초록 ▼

Methods for making ceramic aggregate particles comprising forming a plurality of ceramic aggregate precursor particles from a composition by forcing the composition through at least one orifice in a substrate, at least partially curing the ceramic aggregate precursor particles, and heating the ceram

Methods for making ceramic aggregate particles comprising forming a plurality of ceramic aggregate precursor particles from a composition by forcing the composition through at least one orifice in a substrate, at least partially curing the ceramic aggregate precursor particles, and heating the ceramic aggregate precursor particles to provide ceramic aggregate particles wherein solid particulates are bonded together by ceramic binder. In another aspect, the present invention provides methods for making an abrasive article utilizing methods for making abrasive ceramic aggregate particles comprising forming a plurality of ceramic aggregate precursor particles by passing a composition through at least one orifice in a substrate, separating the abrasive ceramic aggregate precursor particles from the substrate, at least partially curing the abrasive ceramic aggregate precursor particles, heating the abrasive ceramic aggregate precursor particles to provide abrasive ceramic aggregate particles bonded together by ceramic binder, and combining at least a portion of the abrasive ceramic aggregate particles with abrasive article binder material and abrasive material, with or without another abrasive material, to provide an abrasive article.

대표청구항 ▼

Methods for making ceramic aggregate particles comprising forming a plurality of ceramic aggregate precursor particles from a composition by forcing the composition through at least one orifice in a substrate, at least partially curing the ceramic aggregate precursor particles, and heating the ceram

Methods for making ceramic aggregate particles comprising forming a plurality of ceramic aggregate precursor particles from a composition by forcing the composition through at least one orifice in a substrate, at least partially curing the ceramic aggregate precursor particles, and heating the ceramic aggregate precursor particles to provide ceramic aggregate particles wherein solid particulates are bonded together by ceramic binder. In another aspect, the present invention provides methods for making an abrasive article utilizing methods for making abrasive ceramic aggregate particles comprising forming a plurality of ceramic aggregate precursor particles by passing a composition through at least one orifice in a substrate, separating the abrasive ceramic aggregate precursor particles from the substrate, at least partially curing the abrasive ceramic aggregate precursor particles, heating the abrasive ceramic aggregate precursor particles to provide abrasive ceramic aggregate particles bonded together by ceramic binder, and combining at least a portion of the abrasive ceramic aggregate particles with abrasive article binder material and abrasive material, with or without another abrasive material, to provide an abrasive article. 9860400, Marhurkar; US-4596548, 19860600, DeVries et al.; US-4601697, 19860700, Mammolenti et al.; US-4601701, 19860700, Mueller, Jr.; US-4608993, 19860900, Albert; US-4610657, 19860900, Densow; US-4619643, 19861000, Bai; US-4623327, 19861100, Mahurkar; US-4626240, 19861200, Edelman et al.; US-4641652, 19870200, Hutterer et al.; US-4643711, 19870200, Bates; US-4643716, 19870200, Drach; US-4648865, 19870300, Aigner; US-4655771, 19870400, Wallsten; US-4661396, 19870400, Andorf et al.; US-4662404, 19870500, LeVeen et al.; US-4666426, 19870500, Aigner; US-4671795, 19870600, Mulchin; US-4675004, 19870600, Hadford et al.; US-4682978, 19870700, Martin; US-4687471, 19870800, Twardowski et al.; US-4692141, 19870900, Marhurkar; US-4694838, 19870900, Wijayarthna et al.; US-4713049, 19871200, Carter; US-4722725, 19880200, Sawyer et al.; US-4732152, 19880300, Wallsten et al.; US-4737146, 19880400, Amaki et al.; US-4738667, 19880400, Galloway; US-4739768, 19880400, Engelson; US-4747840, 19880500, Ladika et al.; US-4753640, 19880600, Nichols et al.; US-4755176, 19880700, Patel; US-4769005, 19880900, Ginsburg et al.; US-4770652, 19880900, Marhurkar; US-4772268, 19880900, Bates; US-4773432, 19880900, Rydell; US-4775371, 19881000, Mueller, Jr.; US-4776841, 19881000, Catalano; US-4787884, 19881100, Goldberg; US-4790809, 19881200, Kuntz; US-4790810, 19881200, Pugh, Jr. et al.; US-4795439, 19890100, Guest; US-4808155, 19890200, Marhurkar; US-4809710, 19890300, Williamson; US-4813429, 19890300, Eshel et al.; US-4813925, 19890300, Anderson, Jr. et al.; US-4820262, 19890400, Finney; US-4822345, 19890400, Danforth; US-4838881, 19890600, Bennett; US-4842582, 19890600, Marhurkar; US-4842590, 19890600, Tanabe et al.; US-4846791, 19890700, Hattler et al.; US-4846814, 19890700, Ruiz; US-4863442, 19890900, DeMello et al.; US-4874360, 19891000, Goldberg et al.; US-4887996, 19891200, Bengmark; US-4888146, 19891200, Dandeneau; US-4894057, 19900100, Howes; US-4895561, 19900100, Marhurkar; US-4913683, 19900400, Gregory; US-4931037, 19900600, Wetterman; US-4950228, 19900800, Knapp, Jr. et al.; US-4954126, 19900900, Wallsten; US-4960409, 19901000, Catalano; US-4960411, 19901000, Buchbinder; US-4961809, 19901000, Martin; US-4963129, 19901000, Rusch; US-4973301, 19901100, Nissenkorn; US-4976690, 19901200, Solar et al.; US-4978341, 19901200, Niederhauser; US-4981482, 19910100, Ichikawa; US-4985022, 19910100, Fearnot et al.; US-4986814, 19910100, Burney et al.; US-4990133, 19910200, Solazzo; US-4994071, 19910200, MacGregor; US-4995863, 19910200, Nichols et al.; US-4995865, 19910200, Gahara et al.; US-4995868, 19910200, Brazier; US-4998919, 19910300, Schnepp-Pesch et al.; US-5004456, 19910400, Botterbusch et al.; US-5009636, 19910400, Wortley et al.; US-5013296, 19910500, Buckberg et al.; US-5019102, 19910500, Hoene; US-5026377, 19910600, Burton et al.; US-5029580, 19910700, Radford et al.; US-5041083, 19910800, Tsuchida et al.; US-5053004, 19911000, Markel et al.; US-5053023, 19911000, Martin; US-5057073, 19911000, Martin; US-5061275, 19911000, Wallsten et al.; US-5078720, 19920100, Burton et al.; US-5085629, 19920200, Goldberg et al.; US-5116309, 19920500, Coll; US-5124127, 19920600, Jones et al.; US-5129910, 19920700, Phan et al.; US-5135487, 19920800, Morrill et al.; US-5135599, 19920800, Martin et al.; US-5141502, 19920800, Macaluso, Jr.; US-5147370, 19920900, McNamara et al.; US-5149330, 19920900, Brightbill; US-5156592, 19921000, Martin et al.; US-5156596, 19921000, Balbierz et al.; US-5156857, 19921000, Wang et al.; US-5160325, 19921100, Nichols et al.; US-5167623, 19921200, Cianci et al.; US-5171216, 19921200, Dasse et al.; US-5176625, 19930100, Brisson; US-5176626, 19930100, Soehendra; US-5178803, 19930100, Tsuchida et al.; US-5188593, 19930200, Martin; US-5190520, 19930300, Fenton, Jr. et al.; US-5195962, 19930300, Martin et al.; US-5197951, 19930300, Marhurkar; US-5207648, 19930500, Gross; US-5209723, 19930500, Twardowski et al.; US-5211627, 19930500, Willi