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A heat sink structure increasing the dielectric strength of isolation for power integrated circuits is formed from a common layer on which laterally spaced isolated layers for each individual integrated circuit are mounted. At least the isolated layers are formed of anodized aluminum coated with alu

A heat sink structure increasing the dielectric strength of isolation for power integrated circuits is formed from a common layer on which laterally spaced isolated layers for each individual integrated circuit are mounted. At least the isolated layers are formed of anodized aluminum coated with aluminum oxide on exterior surfaces. The aluminum and aluminum oxide of the isolated layers provide good thermal conduction for heat dissipation while the electric isolation from the common electric potential of the common layer is improved, at least in part, by increasing the distance between the integrated circuits and the common layer. The heat sink structure may be mounted within a weatherproof enclosure with one externally exposed surface for heat dissipation.

대표청구항 ▼

A heat sink structure increasing the dielectric strength of isolation for power integrated circuits is formed from a common layer on which laterally spaced isolated layers for each individual integrated circuit are mounted. At least the isolated layers are formed of anodized aluminum coated with alu

A heat sink structure increasing the dielectric strength of isolation for power integrated circuits is formed from a common layer on which laterally spaced isolated layers for each individual integrated circuit are mounted. At least the isolated layers are formed of anodized aluminum coated with aluminum oxide on exterior surfaces. The aluminum and aluminum oxide of the isolated layers provide good thermal conduction for heat dissipation while the electric isolation from the common electric potential of the common layer is improved, at least in part, by increasing the distance between the integrated circuits and the common layer. The heat sink structure may be mounted within a weatherproof enclosure with one externally exposed surface for heat dissipation. al melts, substantially filling said cavity. 10. A heat-activated self-aligning heat sink as claimed in claim 9, wherein said heat sink body includes a vent hole connected with an upper surface of said cavity to an upper surface of said heat sink body. 11. A heat-activated self-aligning heat sink as claimed in claim 10, wherein when said thermal material melts excess thermal material flows into said vent hole. 12. A heat-activated self-aligning heat sink as claimed in claim 9, further comprising: a thermally-conductive deformable material between said floating pedestal and the heat-generating device. 13. A heat-activated self-aligning heat sink as claimed in claim 9, wherein said heat sink body includes fins. 14. A heat-activated self-aligning heat sink as claimed in claim 9, wherein said floating pedestal is configured to tilt to match an angle of tilt of the upper surface of the heat-generating device. 15. A heat-activated self-aligning heat sink as claimed in claim 9, wherein said heat sink body is configured to mechanically attach to the substrate. 16. A heat-activated self-aligning heat sink comprising: a heat sink body including a cavity in a bottom surface of said heat sink body; a pedestal mechanically attached to a substrate; a floating pedestal moveably captured by said pedestal, wherein a bottom surface of said floating pedestals is configured to contact an upper surface of a heat-generating device attached to the substrate; a quantity of thermal material configured to fit between said floating pedestal and said cavity in said bottom surface of said heat sink body; and wherein when said thermal material is heated above a melting temperature of said thermal material and a compressive force is applied to said heat sink body and the substrate, said thermal material melts, substantially filling said cavity. 17. A heat-activated self-aligning heat sink as claimed in claim 16, wherein said heat sink body includes a vent hole connected with an upper surface of said cavity to an upper surface of said heat sink body. 18. A heat-activated self-aligning heat sink as claimed in claim 17, wherein when said thermal material melts excess liquid thermal material flows into said vent hole. 19. A heat-activated self-aligning heat sink as claimed in claim 16, further comprising: a thermally-conductive deformable material between said floating pedestal and the heat-generating device. 20. A heat-activated self-aligning heat sink as claimed in claim 16, wherein said heat sink body includes fins. 21. A heat-activated self-aligning heat sink as claimed in claim 16, wherein said floating pedestal is configured to tilt to match an angle of tilt of the upper surface of the heat-generating device. 22. A heat-activated self-aligning heat sink as claimed in claim 16, wherein said heat sink body is configured to mechanically attach to said pedestal. 