Process for MSG-soldering and use of a shielding gas
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B23K-035/38
B23K-001/00
출원번호
US-0697595
(2000-10-27)
우선권정보
DE-0052043 (1999-10-28)
발명자
/ 주소
Tischler, Friedrich
출원인 / 주소
Linde Aktiengesellschaft
대리인 / 주소
Millen, White, Zelano & Branigan, P.C.
인용정보
피인용 횟수 :
4인용 특허 :
11
초록▼
The invention relates to MSG-soldering (metal shielding gas-soldering) of metallic materials with use of soldering and an electric arc with consumable electrode or non-consumable electrode, whereby a shielding gas that essentially consists of inert gas is used. According to the invention, the shield
The invention relates to MSG-soldering (metal shielding gas-soldering) of metallic materials with use of soldering and an electric arc with consumable electrode or non-consumable electrode, whereby a shielding gas that essentially consists of inert gas is used. According to the invention, the shielding gas contains at least one active gas component in addition to the inert gas. As active gases, oxygen and/or carbon dioxide can be used. The proportion of active gas in the shielding gas is preferably in the range of 0.01 to 0.5% by volume.
대표청구항▼
1. A process for MSG-brazing of metallic materials with use of brazing materials and an electric arc, comprising using a consumable electrode in a shielding gas containing at least one inert gas component and containing at least one active gas component in a range of 0.01 to 0.5% by volume of the sh
1. A process for MSG-brazing of metallic materials with use of brazing materials and an electric arc, comprising using a consumable electrode in a shielding gas containing at least one inert gas component and containing at least one active gas component in a range of 0.01 to 0.5% by volume of the shielding gas. 2. A process according to claim 1, wherein the at least one active gas component consists of an active gas selected from the group consisting of oxygen, carbon dioxide and a component mixture of oxygen and carbon dioxide. 3. A process according to claim 2, wherein the shielding gas has a proportion of active gas in a range of 0.01 to 0.5% by volume. 4. A process according to claim 3, wherein the shielding gas contains argon and 0 to 50% by volume helium. 5. A process according to claim 4, wherein the metallic brazing material is selected from the group consisting of copper (Cu) and aluminum-bronzes (Al Bz). 6. A process according to claim 5, wherein the metallic materials are selected from the group consisting of unalloyed, low-alloy and high-alloy steel, CrNi steel, copper and Cu-containing materials. 7. A process according to claim 2, wherein the shielding gas has a proportion of active gas in the range of 0.01 to 0.2% by volume. 8. A process according to claim 7, wherein the shielding gas contains argon and 0 to 50% by volume helium. 9. A process according to claim 8, wherein the soldering material contains copper (Cu) and aluminum-bronzes (Al Bz). 10. A process according to claim 9, wherein the metallic materials are selected from the group consisting of unalloyed, low-alloy and high-alloy steel, CrNi steel, copper and Cu-containing materials. 11. A process according to claim 2, wherein the shielding gas has a proportion of active gas in a range of 0.02 to 0.1% by volume. 12. A process according to claim 11, wherein the shielding gas contains argon and 0 to 50% by volume helium. 13. A process according to claim 12, wherein the brazing material contains copper (Cu) and aluminum-bronzes (Al Bz). 14. A process according to claim 13, wherein the metallic materials are selected from the group consisting of unalloyed, low-alloy and high-alloy steel, CrNi steel, copper and Cu-containing materials. 15. A process according to claim 2, wherein the shielding gas has a proportion of active gas in a range of 0.01 to 0.2% by volume. 16. A process according to claim 2, wherein the shielding gas has a proportion of active gas in a range of 0.02 to 0.2% by volume. 17. A process according to claim 1 wherein the shielding gas has a proportion of active gas in a range of 0.01 to 0.5% by volume. 18. A process according to claim 1 wherein the shielding gas contains argon and helium, the helium percentage being in the range of 10 to 40% by volume. 19. A process according to claim 1, wherein short arcs, pulsed arcs or spray arcs are used as arc types for MSG-brazing with a consumable electrode. 20. A process comprising use of a shielding gas that contains one or more inert gas components for MSG-brazing of metallic materials with use of brazing materials and an electric arc with a consumable electrode, wherein the shielding gas contains at least one active gas component in a range of 0.01 to 0.5% by volume of the shielding gas. 21. A process comprising use of a shielding gas according to claim 20, wherein the shielding gas contains oxygen, carbon dioxide or a mixture of oxygen and carbon dioxide as the active gas. 22. A process comprising use of a shielding gas according to claim 20, wherein the shielding gas has a proportion of active gas in a range of 0.01 to 0.5% by volume. 23. A process comprising use of a shielding gas according to claim 22, wherein the shielding gas contains argon and 0 to 50% by volume of helium. 24. A process comprising use of a shielding gas according to. claim 19 wherein the shielding gas contains argon and 0 to 50% by volume of helium.
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이 특허에 인용된 특허 (11)
Offer Henry Peter, Apparatus for joining metal components using broad, thin filler nozzle.
Takuya Miyakawa,JPX ; Yoshiaki Mori,JPX ; Yohei Kurashima,JPX ; Makoto Anan,JPX, Method and apparatus for bonding using brazing material at approximately atmospheric pressure.
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