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An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-ch

An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit.

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An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-ch

An electronic apparatus including a motherboard, a plurality of multi-chip modules mounted to the motherboard and cooling members for cooling the multi-chip modules. A refrigeration unit is arranged to deliver cooling water to the cooling members. A connection structure is provided for each multi-chip module for thermally and mechanically releasably coupling each multi-chip module to the refrigeration unit. S-5055058, 19911000, Nagasaka et al.; US-5451823, 19950900, Deverall et al.; US-5453901, 19950900, Lackey; US-5659212, 19970800, Depetris, 310/068.D; US-5729063, 19980300, Adachi et al., 310/068.D; US-5955805, 19990900, Chaudoreille et al.; US-5991184, 19991100, Russell et al., 363/145; US-6121699, 20000900, Kashihara et al.; US-6135828, 20001000, Lalange et al.; US-6327128, 20011200, De Petris; US-20020042218, 20020400, De Petris