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특허 상세정보

Process for MSG-soldering and use of a shielding gas

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B23K-035/38    B23K-001/00   
미국특허분류(USC) 219/129; 228/219
출원번호 US-0697595 (2000-10-27)
우선권정보 DE-0052043 (1999-10-28)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Millen, White, Zelano & Branigan, P.C.
인용정보 피인용 횟수 : 4  인용 특허 : 11
초록

The invention relates to MSG-soldering (metal shielding gas-soldering) of metallic materials with use of soldering and an electric arc with consumable electrode or non-consumable electrode, whereby a shielding gas that essentially consists of inert gas is used. According to the invention, the shielding gas contains at least one active gas component in addition to the inert gas. As active gases, oxygen and/or carbon dioxide can be used. The proportion of active gas in the shielding gas is preferably in the range of 0.01 to 0.5% by volume.

대표
청구항

1. A process for MSG-brazing of metallic materials with use of brazing materials and an electric arc, comprising using a consumable electrode in a shielding gas containing at least one inert gas component and containing at least one active gas component in a range of 0.01 to 0.5% by volume of the shielding gas. 2. A process according to claim 1, wherein the at least one active gas component consists of an active gas selected from the group consisting of oxygen, carbon dioxide and a component mixture of oxygen and carbon dioxide. 3. A process according to...

이 특허에 인용된 특허 (11)

  1. Offer Henry Peter. Apparatus for joining metal components using broad, thin filler nozzle. USP1998085793009.
  2. Mori Yoshiaki,JPX ; Miyakawa Takuya,JPX ; Asano Yasuhiko,JPX ; Kurashina Osamu,JPX ; Miyamori Satoshi,JPX ; Kurashima Yohei,JPX ; Anan Makoto,JPX. Method and apparatus for bonding using brazing material. USP2000126158648.
  3. Mori Yoshiaki,JPX ; Miyakawa Takuya,JPX ; Asano Yasuhiko,JPX ; Kurashina Osamu,JPX ; Miyamori Satoshi,JPX ; Kurashima Yohei,JPX ; Anan Makoto,JPX. Method and apparatus for bonding using brazing material. USP1998045735451.
  4. Takuya Miyakawa,JPX ; Yoshiaki Mori,JPX ; Yohei Kurashima,JPX ; Makoto Anan,JPX. Method and apparatus for bonding using brazing material. USP2000086100496.
  5. Takuya Miyakawa,JPX ; Yoshiaki Mori,JPX ; Yohei Kurashima,JPX ; Makoto Anan,JPX. Method and apparatus for bonding using brazing material at approximately atmospheric pressure. USP1998115831238.
  6. Vojta Erich (Hemhofen DEX) Hendel Horst (Berlin DEX). Method and apparatus for soldering a coil winding wire to a terminal pin. USP1996035497936.
  7. Dittmann Michael,DEX ; Vojta Erich,DEX. Method and device for contacting the winding wire of a coil. USP1999065908568.
  8. Lindstrom Johan,SEX. Method for plasma brazing. USP2001036198068.
  9. Blad Per A. (Stockholm SEX) Johansson Rolf (Åkersberga SEX). Method of attaching a connection piece to a metal surface by brazing. USP1987124716272.
  10. Hodozuka Yasuo (Oura-Machi JPX) Iida Tadashi (Menuma-Machi JPX) Yamaga Yoshikazu (Ojima-Machi JPX) Ueda Satoshi (Oota JPX) Imaizumi Yasuo (Oota JPX). Structure for joining plate elements. USP1997075645364.
  11. Hodozuka Yasuo (Oura JPX) Iida Tadashi (Menuma JPX) Yamaga Yoshikazu (Ojima JPX) Ueda Satoshi (Oota JPX) Imaizumi Yasuo (Oota JPX). Structure for joining plate elements and method for joining the same. USP1995125476210.