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Apparatus for delivering power to high performance electronic assemblies 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-012/16
출원번호 US-0801437 (2001-03-08)
발명자 / 주소
  • Dibene, II, Joseph T.
  • Hartke, David H.
  • Derian, Edward J.
  • Hoge, Carl E.
  • Broder, James M.
  • San Andres, Jose B.
  • Riel, Joseph S.
출원인 / 주소
  • Incep Technologies, Inc.
대리인 / 주소
    Knobbe, Martens, Olson & Bear LLP
인용정보 피인용 횟수 : 61  인용 특허 : 51

초록

A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circu

대표청구항

A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circu

이 특허에 인용된 특허 (51)

  1. Hilbrink Johan O. (Cincinnati OH), Apparatus for cooling electronic devices.
  2. Taylor Billy K. (Columbia SC), Apparatus for using an active circuit board as a heat sink.
  3. Tracy Mark S. ; Nguyen Minh H ; Progl Curtis L., Apparatus, method and system for thermal management of a semiconductor device.
  4. Riley John B., Attachment assembly for integrated circuits.
  5. Kosmala Michael L. (Aliso Viejo CA), Boardlock assembly.
  6. Kawaguchi Akira (Musashimurayama JPX) Ohtsu Akihiko (Kawasaki JPX), Coaxial connector for connecting two circuit boards.
  7. Gonzales Olivier,FRX, Coaxial coupling for interconnecting two printed circuit cards.
  8. Ayers David J. ; Samaras Bill ; McCutchan Dan R., Connector scheme for a power pod power delivery system.
  9. Short W. Harry (Mesa AZ), Cooling and power and/or ground distribution system for integrated circuits.
  10. Hatada Toshio (Tsuchiura JPX) Ohashi Shigeo (Tsuchiura JPX) Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Matsushima Hitoshi (Ryugasaki JPX) Sato Motohiro (Ibaraki JPX) Inouye Hiro, Cooling apparatus of electronic device.
  11. Daikoku Takahiro (Ushiku JPX) Ashiwake Noriyuki (Tsuchiura JPX) Kawasaki Nobuo (Ibaraki JPX) Zushi Shizuo (Hadano JPX), Cooling apparatus of electronic devices.
  12. Harris Willard Stephen ; Kemink Randall Gail ; McClafferty William David ; Schmidt Roger Ray, Cooling device for hard to access non-coplanar circuit chips.
  13. Mine Shinji (Tokyo JPX) Shimonishi Terumi (Tokyo JPX), Cooling structure for heat generating electronic components mounted on a substrate.
  14. Ohashi Shingeo (Tsuchiura JPX) Nakajima Tadakatsu (Ibaraki JPX) Kuwahara Heikichi (Ibaraki JPX) Hatada Toshio (Tsuchiura JPX) Matsushima Hitoshi (Ryugasaki JPX) Sato Motohiro (Ibaraki JPX) Inouye Hir, Cooling system of electronic computer using flexible members in contact with semiconductor devices on boards.
  15. Suzuki Masahiro (Inagi) Yamamoto Haruhiko (Yokohama) Udagawa Yoshiaki (Tokyo JPX), Cooling system used with an electronic circuit device for cooling circuit components included therein having a thermally.
  16. Salmonson Richard B., Daughter card assembly.
  17. Wessely Herrmann (Munich DEX), Device for cooling a plurality of integrated modules combined on a rigid printed circuitboard to form logic cards.
  18. Shimabara Norio (Tokyo JPX) Tokumo Teruhiko (Tokyo JPX), Electronic circuit module having improved cooling arrangement.
  19. Ouchi Katsunori (Hitachi JPX) Morihara Atsushi (Katsuta JPX) Naganuma Yoshio (Hitachi JPX) Sato Koji (Hitachi JPX) Kaji Ryuichi (Kitaibaraki JPX), Electronic equipment and computer with heat pipe.
  20. Burward-Hoy Trevor, Electronic package cooling system and heat sink with heat transfer assembly.
  21. Zapach Trevor,CAX ; Jeakins William D.,CAX ; Muegge Steven,CAX, Electronic unit.
