$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Sample processing system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/02
출원번호 US-0434663 (1999-11-05)
우선권정보 JP-0316577 (1998-11-06)
발명자 / 주소
  • Yanagita, Kazutaka
  • Ohmi, Kazuaki
  • Sakaguchi, Kiyofumi
출원인 / 주소
  • Canon Kabushiki Kaisha
대리인 / 주소
    Morgan & Finnegan, L.L.P.
인용정보 피인용 횟수 : 10  인용 특허 : 38

초록

This invention is to provide a processing system suitable for manufacturing, e.g., an SOI substrate. A processing system includes a turntable on which holding mechanisms for holding bonded substrate stacks are mounted at a substantially equal angular interval, a driving mechanism for pivoting the tu

대표청구항

This invention is to provide a processing system suitable for manufacturing, e.g., an SOI substrate. A processing system includes a turntable on which holding mechanisms for holding bonded substrate stacks are mounted at a substantially equal angular interval, a driving mechanism for pivoting the tu

이 특허에 인용된 특허 (38)

  1. Vogtmann Michael R. ; Lentz Terry L., Accurate positioning of a wafer.
  2. Munoz Jose P. (West Bloomfield MI), Adjustable fluid jet cleaner.
  3. Dexter Jeffrey L. (North Dartmouth MA) Fairweather William E. (Mattapoisett MA) Shurtleff Harold R. (Buzzards Bay MA), Apparatus and method for cleaning wafers.
  4. Cha Gi-ho,KRX ; Lee Byoung-hun,KRX, Apparatus and methods for wafer debonding using a liquid jet.
  5. Onodera Masami (Niigata JPX), Apparatus for cleaning and drying hard disk substrates.
  6. Bayley Barry J. (Newton-le-Willows GB2) Brittain Austin (Dumfries GB6) Graham Kenneth (St. Lukes ; Near Warrington GB2) Thawley Clive S. (Dumfries GB6), Apparatus for treating the surfaces of cylindrical objects in a number of sequential steps.
  7. Yabumoto Junsuke (Atsugi JPX) Hirose Masanori (Kawasaki JPX), Bubble separating apparatus.
  8. Henley Francois J. ; Cheung Nathan, Clustertool system software using plasma immersion ion implantation.
  9. Henley Francois J. ; Cheung Nathan, Controlled cleavage process using pressurized fluid.
  10. Atoji Tadashi,JPX, Fabrication process and fabrication apparatus of SOI substrate.
  11. Jang Kwon-yuong,KRX, Grinding apparatus for semiconductor wafers.
  12. Robinson Karl M. ; Stroupe Hugh, High-speed planarizing apparatus and method for chemical mechanical planarization of semiconductor wafers.
  13. Izutani Naoaki (Takatsuki JPX) Watanabe Yuji (Sakai JPX) Yasuhara Takashi (Toyonaka JPX) Sugioka Kayoko (Osaka JPX), Liquid separating apparatus.
  14. Moe Rolf (c/o Bjorne Enterprises ; Inc. ; 23595 Cabot St. ; Suite 111 Hayward CA 94545) Corriea David J. (Hayward CA) Premeau John E. (Fremont CA), Machine for stripping wafers.
  15. Eror Miroslav (Old Tappan NJ) Biehl Richard E. (Pearl River NY), Method and apparatus for handling and processing wafer-like materials.
  16. Jevtic Dusan, Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer pr.
  17. Freund Joseph Michael ; Przybylek George John ; Romero Dennis Mark, Method and apparatus for removing work pieces adhered to a support.
  18. Kazuaki Ohmi JP; Takao Yonehara JP; Kiyofumi Sakaguchi JP; Kazutaka Yanagita JP, Method and apparatus for separating composite member using fluid.
  19. Nguyen Thu ; Lavi Michal, Method and apparatus for sequencing wafers in a multiple chamber, semiconductor wafer processing system.
  20. Goesele Ulrich M. (Durham NC) Lehmann Volker (Durham NC), Method for bubble-free bonding of silicon wafers.
  21. Thomas Michael E. (Milpitas CA) van de Van Everhardus P. (Cupertino CA) Broadbent Eliot K. (San Jose CA), Method for preventing substrate backside deposition during a chemical vapor deposition operation.
  22. Itoh Takashi,JPX ; Saitoh Hiroyuki,JPX ; Kinami Haruyuki,JPX ; Konaka Toshinori,JPX ; Murai Tsuyoshi,JPX, Method for scrubbing substrate.
  23. Bankes Robert B. (Reading PA) Gladney Walter W. (Kutztown PA), Methods and apparatus for treating wafer-like articles.
  24. Asakawa Teruo,JPX ; Saeki Hiroaki,JPX, Multi-chamber treatment system.
  25. Gupta Anand ; Karlsrud Chris ; Gopalan Periya, Post-CMP wet-HF cleaning station.
  26. Bruel Michel (Veurey FRX), Process for the production of thin semiconductor material films.
  27. Asakawa Teruo (Yamanashi JPX) Osawa Tetsu (Sagamihara JPX) Hosaka Noboru (Yamanashi JPX), Processing system.
  28. Williams John K. (Fairport NY), Recovery of selenium and selenium alloys by hydraulic lathing.
  29. Koizumi Koutarou,JPX ; Tsunekawa Sukeyoshi,JPX ; Kawai Kazuhiko,JPX ; Shimoda Maki,JPX ; Itoh Katsuhiko,JPX ; Itoh Haruo,JPX ; Saito Akio,JPX, Removal method of organic matter and system for the same.
  30. Okamura Kouji,JPX ; Akimoto Masami,JPX, Resist processing process.
  31. Kazutaka Yanagita JP; Takao Yonehara JP; Kazuaki Omi JP; Kiyofumi Sakaguchi JP, Sample separating apparatus and method, and substrate manufacturing method.
  32. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample separating apparatus and method, and substrate manufacturing method.
  33. Bryan Michael A. ; Kai James K., Substrate cleaving tool and method.
  34. Fisher Jack (5884 Fredricksburg Dr. Nashville TN 37215) Maxwell G. Patrick (4416 Gerald Pl. Nashville TN 37205) Perry Larry (3333 Country Ridge Dr. Antioch TN 37013), System and method for the measurement of mechanical properties of elastic materials.
  35. Derbinski Senia L. ; Parker Richard Fred, Vacuum processing apparatus with low particle generating wafer clamp.
  36. Toshima Masato, Wafer transfer system and method of using the same.
  37. Ichikawa Masahiro,JPX ; Shimizu Toshikuni,JPX, Washing apparatus for disc-like workpieces.
  38. Murakami Frank A. (Santa Fe Springs CA), Wheel cleaning assembly.

