$\require{mediawiki-texvc}$
  • 검색어에 아래의 연산자를 사용하시면 더 정확한 검색결과를 얻을 수 있습니다.
  • 검색연산자
검색연산자 기능 검색시 예
() 우선순위가 가장 높은 연산자 예1) (나노 (기계 | machine))
공백 두 개의 검색어(식)을 모두 포함하고 있는 문서 검색 예1) (나노 기계)
예2) 나노 장영실
| 두 개의 검색어(식) 중 하나 이상 포함하고 있는 문서 검색 예1) (줄기세포 | 면역)
예2) 줄기세포 | 장영실
! NOT 이후에 있는 검색어가 포함된 문서는 제외 예1) (황금 !백금)
예2) !image
* 검색어의 *란에 0개 이상의 임의의 문자가 포함된 문서 검색 예) semi*
"" 따옴표 내의 구문과 완전히 일치하는 문서만 검색 예) "Transform and Quantization"

특허 상세정보

Power converter enclosure

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-007/20   
미국특허분류(USC) 361/700; 165/104.33; 257/715
출원번호 US-0188089 (2002-07-03)
우선권정보 FR-0009007 (2001-07-06)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Sughrue Mion, PLLC
인용정보 피인용 횟수 : 17  인용 특허 : 7
초록

A power converter enclosure, intended in particular to equip a rail vehicle traction system including power electronic modules comprising one or more power semiconductor components mounted on a substrate, includes a base including a bottom panel with double walls having an inside wall on the side toward the interior of the enclosure in contact with at least one substrate supporting a power component. The bottom panel is extended by at least two lateral panels with double walls whose outside walls are cooled by cooling fins. The two walls of the bottom pa...

대표
청구항

1. A power converter enclosure, intended in particular to equip a rail vehicle traction system including power electronic modules comprising one or more power semiconductor components mounted on a substrate, which enclosure includes a base including a bottom panel with double walls having an inside wall on the side toward the interior of said enclosure in contact with at least one substrate supporting a power component, said bottom panel being extended by at least two lateral panels with double walls whose outside walls are cooled by cooling fins, and in...

이 특허를 인용한 특허 피인용횟수: 17

  1. Osakabe, Hiroyuki. Boiling cooler for cooling heating element by heat transfer with boiling. USP2004106808015.
  2. Ghosh, Debashis; Bhatti, Mohinder Singh; Reyzin, Ilya. Compact thermosiphon for dissipating heat generated by electronic components. USP2005016840311.
  3. Tanaka, Toshiyuki; Hata, Yukihiko. Cooling apparatus for electronic apparatus. USP2005106958910.
  4. Saito,Tomonori. Cooling system and projection-type image display apparatus using the same. USP2007107275833.
  5. Tanaka,Makoto. Electronic apparatus. USP2007017170750.
  6. Hata,Yukihiko; Tomioka,Kentaro; Tanimoto,Mitsuyoshi; Kusaka,Hiroyuki. Electronic apparatus having a heat-radiating unit for radiating heat of heat-generating components. USP2007097273089.
  7. Tsuji,Hiroyuki. Electronic apparatus with air cooling unit. USP2007047203062.
  8. Luo, Chin-Kuang. Heat dissipating device. USP2005076913072.
  9. MacDonald, Mark; Nishi, Yoshifumi. Heat exchanger assembly for electronic device. USP2015079081554.
  10. Hata, Yukihiko; Tomioka, Kentaro. Heat-Receiving apparatus and electronic equipment. USP2009067548425.
  11. Hata,Yukihiko; Tomioka,Kentaro. Heat-receiving apparatus and electronic equipment. USP2007117301771.
  12. Tracy, Mark S.; Ashcraft, Britt C.; Lev, Jeffrey A.; Walker, Paul N.. Laptop computer user thermal isolation apparatus. USP2013098526179.
  13. Garrett, Gerald Bruce. Liquid storage and cooling computer case. USP2012088240359.
  14. West, Richard Travis. Power converter with linear distribution of heat sources. USP2012108295049.
  15. Tomioka,Kentaro; Hata,Yukihiko. Pump and electronic device having the pump. USP2007107280357.
  16. Hata,Yukihiko; Tomioka,Kentaro. Pump, electronic apparatus, and cooling system. USP2007057215546.
  17. Derksen, James. System and method for improved motor controller. USP2005056891725.