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Mechanical housing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01K-007/20
출원번호 US-0804129 (2001-03-12)
발명자 / 주소
  • Gustine, Gary
  • Ham, Charles G.
  • Sawyer, Michael
  • Daniels, Fredrick
  • Bishop, Michelle
  • King, Lane
  • Kusz, Matthew
출원인 / 주소
  • ADC Telecommunications, Inc.
대리인 / 주소
    Fogg and Associates, LLC
인용정보 피인용 횟수 : 24  인용 특허 : 40

초록

An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region

대표청구항

An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region

이 특허에 인용된 특허 (40)

  1. Houston, John M., Apparatus for maintaining electronic equipment and the like at low temperatures in hot ambient environments.
  2. Murchison Loren ; Burbano Carlos ; Reeve Brian Geroge, Backplate for securing a circuit card to a computer chassis.
  3. Martin Jacob (Wellesley MA), Combination conductive and convective heatsink.
  4. Randall D. Hutchison ; Robert Shiffbauer ; Kevan Smith, Concentrical slot telecommunications equipment enclosure.
  5. Ito Eiji (Aichi JPX), Control device case.
  6. Falaki Hamid Reza,GBX ; Gates William George,GBX ; Hanlon Patrick Francis,IEX ; Keegan Martin Michael Mark,IEX ; Kelly Daniel Peter,IEX, Cooling electronic apparatus.
  7. Leyssens Francois J. C. (Mortsel BEX) Rombouts Hendrikus M. J. (Zoersel BEX), Cooling system.
  8. Rein Charles R. (Panama City FL), Electronic card mount and heat transfer assembly for underwater vehicles.
  9. Bitller Jean-Pierre (Plaisir FRX) Faucher Pascal (Longjumeau FRX) Hang-Hu Monique (Sainte Genevieve des Bois FRX) Pelet Andr (Maurepas FRX), Electronic circuit housing.
  10. Hata Kanji (Katano JPX) Maruyama Masahiro (Mino JPX) Itemadani Eiji (Sakai JPX), Electronic component mounting device.
  11. Ono Hideyo (Hyogo JPX) Yoshitake Kunitoshi (Hyogo JPX) Kakuta Nobuyuki (Hyogo JPX), Electronic device housing with temperature management functions.
  12. Murphy John E. (Los Angeles CA) Gardner William T. (Los Angeles CA), Electronic module with self-activated heat pipe.
  13. Zapach Trevor,CAX ; Jeakins William D.,CAX ; Muegge Steven,CAX, Electronic unit.
  14. Beavers Roger L., Enclosure for high-density subscriber line modules.
  15. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.
  16. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.
  17. Pandolfi Richard, Environmental system for rugged disk drive.
  18. Baum Walter (Hanover DEX) Still Michael (Langenhagen DEX) Becker Erich (Seeheim-Jugenheim DEX), Heat-producing elements with heat pipes.
  19. Sharp, Stanley O., High density electronics packaging system for hostile environment.
  20. Fathi Saul S. (Huntington NY), Holder and heat sink for electronic components.
  21. Eggert Hans-Joachim (Karlsfed DT) Oberberger Otto (Gilching DT) Zenkert Heinrich (Munich DT), Housing for electrical communications and measuring devices.
  22. Pelet Andr (Maurepas FRX) Cachot Jacques (Saint Michel sur Orge FRX), Housing for submersible equipment.
  23. Bitller Jean-Pierre (Orsay FRX) Pelet Andr (Maurepas FRX) Wirth Guy (Paris FRX) Hang-Hu Monique (Saintry sur Seine FRX), Housing for underwater electronic circuits.
  24. Cobb Lane C. (Ridgefield WA) Kuzmanich Gregory M. (Portland OR), I/O riser card for motherboard in a personal computer/server.
  25. Kausch Marvin L. (San Jose CA), Isolation chamber for electronic devices.
  26. Chin-Yuan Hung TW; Chang-Fu Chen TW; Fu-Di Tang TW, Leadframe with dot array of silver-plated regions on die pad for use in exposed-pad semiconductor package.
  27. Laetsch Erich K., Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction.
  28. Buron Douglas J. (Plantation FL) Steinman Sheldon (Miramar FL) Wray Donald L. (Lauderhill FL), Modular expandable housing arrangement for electronic apparatus.
  29. Harris Michael P. (San Diego CA), Modular segment adapted to provide a passively cooled housing for heat generating electronic modules.
  30. Glover Hugh B. (Cary NC) Jones Clifford T. (Raleigh NC), Optical network unit.
  31. Davis Arthur A. (Harrold Wood GB2) Eady Robert W. (London GB2), Optical repeaters.
  32. Davis Aurthur A. (Harrold Wood GB2) Eady Robert W. (London GB2), Optical repeaters.
  33. Glover Richard John,CAX ; Bishop Michael Reginald,CAX ; Tencer Michal Stefan,CAX, Packaging system for thermally controlling the temperature of electronic equipment.
  34. Perry Michael W. (Ocean NJ), Repeater housing and circuit mounting structure.
  35. Morris ; Jr. Corydon E., Retention gasket with cooperating cover.
  36. Naedel Richard G. (Rockville MD) Bogdan Francis J. (Baltimore MD) Richardson Michael (Annapolis MD) Rosenberger Keith (Baltimore MD), Severe environment enclosure with thermal heat sink and EMI protection.
  37. Heinzer Hans E. (Chula Vista CA), Submarine housing for submarine cable system repeater components or the like.
  38. Garcia-Ortiz Asdrubal, Thermal management apparatus for a sealed enclosure.
  39. Reimer William A. (Wheaton IL), Thermal management plate.
  40. Vos David L. ; Hughto-Delzer Francis W., Thermally conductive vibration isolators.

