$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01B-011/00
출원번호 US-0996817 (1992-12-28)
발명자 / 주소
  • Tang, Wallace T. Y.
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Fish & Richardson P.C.
인용정보 피인용 횟수 : 31  인용 특허 : 25

초록

A technique and apparatus is disclosed for the optical monitoring and measurement of a thin film (or small region on a surface) undergoing thickness and other changes while it is rotating. An optical signal is routed from the monitored area through the axis of rotation and decoupled from the monitor

대표청구항

A technique and apparatus is disclosed for the optical monitoring and measurement of a thin film (or small region on a surface) undergoing thickness and other changes while it is rotating. An optical signal is routed from the monitored area through the axis of rotation and decoupled from the monitor

이 특허에 인용된 특허 (25)

  1. Sandhu Gurtej S. (Boise ID) Schultz Laurence D. (Boise ID) Doan Trung T. (Boise ID), Apparatus for endpoint detection during mechanical planarization of semiconductor wafers.
  2. Severin Petrus J. W. (Eindhoven NLX) Verspui Gerrit (Eindhoven NLX), Device having an exchangeable substrate sleeve for measuring layer thickness.
  3. Lewis Russell E. (Cupertino CA) Howard Richard E. (Pleasanton CA) Litvak Herbert E. (Cupertino CA), Endpoint and uniformity determinations in material layer processing through monitoring multiple surface regions across t.
  4. Kaanta Carter W. (Colchester VT) Leach Michael A. (Bristol VT), In situ conductivity monitoring technique for chemical/mechanical planarization endpoint detection.
  5. Miller Gabriel L. (Westfield NJ) Wagner Eric R. (South Plainfield NJ), In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection.
  6. Lustig Naftali E. (Croton-on-Hudson NY) Saenger Katherine L. (Ossining NY) Tong Ho-Ming (Yorktown Heights NY), In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing.
  7. Claypool Mark P. (Horseheads NY), Inspecting glass containers for line-over finish defects with bifurcated fiber optic bundle.
  8. Fisher Wayne G. (Allen TX), Integrated circuit planarization by mechanical polishing.
  9. Heimann Peter A. (Clifton NJ) Moran Joseph M. (Berkeley Heights NJ) Schutz Ronald J. (Warren NJ), Interferometric methods and apparatus for device fabrication.
  10. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Kaczorowski Edward M. (Santa Clara CA), Laser interferometer system and method for monitoring and controlling IC processing.
  11. Tien Zu-Jean (Poughkeepsie NY), Laser luminescence monitor for material thickness.
  12. Schultz Laurence D. (Boise ID), Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer.
  13. Kondo Noriyuki (Kyoto JPX), Method of and apparatus for measuring film thickness.
  14. Mimasaka Masahiro (Kyoto JPX), Method of detecting an end point of surface treatment.
  15. Sandhu, Gurtej S.; Schultz, Laurence D.; Doan, Trung T., Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers.
  16. Ohgami Nobutoshi (Hikone JPX) Kitagawa Masaru (Hikone JPX) Nishizawa Hisao (Inugami JPX) Saita Masakazu (Yasu JPX), Method of surface treatment.
  17. d\Auria Luigi (Paris FRX) Auvray Grard (Paris FRX) Desormiere Bernard (Paris FRX), Optical connection system for the bidirectional exchange of data between a central unit and peripheral units and an elec.
  18. Claypool Mark P. (Horseheads NY) Battersby Patrick T. (Elmira NY), Optical inspection of transparent layers.
  19. Wada Yorio (Suginami JPX) Hyakumura Kazushi (Hachiouji JPX), Optical measuring device of film thickness.
  20. Lewis Norris E. (Christiansburg VA) Miller Michael B. (Blacksburg VA), Optical slip ring assembly.
  21. Litvak Herbert E. (Cupertino CA), Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment.
  22. Yano Hiroyuki (Wappingers Falls NY) Okumura Katsuya (Poughkeepsie NY), Pad condition and polishing rate monitor using fluorescence.
  23. Millis Edwin G. (Dallas TX) Wood ; Jr. Samuel J. (Plano TX), Process for determining photoresist develop time by optical transmission.
  24. Dorsey Glenn F. (Blacksburg VA), Single channel optical slip ring.
  25. Roll Kenneth A. (Canton OH), Tristimulus colorimeter for use in the fabrication of artificial teeth.

