Electromechanical device and a process of preparing same
원문보기
IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0971515
(2001-07-26)
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발명자
/ 주소 |
- Cotte, John Michael
- McCullough, Kenneth John
- Moreau, Wayne Martin
- Simons, John P.
- Taft, Charles J.
- Volant, Richard P.
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출원인 / 주소 |
- International Business Machines Corporation
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대리인 / 주소 |
Scully, Scott, Murphy, Presser
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인용정보 |
피인용 횟수 :
9 인용 특허 :
6 |
초록
▼
An electromechanical device having a size no larger than about 10 microns utilizing a working fluid in the high pressure liquid or supercritical fluid state. A process of preparing the electromechanical device involves the introduction of the liquid or supercritical fluid therein which permits the r
An electromechanical device having a size no larger than about 10 microns utilizing a working fluid in the high pressure liquid or supercritical fluid state. A process of preparing the electromechanical device involves the introduction of the liquid or supercritical fluid therein which permits the retention of the working fluid in the liquid or supercritical state after introduction.
대표청구항
▼
1. A process of making an electromechanical device utilizing a working fluid comprising the steps of: introducing a high pressure liquid or supercritical fluid into an electromechanical device utilizing or working fluid having a size no greater than about 10 microns from a source of said liquid o
1. A process of making an electromechanical device utilizing a working fluid comprising the steps of: introducing a high pressure liquid or supercritical fluid into an electromechanical device utilizing or working fluid having a size no greater than about 10 microns from a source of said liquid or supercritical fluid under thermodynamic conditions consistent with the maintenance of said fluid in the liquid or supercritical state; stopping said introduction of said liquid or supercritical fluid when the pressure of said fluid in said electromechanical device equals the pressure of said liquid or supercritical fluid source; closing, concurrently with said fluid introduction stoppage, said ingress and egress into said electromechanical device; and adjusting said thermodynamic conditions to ambient wherein said working fluid in said electromechanical device is retained in the high pressure liquid or supercritical state. 2. A process in accordance with claim 1 wherein said pressure of said liquid or supercritical fluid source is in the range of between about 1,000 psi and about 8,000 psi. 3. A process in accordance with claim 2 wherein said liquid or supercritical fluid is selected from the group consisting of carbon dioxide, neon, nitrogen, argon, xenon, sulfur hexafluoride and propane. 4. A process in accordance with claim 2 wherein said pressure of said liquid or supercritical fluid is in the range of between about 2,000 psi and about 5,000 psi. 5. A process in accordance with claim 4 wherein said liquid or supercritical fluid is selected from the group consisting of carbon dioxide, neon, nitrogen, argon, xenon, sulfur hexafluoride, propane and ammonia. 6. A process in accordance with claim 4 wherein said pressure of said liquid or supercritical fluid is about 3,000 psi. 7. A process in accordance with claim 6 wherein said liquid or supercritical fluid is carbon dioxide. 8. A microelectromechanical device comprising an electromechanical device utilizing a working fluid, said device being no larger than about 10 microns, said working fluid being a high pressure liquid or supercritical fluid. 9. A device in accordance with claim 8 wherein said device is no larger that about 1 micron. 10. A device in accordance with claim 8 wherein said liquid or supercritical fluid is selected from the group consisting of carbon dioxide, neon, nitrogen, argon, xenon, sulfur hexafluoride, propane and ammonia. 11. A device in accordance with claim 10 wherein said liquid or supercritical fluid is selected from the group consisting of carbon dioxide, neon, nitrogen, argon, xenon, sulfur hexafluoride and propane. 12. A device in accordance with claim 11 wherein said liquid or supercritical fluid is at a pressure in the range of between about 1,000 psi and about 8,000 psi. 13. A device in accordance with claim 10 wherein said liquid or supercritical fluid is at a pressure in the range of between about 2,000 psi and about 5,000 psi. 14. A device in accordance with claim 13 wherein said liquid or supercritical fluid is at a pressure in the range of about 3,000 psi. 15. A device in accordance with claim 12 wherein said liquid or supercritical fluid is carbon dioxide. 16. A device in accordance with claim 8 wherein said microelectromechanical device is a heat exchanger, a closed loop pumping apparatus or a closed loop hydraulic system.
이 특허에 인용된 특허 (6)
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Jafar Darabi ; Michael M. Ohadi, Electrohydrodynamicly enhanced micro cooling system for integrated circuits.
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Forster Fred K. ; Bardell Ron L. ; Sharma Nigel R., Method for making micropumps.
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Tani Michihiko,JPX ; Masaki Yasufumi,JPX, Method of measuring a pressure of a pressurized fluid fed through a diaphragm pump and accumulated in a vessel, and miniature pump system effecting the measurement.
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Tsai Ming-Jye,TWX ; Tsai Tsung-Han,TWX ; Jang Ruei-Hung,TWX, Micro cooling engine array system.
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Matthew E. Moran, Micro-scalable thermal control device.
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Bonne Ulrich (Hopkins MN) Ohnstein Thomas R. (Roseville MN), Microstructure gas valve control.
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Littrup,Peter J.; Babkin,Alexei V.; Duncan,Robert; Boldarev,Sergey, Cryotherapy system.
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Colburn, Matthew E.; Shneyder, Dmitriy; Siddiqui, Shahab, Development or removal of block copolymer or PMMA-b-S-based resist using polar supercritical solvent.
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Colburn,Matthew E.; Shneyder,Dmitriy; Siddiqui,Shahab, Development or removal of block copolymer or PMMA-b-S-based resist using polar supercritical solvent.
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Littrup, Peter J.; Babkin, Alexei V.; Duncan, Robert; Boldarev, Sergey, Methods and systems for cryogenic cooling.
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Littrup,Peter J.; Babkin,Alexei V.; Duncan,Robert; Boldarev,Sergey, Methods and systems for cryogenic cooling.
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