contact surface of the lead is pressed against an inside wall of the injection mold. The biasing of the contact surface against the inside wall prevents polymer flash from forming on the contact surface. Also, the spring element fixes the lead during the injection operation and anchors the lead in the completed package. Hold-down pins within the injection mold are thus obviated.

대표청구항 ▼

1. A lead frame formed by injection molding in a mold having an inside wall, the lead frame comprising: an integrated circuit; an enclosure encapsulating said integrated circuit; and at least one lead formed with a contact face electrically bonded to said integrated circuit; said at least one

1. A lead frame formed by injection molding in a mold having an inside wall, the lead frame comprising: an integrated circuit; an enclosure encapsulating said integrated circuit; and at least one lead formed with a contact face electrically bonded to said integrated circuit; said at least one lead including a spring element opposing said contact face compressed during the injection molding in the injection mold, whereby said contact surface is pressed against the inside wall of the injection mold during the injection molding. 2. The lead frame according to claim 1, wherein said spring element is integrally formed at one end of said lead. 3. The lead frame according to claim 1, wherein said spring element is a hook anchoring said lead in the package after completion thereof. 4. The lead frame according to claim 3, wherein said spring element is a J-shaped element. 5. The lead frame according to claim 3, wherein said spring element has a semicircular shape. 6. The lead frame according to claim 1, wherein said spring element is at least partially zigzag-shaped. 7. The lead frame according to claim 1, wherein said spring element is disposed in vicinity of said contact surface. 8. The lead frame according to claim 1, wherein the injection mold is formed with two injection mold halves defining a given thickness of the package, and wherein said spring element projects relative to said contact surface by more than the given thickness of the package.