이 특허를 인용한 특허 (31)

  1. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
  2. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
  3. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
  4. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.
  5. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.
  6. Kirby, Deborah J.; Perahia, Raviv; Nguyen, Hung; Chang, David T.; Boden, Tracy J., Dielectric high Q MEMS shell gyroscope structure.
  7. Sorenson, Logan D.; Nguyen, Hung; Perahia, Raviv; Chang, David T.; Huang, L. X. Coco; Erbland, Joshua A., FM demodulation system for quartz MEMS magnetometer.
  8. Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.
  9. Kubena, Randall L., Integrated quartz MEMS tuning fork resonator/oscillator.
  10. Kirby, Deborah Janice; Kubena, Randall Lynn, Integrated quartz biological sensor and method.
  11. Chang, David T.; Kubena, Randall L., Large area integration of quartz resonators with electronics.
  12. Kubena, Randall L., MEMS on-chip inertial navigation system with error correction.
  13. Kubena, Randall L., MEMS on-chip inertial navigation system with error correction.
  14. Kubena, Randall L.; Chang, David T., MEMS-based quartz hybrid filters and a method of making the same.
  15. Kubena, Randall L.; Chang, David T.; Kim, Jinsoo, Method for fabricating quartz-based nanoresonators.
  16. Kubena, Randall L.; Chang, David T.; Larson, Robert L., Method for producing a disk resonator gyroscope.
  17. Kubena, Randall L.; Hsu, Tsung-Yuan, Method of fabricating quartz resonators.
  18. Chang, David T.; Kubena, Randall L.; Patterson, Pamela R., Method of fabrication an ultra-thin quartz resonator.
  19. Kubena, Randall L.; Chang, David T., Method of manufacturing MEMS based quartz hybrid filters.
  20. Nguyen, Hung; Sorenson, Logan D.; Chang, David T.; Perahia, Raviv; Kirby, Deborah J.; Joyce, Richard J., Micro-scale piezoelectric resonating magnetometer.
  21. Schietinger, Charles W.; Hoang, Anh N.; Bakin, Dmitry V., Optical techniques for measuring layer thicknesses and other surface characteristics of objects such as semiconductor wafers.
  22. Nguyen, Hung; Sorenson, Logan D.; Perahia, Raviv; Chang, David T.; Erbland, Joshua A., Piezoelectric magnetometer capable of sensing a magnetic field in multiple vectors.
  23. Birang, Manoocher; Gleason, Allan, Polishing pad for in-situ endpoint detection.
  24. Kubena, Randall L.; Chang, David T.; Larson, Robert L., Quartz-based disk resonator gyro with ultra-thin conductive outer electrodes and method of making same.
  25. Kubena, Randall L.; Chang, David T.; Kim, Jinsoo, Quartz-based nanoresonator.
  26. Kubena,Randall L.; Chang,David T.; Kim,Jinsoo, Quartz-based nanoresonators and method of fabricating same.
  27. Kubena, Randall L.; Chang, David T., Resonator assembly comprising a silicon resonator and a quartz resonator.
  28. Kubena, Randall L.; Hsu, Tsung-Yuan, Resonator with a fluid cavity therein.
  29. Kubena, Randall L.; Kirby, Deborah J.; Chang, David T., Rounded and curved integrated tethers for quartz resonators.
  30. Hirokawa, Kazuto; Kobayashi, Yoichi; Nakai, Shunsuke; Ohta, Shinrou; Tsukuda, Yasuo, Substrate polishing apparatus.
  31. Chang, David T.; Hsu, Tsung-Yuan, Thermal stress resistant resonator, and a method for fabricating same.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트