  22. Azar Kaveh, Enhanced cooling of a heat dissipating circuit element.
  23. Chu Richard C. (Poughkeepsie NY) Ellsworth ; Jr. Michael J. (Poughkeepsie NY) Goth Gary F. (Pleasant Valley NY) Simons Robert E. (Poughkeepsie NY) Zumbrunnen Michael L. (Poughkeepsie NY), Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and.
  24. Karnezos Marcos (Menlo Park CA) Kaw Ravindhar (San Jose CA) Hanlon Lawrence (Menlo Park CA) Matta Farid (Mountain View CA), Flex interconnect module.
  25. Lipschutz Lewis D. (Poughkeepsie NY), Flexible thermal conduction element for cooling semiconductor devices.
  26. Tanaka Suemi (Yokohama JPX) Sotani Junji (Yokohama JPX) Nanba Kenichi (Tokyo JPX), Heat pipe type radiation for electronic apparatus.
  27. Patel Chandrakant (Fremont CA), Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate.
  28. Nakamori Toshihiro,JPX, Heat-sinking arrangement for circuit elements.
  29. Horvath Joseph L. (Poughkeepsie NY) Biskeborn Robert G. (Pawling NY) Harvilchuck Joseph M. (Billings NY), High conduction cooling module having internal fins and compliant interfaces for VLSI chip technology.
  30. Dozier ; II Thomas H. (Carrollton TX), Land grid array package/circuit board assemblies and methods for constructing the same.
  31. Dawson ; deceased Peter F. (late of Portola Valley CA by Shirley B. Dawson ; executrix ) Leibovitz Jacques (San Jose CA) Nagesh Voddarahalli K. (Cupertino CA), Low cost, high thermal performance package for flip chips with low mechanical stress on chip.
  32. Salmonson Richard B., Method and apparatus for cooling daughter card modules.
  33. Katchmar Roman (Ottawa CAX), Methods of making printed circuit boards and heat sink structures.
  34. Fugaro Anthony Salvatore, Microelectronic packages and packaging methods including thermally and electrically conductive pad.
  35. Koenen David J. (Houston TX), Microprocessor heat dissipation apparatus for a printed circuit board.
  36. Bujalski C. Gregory ; Petsinger Jeffrey M. ; Rooney Daniel T., Multi-board electronic assembly including spacer for multiple electrical interconnections.
  37. Mok Sammy L., Multiple chip module assembly for top of mother board.
  38. Mok Sammy L. (Cupertino CA), Multiple chip module mounting assembly and computer using same.
  39. Cichocki Dean M. (Phoenix AZ) Schwartz Steven D. (Phoenix AZ), Passive cooled electronic chassis.
  40. McCutchan Dan R. ; Samaras William A. ; Ayers David J., Power pod/power delivery system.
  41. Katchmar Roman (Ottawa CAX), Printed circuit board and heat sink arrangement.
  42. Katchmar Roman,CAX, Printed circuit board and heat sink arrangement.
  43. Wade White, Printed circuit board top side mounting standoff.
  44. Katchmar Roman (Ottawa CAX), Printed circuit boards and heat sink structures.
  45. McMahon John Francis, Shared socket multi-chip module and/or piggyback pin grid array package.
  46. Hunninghaus Roy E. ; Andrews Kevin M. ; Christopher Gary L. ; Anderson David J. ; Tomase Joseph P., Solder bonded electronic module.
  47. Smith Grant M. ; Tamarkin Vladimir K., Stacked circuit board assembly adapted for heat dissipation.
  48. Till David P. (Sturbridge MA), Stand-off device.
  49. Harmon Raymond E. (Tustin CA) Poe Lloyd R. (Long Beach CA), Stand-off fastener.
  50. Cheng Chee F. (Singapore SGX) You Chiou C. (Singapore SGX) Tong Kai L. (Singapore SGX), Substrate to substrate standoff assembly.
  51. Hung-Chi Yu TW, Surface mount electrical connector with anti-wicking terminals.

