초록 ▼

A load management system includes a load management control center, at least one power management termination system, a plurality of power line nodes, and a plurality of load management devices. This system is operable so that the load management control center may independently, or as a group, cont

A load management system includes a load management control center, at least one power management termination system, a plurality of power line nodes, and a plurality of load management devices. This system is operable so that the load management control center may independently, or as a group, control each of the load management devices. According to one aspect of the present invention, the load management control center accesses the load management devices across a communication network that includes a power line network. The load management devices may be addressed individually. Alternately, the load management devices may be addressed as a group or set of groups by the load management control center during load shedding operations. Load management devices may include meters that are communicatively coupled to the load management control center.

대표청구항 ▼

A load management system includes a load management control center, at least one power management termination system, a plurality of power line nodes, and a plurality of load management devices. This system is operable so that the load management control center may independently, or as a group, cont

A load management system includes a load management control center, at least one power management termination system, a plurality of power line nodes, and a plurality of load management devices. This system is operable so that the load management control center may independently, or as a group, control each of the load management devices. According to one aspect of the present invention, the load management control center accesses the load management devices across a communication network that includes a power line network. The load management devices may be addressed individually. Alternately, the load management devices may be addressed as a group or set of groups by the load management control center during load shedding operations. Load management devices may include meters that are communicatively coupled to the load management control center. board having at least a surface insulated and with a plurality of conductive patterns; a small signal type semiconductor element electrically connected to said conductive pattern; a large signal type semiconductor element electrically connected to said conductive pattern; Au-metal wires to couple directly electrodes of said small signal type semiconductor element to said conductive patterns, and Al-metal wires to couple directly electrodes of said large signal type semiconductor element to at least one of said conductive patterns, at least a part of said Au wires having a diameter different form at least a part of said Al wires; a semiconductor device having a plurality of conductive paths electrically separated by wenches, a small signal type semiconductor element fixed on said conductive path, and an Au wire coupling said small signal type semiconductor element to said conductive path; and an insulating resin coating said semiconductor element and the Au-metal wire coupled thereto and filling in said trenches between said conductive patterns to integrally support the semiconductor device, with a back face of said conductive paths exposed, wherein said semiconductor device is mounted on the mounting board to couple the exposed conductive paths to the conductive patterns. 11. A hybrid integrated circuit device comprising: a mounting board having at least an insulated surface and with a plurality of conductive patterns; a small signal type semiconductor element electrically connected to said conductive pattern; a large signal type semiconductor element electrically connected to said conductive pattern; Au-metal wires to couple directly electrodes of said small signal type semiconductor hat element to at least one of the conductive patterns, and Al-metal wires to couple directly electrodes of said large signal type semiconductor element to at least one of the conductive patterns, at least a part of said Au wires having a diameter different form at least a part of said Al wires; a semiconductor device having a plurality of conductive paths electrically separated by trenches, a large signal type semiconductor element fixed on said conductive path, an Al wire coupling said large signal type semiconductor element to said conductive pat; and an insulating resin coating said large signal type semiconductor element and the Al wire coupled thereto and filling in said trenches between said conductive paths to integrally support the semiconductor device, with a back face of said conductive parts exposed, wherein said semiconductor device is mounted on the mounting board to couple the exposed conductive pats to the conductive patterns. 12. A hybrid integrated circuit device comprising: a mounting board having at least an insulated surface and with a plurality of conductive patterns; a small signal type semiconductor element electrically connected to said conductive pattern; a large signal type semiconductor element electrically connected to said conductive pattern; a small diameter fine metal wire to couple directly at least a bonding electrode of said small signal type semiconductor element to said conductive pattern; a large diameter fine metal