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Ceramic semiconductor package and method for fabricating the package

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/48
  • H01L-023/04
  • H01L-023/12
  • H03H-011/00
  • H03H-009/02
출원번호 US-0881343 (2001-06-13)
발명자 / 주소
  • Glenn, Thomas P.
  • Hollaway, Roy D.
  • Webster, Steven
출원인 / 주소
  • Amkor Technology, Inc.
대리인 / 주소
    Bever, Hoffman & Harms, LLP
인용정보 피인용 횟수 : 15  인용 특허 : 22

초록

A sealed ceramic package for a semiconductor device and a method of fabricating the same are disclosed. In one embodiment, a ceramic substrate has a set of cavities each having an opening at a substrate top surface. A semiconductor die is disposed within each cavity, and is electrically connected th

대표청구항

A sealed ceramic package for a semiconductor device and a method of fabricating the same are disclosed. In one embodiment, a ceramic substrate has a set of cavities each having an opening at a substrate top surface. A semiconductor die is disposed within each cavity, and is electrically connected th

이 특허에 인용된 특허 (22)

  1. Kirkman Scott, Apparatus for forming electrical connections between a semiconductor die and a semiconductor package.
  2. Mahulikar Deepak ; Hoffman Paul R. ; Braden Jeffrey S., Ball grid array electronic package.
  3. Kamada Hiroshi,JPX ; Fukuhara Naoharu,JPX ; Terai Katuya,JPX ; Katoh Hiroshi,JPX, Ceramic package type electronic part which is high in connection strength to electrode.
  4. Knecht Thomas (Algonquin IL), Double-sided oscillator package and method of coupling components thereto.
  5. Dudderar Thomas Dixon ; Han Byung Joon,KRX ; Raju Venkataram Reddy ; Shevchuk George John, Electronic device package enclosed by pliant medium laterally confined by a plastic rim member.
  6. SinghDeo Narendra N. (New Haven CT) Mahulikar Deepak (Meriden CT) Butt Sheldon H. (Godfrey IL), Electronic packaging of components incorporating a ceramic-glass-metal composite.
  7. Miyoshi Akio (Nishitama JPX) Fukami Akira (Nishitama JPX), Hermetic sealing cover and a method of producing the same.
  8. Butt Sheldon H. (Godfrey IL), Hermetically sealed metal package.
  9. Satoru Tomie JP, High-frequency input/output feedthrough and package for housing a high-frequency semiconductor element.
  10. Going Timothy J. ; Lindner Alan W., High-frequency passband microelectronics package.
  11. Hamada Noriaki,JPX ; Yamaguchi Kouichi,JPX ; Yonekura Hideto,JPX ; Nagae Kenichi,JPX, Low-temperature calcined ceramics.
  12. Smith Charles (Ramona CA) Akhtar Masyood (San Diego CA) Chau Michael M. (San Diego CA) Savage David (San Diego CA), Metal-ceramic composite lid.
  13. Ohya Kazuyuki,JPX ; Sayama Norio,JPX, Metal-foil-clad composite ceramic board and process for the production thereof.
  14. Heckaman Douglas E. (Indialantic FL) Frisco Jeffrey A. (Palm Bay FL) Rieder Gregory C. (Satellite Beach FL) Bajgrowicz Edward J. (Palm Bay FL), Microwave chip carrier package having cover-mounted antenna element.
  15. Dunlap ; Jr. Earl S. ; Ford Stephen L., Nib for a marking pen and method of forming the same.
  16. Shiga Nobuo,JPX, Packaged semiconductor device suitable to be mounted and connected to microstrip line structure board.
  17. Sakai Yoshimi,JPX ; Kooriike Takumi,JPX, Piezoelectric element package in which a piezoelectric element on a chip carrier is reliably shielded by using a cap.
  18. Juskey, Frank J.; McMillan, John R.; Huemoeller, Ronald P., Printed circuit board with integral heat sink for semiconductor package.
  19. Moriyasu Miyazaki JP; Hidenori Yukawa JP; Hideyuki Oh-Hashi JP; Masatoshi Nii JP, RF circuit module.
  20. Akasaki Hidehiko,JPX, Semiconductor device package.
  21. Masato Higuchi JP; Atsushi Hirakawa JP; Shinobu Uesugi JP; Koichi Kanryo JP, Surface acoustic wave device having a package including a conductive cap that is coated with sealing material.
  22. Costello John A. ; Buhay Harry ; Papania Richard R. ; Rai-Choudhury Prosenjit ; Petrosky Kenneth J. ; Madia Gene A., Thick film copper metallization for microwave power transistor packages.

이 특허를 인용한 특허 (15)

  1. Xue, Xiaojie; Sengupta, Dipak, Cavity package with composite substrate.
  2. Farrell, Brian; Jaynes, Paul; Taylor, Malcolm, Chip package sealing method.
  3. Farrell, Brian; Jaynes, Paul; Taylor, Malcolm, Chip package sealing method.
  4. Farrell, Brian; Jaynes, Paul; Taylor, Malcolm, Electronic and optoelectronic component packaging technique.
  5. Farrell,Brian; Jaynes,Paul; Taylor,Malcolm, Electronic and optoelectronic component packaging technique.
  6. Hofer, Axel, Endoscope and method for recording at least one stereoscopic image by means of an endoscope.
  7. Nguyen, Jennifer; Geiger, David; Aranda, Ranilo; Sjoberg, Jonas; Mohammed, Anwar; Kurwa, Murad, Fixture design for pre-attachment package on package component assembly.
  8. Senju, Tomohiro, High frequency ceramic package and fabrication method for the same.
  9. Motohashi, Norikazu, Method for manufacturing semiconductor device and molded structure.
  10. Kobinata, Katsumi; Furukawa, Yoshiki; Nozaki, Takahiko, Optical communication module.
  11. Glidden,Steven C.; Sanders,Howard D., Packaging of solid state devices.
  12. Mullet, Willis J., Sectional door system.
  13. Mullet,Willis J., Sectional door system.
  14. Fuchinoue, Kenji, Semiconductor device and method of manufacturing the same.
  15. Palmteer, William, Surface mount package.
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