이 특허를 인용한 특허 (24)

  1. Fischer,Larry G.; Wayman,Michael J., Apparatus for enclosing electronic components.
  2. Fischer, Larry G.; Moreau, Eric S.; Martell, Gregory, Apparatus for enclosing electronic components used in telecommunication systems.
  3. Obasih, Kem M.; DeKeuster, Richard M., Battery module passive thermal management features and positioning.
  4. Wayman,Michael J., Chassis mounted heat sink system.
  5. Cairo, John Alan; Fleig, Tyler; Nemec, Bruce Carl, Electrical enclosure cooling structure assembly and method.
  6. Kim, Duk-Yong; Lee, Jung-Pil; Kim, Kyoung-Seuk; Yoo, Chang-Woo; Jang, Sung-Ho, Enclosure device of wireless communication apparatus.
  7. Fischer,Larry G.; Hermel,Michael J.; Moreau,Eric S.; Martell,Gregory, Enclosure for electronic components.
  8. Merz, Nicholas G.; DiFonzo, John C.; Zadesky, Stephen P.; Prichard, Michael J., Heat dissipation in computing device.
  9. Merz, Nicholas G.; Difonzo, John C.; Zadesky, Stephen P.; Prichard, Michael J., Heat dissipation in computing device.
  10. Merz, Nick; DiFonzo, John; Zadesky, Stephen; Prichard, Michael, Heat dissipation in computing device.
  11. Merz, Nick; DiFonzo, John; Zadesky, Stephen; Prichard, Michael, Heat dissipation in computing device.
  12. Leon,Eduardo; Harwood,Walter; Bond,William; Hernandez,Frank; Vaidya,Avinash K., Heat pipe cooled electronics enclosure.
  13. Hahn, Amand J.; Boer, Rod P.; Schneider, Eric A., Housing for an automation system controller.
  14. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Housing for an electronic circuit module.
  15. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Housing for an electronic circuit module.
  16. Rytka, Maria Magdalena; Gharakhanian, Vahe; Jangirov, Rauf, IGBT packaging and cooling using PCM and liquid.
  17. Barth, Michael K.; Ham, Charles G.; Tennis, Gene; Kusz, Matthew; Sjodin, Chad J.; Ferris, Matthew; Petersen, Cyle D., Methods and systems of heat transfer for electronic enclosures.
  18. Carullo,Thomas J.; Willers,Arthur G.; Goodenough,Ryan K., Modular chassis divided along a midplane and cooling system therefor.
  19. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Modular electronic housing.
  20. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Modular electronic housing and assemblies.
  21. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Modular electronic housing and assemblies.
  22. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Modular electronic housing and assemblies.
  23. Hahn,Amand J.; Boer,Rod P.; Schneider,Eric A., Modular electronic housing and assemblies.
  24. Austin,David M.; Calanni,Daniel J.; Giacoma,Lawrence M.; Dorval,Jay H., Multiple printed circuit board heat transfer guide plates.
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