초록 ▼

A heat sink provides efficient heat transfer from a heat-producing semiconductor device. Heat pipes project from a spreader plate in contact with the device and distribute heat to multiple cooling fins. The fins are arranged for maximum contact with the ambient air. An active fan is internally dispo

A heat sink provides efficient heat transfer from a heat-producing semiconductor device. Heat pipes project from a spreader plate in contact with the device and distribute heat to multiple cooling fins. The fins are arranged for maximum contact with the ambient air. An active fan is internally disposed within the fins, for further cooling efficiency. The heat sink may be permanently affixed to a printed circuit board holding the semiconductor device or the heat sink may be attached and released thereto without need of tools. A base plate maintains spring-like compliance of the printed circuit board while allowing sufficient clamping force on the heat sink to sustain thermal contact with the heat-producing surface during shock-loading.

대표청구항 ▼

A heat sink provides efficient heat transfer from a heat-producing semiconductor device. Heat pipes project from a spreader plate in contact with the device and distribute heat to multiple cooling fins. The fins are arranged for maximum contact with the ambient air. An active fan is internally dispo

A heat sink provides efficient heat transfer from a heat-producing semiconductor device. Heat pipes project from a spreader plate in contact with the device and distribute heat to multiple cooling fins. The fins are arranged for maximum contact with the ambient air. An active fan is internally disposed within the fins, for further cooling efficiency. The heat sink may be permanently affixed to a printed circuit board holding the semiconductor device or the heat sink may be attached and released thereto without need of tools. A base plate maintains spring-like compliance of the printed circuit board while allowing sufficient clamping force on the heat sink to sustain thermal contact with the heat-producing surface during shock-loading. said cartridge from said cartridge insertion slot, to continue to engage said tang and urge said tang against said first information device, until said connector of said first information device has become fully disengaged from said internal electrical connector of said host computer unit. 22. A method for removably coupling an information device with an internal electrical connector of a host computer unit, said method comprising the steps of: (a) installing said information device on a cartridge that supports said information device for removable electrical and mechanical engagement with said internal electrical connector of said host computer unit, and provides electrical access to said information device; and (b) inserting said cartridge upon which