초록 ▼

A heat sensing device manager system and method for processing signals from heat sensing devices used to monitor the semiconductor processing environment. The system includes a circuit for determining if a heat sensing device has failed. Where a heat sensing device has failed the system can switch c

A heat sensing device manager system and method for processing signals from heat sensing devices used to monitor the semiconductor processing environment. The system includes a circuit for determining if a heat sensing device has failed. Where a heat sensing device has failed the system can switch control of the system such that it relies on signals generated by operational heat sensing devices. The system also provides the user with an intuitive LED interface that provides the user with information regarding the operation of the heat sensing elements of the system, and where a heat sensing device has failed the user interface can convey information regarding the nature of a particular heat sensing device failure.

대표청구항 ▼

A heat sensing device manager system and method for processing signals from heat sensing devices used to monitor the semiconductor processing environment. The system includes a circuit for determining if a heat sensing device has failed. Where a heat sensing device has failed the system can switch c

A heat sensing device manager system and method for processing signals from heat sensing devices used to monitor the semiconductor processing environment. The system includes a circuit for determining if a heat sensing device has failed. Where a heat sensing device has failed the system can switch control of the system such that it relies on signals generated by operational heat sensing devices. The system also provides the user with an intuitive LED interface that provides the user with information regarding the operation of the heat sensing elements of the system, and where a heat sensing device has failed the user interface can convey information regarding the nature of a particular heat sensing device failure. member 4 into a stepped bore 8 formed in a tubular member 2, and setting an O-ring 16 on an upper surface of a stepped portion of the stepped bore 8, a clearance 15 between the shaft-like member 4 and tubular member 2 being thereby sealed with this seal structure. A seal region 17 is formed on the upper surface of the stepped portion of the stepped bore 8, and a conical introduction port portion 18 extending divergently in the rearward direction from the seal region toward an opening of the stepped bore 8 is provided. Moreover, a cone angle α of the introduction port portion 18 with respect to an axis L of the tubular member 2 is set to not larger than 35°.