이 특허를 인용한 특허 (61)

  1. Anthony,William M., Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node.
  2. Anthony,William M., Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node.
  3. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.
  4. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.
  5. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.
  6. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.
  7. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.
  8. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.
  9. Anthony, Anthony A.; Anthony, William M., Arrangement for energy conditioning.
  10. Anthony, Jr.,Anthony A.; Anthony,William M., Arrangement for energy conditioning.
  11. Anthony,Anthony A.; Anthony,William M., Arrangement for energy conditioning.
  12. Anthony,Anthony A.; Anthony,William M., Arrangement for energy conditioning.
  13. Anthony, Anthony A.; Anthony, William M., Arrangements for energy conditioning.
  14. Anthony,Anthony A., Component carrier.
  15. Anthony,Anthony; Anthony,William M., Component carrier.
  16. Anthony,Anthony; Anthony,William M., Component carrier.
  17. Anthony, William M., Conditioner with coplanar conductors.
  18. Anthony, William M., Conditioner with coplanar conductors.
  19. Johnson, Lee A; Zurn, Michael J.; Jacobson, Jon T.; Janssen, Dale A., Connector for interconnecting conductors of circuit boards.
  20. Anthony,Anthony, Connector related structures including an energy conditioner.
  21. Gilliland, Don Alan, Cyclindrical impedance matching connector standoff with optional common mode ferrite.
  22. Shing, Yuen Kim, Distribution housing.
  23. Palenzuela, Gonzalo, Easy mounting configuration for loudspeaker.
  24. Orris, David Patrick, Electrical socket assembly for electrically connecting adjacent circuit boards.
  25. Anthony,Anthony A.; Anthony,William M., Electrode arrangement for circuit energy conditioning.
  26. Anthony, David J., Energy conditioner structures.
  27. Anthony, William M., Energy conditioner with tied through electrodes.
  28. Anthony, William M., Energy conditioner with tied through electrodes.
  29. Anthony, Anthony A.; Anthony, William M., Energy conditioning circuit arrangement for integrated circuit.
  30. Anthony, Anthony A.; Anthony, William M., Energy conditioning circuit arrangement for integrated circuit.
  31. Anthony, Anthony A.; Anthony, William M., Energy conditioning circuit arrangement for integrated circuit.
  32. Anthony,Anthony A.; Anthony,William M., Energy conditioning circuit assembly.
  33. Anthony,Anthony; Anthony,William, Energy conditioning structure.
  34. Anthony,William M., Energy pathway arrangement.
  35. Anthony,William M.; Anthony,Anthony A.; Muccioli,James P., Energy pathway arrangement.
  36. Anthony,William M., Energy pathway arrangements for energy conditioning.
  37. Anthony,William M., Energy pathway arrangements for energy conditioning.
  38. Anthony, Anthony, Filter assembly.
  39. Anthony, William M.; Anthony, David; Anthony, Anthony, Internally overlapped conditioners.
  40. Anthony, William M.; Anthony, David; Anthony, Anthony, Internally overlapped conditioners.
  41. Anthony, William M.; Anthony, David; Anthony, Anthony, Internally overlapped conditioners.
  42. Anthony, David; Anthony, Anthony; Anthony, William M.; Muccioli, James; Neifeld, Richard A., Internally shielded energy conditioner.
  43. Coteus, Paul W.; Ferencz, Andrew; Hall, Shawn Anthony; Takken, Todd Edward, Low resistance, low-inductance power connectors.
  44. Anthony, Anthony A.; Anthony, William M., Manufacture including shield structure.
  45. Anthony, William M.; Anthony, David; Anthony, Anthony, Method for making internally overlapped conditioners.
  46. Rich, Mark; Statezni, Dieter; Green, Michael, Module that can be used as a plug-in module and as a solder-down module.
  47. Anthony, Anthony; Anthony, William M., Multi-functional energy conditioner.
  48. Anthony,Anthony A.; Anthony,William M., Multi-functional energy conditioner.
  49. Anthony, Jr., Anthony A.; Anthony, William M., Offset pathway arrangements for energy conditioning.
  50. Anthony,Anthony A.; Anthony,William M.; Muccioli,James P., PREDETERMINED SYMMETRICALLY BALANCED AMALGAM WITH COMPLEMENTARY PAIRED PORTIONS COMPRISING SHIELDING ELECTRODES AND SHIELDED ELECTRODES AND OTHER PREDETERMINED ELEMENT PORTIONS FOR SYMMETRICALLY BALA.
  51. Anthony, Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.
  52. Anthony,Anthony A., Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package.
  53. Anthony, Jr.,Anthony A.; Anthony,William M., Pathway arrangement.
  54. Barr,Andrew; Espinoza Ibarra,Ricard E.; Chheda,Sachin Navin, Power distribution system.
  55. Chheda,Sachin Navin; Espinoza Ibarra,Ricardo E.; Yates,Kirk, Power distribution system.
  56. Schack, Göran Walter; Fagrenius, Gustav, Shielded circuit assembly and method.
  57. Anthony,David; Anthony,Anthony; Anthony,William, Shielded energy conditioner.
  58. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
  59. Anthony, Anthony A.; Anthony, William M., Universal energy conditioning interposer with circuit architecture.
  60. Anthony,Anthony A.; Anthony,William M., Universal energy conditioning interposer with circuit architecture.
  61. Anthony,Anthony A.; Anthony,William M., Universial energy conditioning interposer with circuit architecture.
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