23. A heat-activated self-aligning heat sink as claimed in claim 16, wherein said heat sink body is configured to mechanically attach to the substrate. 24. A method for the construction of a heat-activated self-aligning heat sink comprising the steps of: a) providing a heat sink body; b) creating a cavity in a bottom surface of the heat sink body; c) moveably attaching a floating pedestal to a pedestal mechanically attached to a substrate; d) placing a quantity of thermal material on a top surface of the floating pedestal; and e) placing the heat sink body over the thermal material such that the thermal material is captured between the cavity and the floating pedestal. 25. A method for the construction of a heat-activated self-aligning heat sink as claimed in claim 24, further comprising the step of: f) heating the thermal material to a temperature greater than a melting point of the thermal material, resulting in the thermal material turning into a liquid. 26. A method for the construction of a heat-activated se lf-aligning heat sink as claimed in claim 25, further comprising the step of: g) applying a compressive force to the heat sink body and the substrate sufficient to compress the assembly such that the heat sink body contacts the pedestal. 27. A method for the construction of a heat-activated self-aligning heat sink as claimed in claim 26, further comprising the step of: f) mechanically attaching the heat sink body to the pedestal. 28. A method for the construction of a heat-activated self-aligning heat sink as claimed in claim 26, further comprising the step of: f) mechanically attaching the heat sink body to the substrate. 29. A method for the construction of a heat-activated self-aligning heat sink as claimed in claim 26, wherein during said heating step, the liquid thermal material substantially fills a cavity in the bottom surface of the heat sink body. 30. A method for the construction of a heat-activated self-aligning heat sink comprising the steps of: a) providing a heat sink body; b) creating a cavity in a bottom surface of the heat sink body; c) attaching a pedestal to the heat sink body; d) placing a quantity of thermal material within the cavity; and e) moveably attaching a floating pedestal to the pedestal such that the thermal material is captured between the cavity and the floating pedestal. 31. A method for the construction of a heat-activated self-aligning heat sink as claimed in claim 30, further comprising the step of: f) heating the thermal material to a temperature greater than a melting point of the thermal material, resulting in the thermal material turning into a liquid. 32. A method for the construction of a heat-activated self-aligning heat sink as claimed in claim 31, further comprising the step of: g) applying a compressive force to the heat sink body and the substrate sufficient to compress the assembly such that the pedestal contacts a substrate. 33. A method for the construction of a heat-activated self-aligning heat sink as claimed in claim 32, further comprising the step of: h) mechanically attaching the heat sink body to a substrate. 34. A method for the construction of a heat-activated self-aligning heat sink as claimed in claim 32, further comprising the step of: h) mechanically attaching the pedestal to a substrate. 35. A method for the construction of a heat-activated self-aligning heat sink as claimed in claim 32, wherein during said heating step, the liquid thermal material substantially fills a cavity in the bottom surface of the heat sink body. 36. A method for the construction of a heat-activated self-aligning heat sink comprising the steps of: a) providing a heat sink body; b) creating a cavity in a bottom surface of the heat sink body; c) configuring the cavity to moveably capture a floating pedestal; d) placing a quantity of thermal material within said cavity; and e) moveably capturing the floating pedestal partially within said cavity, wherein a bottom surface of the floating pedestal is configured to contact an upper surface of a hear-generating device attached to a substrate, and an upper surface of the floating pedestal is within said cavity. 37. A method for the construction of a heat-activated self-aligning heat sink as claimed in claim 36, further comprising the step of: f) heating the thermal material to a temperature greater than a melting point of the thermal material, resulting in the thermal material turning into a liquid. 38. A method for the construction of a heat-activated self-aligning heat sink as claimed in claim 37, further comprising the step of: g) applying a compressive force to the heat sink body and the substrate sufficient to compress the assembly such that the heat sink body contacts the pedestal. 39. A method for the construction of a heat-activated self-aligning heat sink as claimed in claim 38, further comprising the step of f) mechanically attaching the heat sink body to the ped