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Separable power delivery connector 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-012/00
출원번호 US-0132586 (2002-04-25)
발명자 / 주소
  • Derian, Edward J.
  • DiBene, II, Joseph Ted
  • Hartke, David H.
출원인 / 주소
  • Incep Technologies, Inc.
대리인 / 주소
    Knobbe Martens Olson & Bear LLP
인용정보 피인용 횟수 : 16  인용 특허 : 104

초록

A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the fi

대표청구항

A connector for providing power from a first circuit board to a second circuit board. The apparatus comprises a first conductive member, including a first conductive member first end and a first conductive member second end distal from the first end; a second conductive member disposed within the fi

이 특허에 인용된 특허 (104)

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이 특허를 인용한 특허 (16)

  1. Lecsek, Robert Leslie; Payne, Shawn Robert, Coaxial heat sink connector.
  2. Johnson, Lee A; Zurn, Michael J.; Jacobson, Jon T.; Janssen, Dale A., Connector for interconnecting conductors of circuit boards.
  3. Gilliland, Don Alan, Cyclindrical impedance matching connector standoff with optional common mode ferrite.
  4. Chrysler, Gregory M.; Maveety, James G., Die having a via filled with a heat-dissipating material.
  5. Aimoto, Daiki, Electrical connector assembly.
  6. Kim, Dong Wook; Song, Young Kyu; Hwang, Kyu-Pyung; We, Hong Bok, Integrated device comprising coaxial interconnect.
  7. Rubenstein,Brandon Aaron; Youngman,William, Interconnect system having housing assembly with pin receptor.
  8. Coteus, Paul W.; Ferencz, Andrew; Hall, Shawn Anthony; Takken, Todd Edward, Low resistance, low-inductance power connectors.
  9. Coteus, Paul W.; Ferencz, Andrew; Hall, Shawn Anthony; Takken, Todd Edward, Low resistance, low-inductance power connectors.
  10. Chrysler, Gregory M.; Maveety, James G., Micro-chimney and thermosiphon die-level cooling.
  11. Harris,Shaun L.; Belson,Steven A.; Peterson,Eric C.; Williams,Gary W.; Belady,Christian L., Multi-chip module with stacked redundant power.
  12. Ho, Yi-Tse, Power connection apparatus assembly and power connection apparatus.
  13. Barr,Andrew; Espinoza Ibarra,Ricard E.; Chheda,Sachin Navin, Power distribution system.
  14. Chheda,Sachin Navin; Espinoza Ibarra,Ricardo E.; Yates,Kirk, Power distribution system.
  15. Borghoff, Georg, Power semiconductor module and power semiconductor module system.
  16. Harris,Shaun L.; Belson,Steven A.; Peterson,Eric C.; Williams,Gary W.; Belady,Christian L.; Christenson,Jeffrey P., Redundant power for processor circuit board.
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