이 특허를 인용한 특허 (10)

  1. Sakashita, Yoshihiko; Watanabe, Katsumi; Yamagata, Masahiro; Oshiba, Hisanori; Sarumaru, Shogo; Muraoka, Yusuke; Saito, Kimitsugu; Mizobata, Ikuo; Kitakado, Ryuji, High pressure processing apparatus and high pressure processing method.
  2. Sakashita,Yoshihiko; Watanabe,Katsumi; Oshiba,Hisanori; Sarumaru,Shogo; Muraoka,Yusuke; Saito,Kimitsugu; Mizobata,Ikuo; Kitakado,Ryuji, High pressure processing method.
  3. Yanagita, Kazutaka; Kohda, Mitsuharu; Sakaguchi, Kiyofumi; Fujimoto, Akira, Plate member separating apparatus and method.
  4. Wakabayashi, Satoshi, Polishing apparatus.
  5. Yanagita, Kazutaka; Ohmi, Kazuaki; Sakaguchi, Kiyofumi, Sample processing system.
  6. Yanagita, Kazutaka; Kohda, Mitsuharu; Sakaguchi, Kiyofumi; Fujimoto, Akira, Separating apparatus and processing method for plate member.
  7. Yanagita, Kazutaka; Kohda, Mitsuharu; Sakaguchi, Kiyofumi; Fujimoto, Akira, Separating apparatus and processing method for plate member.
  8. Hirakawa, Osamu; Yoshitaka, Naoto; Matsunaga, Masataka; Okamoto, Norihiko, Separation system, separation method, program and computer storage medium.
  9. Orii,Takehiko; Kuroda,Osamu, Substrate processing apparatus.
  10. Fujino, Yutaka, Substrate processing system.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로