초록

An apparatus, comprising: a plurality of stacked computer components comprising; a vapor chamber, and a centerpoint force, wherein the centerpoint force is applied to the vapor chamber.

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1. An apparatus, comprising: a stack of computer components, comprising: a heat pipe, a spreader plate, and a die, the stack of computer components coupled together by a bracket which provides a uniform clamping pressure of a single point force. 2. The apparatus of claim 1, wherein a therm

1. An apparatus, comprising: a stack of computer components, comprising: a heat pipe, a spreader plate, and a die, the stack of computer components coupled together by a bracket which provides a uniform clamping pressure of a single point force. 2. The apparatus of claim 1, wherein a thermal interface material is positioned between the spreader plate and the die. 3. The apparatus of claim 2, wherein the thermal interface material has a thickness of 0.13 mm. 4. The apparatus of claim 2, wherein the thermal interface material is a phase change thermal interface material. 5. The apparatus of claim 1 further comprising: a backplate; wherein the a bracket is connected to the backplate the bracket including a depressed centerpoint to provide the single point force and to hold the stack of computer components together between the backplate and the bracket via the single point force. 6. An apparatus comprising; a vapor chamber; a back plate; and a spring clip connected to the backplate, the spring clip including a single depressed centerpoint to provide a single point force directly to the vapor chamber and to provide a uniform clamping force to hold the vapor chamber between the backplate and the spring clip via the single point force. 7. The apparatus of claim 6, further comprising: a thermal interface material thermally coupled beneath the vapor chamber; a die thermally coupled beneath the thermal Interface material; and a substrate coupled beneath the die, wherein both the spring clip and the back plate hold the vapor chamber, the thermal interface material, the die, and the substrate together with a uniform clamping pressure as applied by the single point force. 8. The apparatus of claim 7, wherein the vapor chamber has opposing ends with one end contacting the depressed center point and wherein a support structure supports a second end of the vapor chamber. 9. The apparatus of claim 8, wherein the support structure includes foam blocks above and beneath the second end of the vapor chamber, the foam blocks held stationary by standoff tubes connected to top and bottom brackets. 10. The apparatus of claim 6, wherein the spring clip is made of spring steel and has a spider-like shaped body having four legs that connect at a central intersection with the depressed centerpoint positioned in the center of the central intersection. 11. The apparatus of claim 6, wherein the single depressed centerpoint includes a dimple that, in connection with a spring response of the spring clip, provides the single point force directly to one point on the vapor chamber. 12. An apparatus, comprising: a spring clip having a body with at least two legs including a single depressed centerpoint between said two legs to provide a single point force to a vapor chamber to hold the vapor chamber in place with a uniform clamping pressure. 13. The apparatus of claim 12, wherein the spring clip is made of spring steel and has a spider-like shaped body having four legs that connect at a central intersection with the depressed centerpoint positioned in the center of the central intersection. 14. The apparatus of claim 13, wherein the spring clip is approximately 70 mm square with each leg having a width of approximately 8 mm. 15. The apparatus of claim 13, wherein each leg is bent at a right angle to form a foot, wherein each foot is to be connected to a printed circuit board. 16. The apparatus of claim 12, wherein the spring clip is formed from 1.5 mm thick spring steel sheet stock. 17. The apparatus of claim 12, wherein the single depressed centerpoint includes a dimple that, in connection with a spring response of the spring clip, is to provide the single point force directly to one point on the vapor chamber. 18. The apparatus of claim 17, wherein the dimple has a radius approximately in the range of 1 mm to 12 mm.