초록 ▼

The power supply in accordance with the present invention provides AC redundancy while also preventing voltages from multiple AC voltage sources from adding at a common node. The adding of voltages is avoided by ensuring that only one AC voltage source at a time is providing the voltage at the outpu

The power supply in accordance with the present invention provides AC redundancy while also preventing voltages from multiple AC voltage sources from adding at a common node. The adding of voltages is avoided by ensuring that only one AC voltage source at a time is providing the voltage at the output. Even if the other AC voltage sources are connected afterwards, these later AC voltage source are prevented from providing power at the output. In addition, diodes prevent current from back flowing to the AC voltage sources which are not supplying power to the output. Because the power supply in accordance with the present invention neither uses redundant AC to DC power supplies from independent AC voltage sources, nor does it use a costly transfer switch, the power supply in accordance with the present invention is more cost effective than conventional redundant power supplies.

대표청구항 ▼

The power supply in accordance with the present invention provides AC redundancy while also preventing voltages from multiple AC voltage sources from adding at a common node. The adding of voltages is avoided by ensuring that only one AC voltage source at a time is providing the voltage at the outpu

The power supply in accordance with the present invention provides AC redundancy while also preventing voltages from multiple AC voltage sources from adding at a common node. The adding of voltages is avoided by ensuring that only one AC voltage source at a time is providing the voltage at the output. Even if the other AC voltage sources are connected afterwards, these later AC voltage source are prevented from providing power at the output. In addition, diodes prevent current from back flowing to the AC voltage sources which are not supplying power to the output. Because the power supply in accordance with the present invention neither uses redundant AC to DC power supplies from independent AC voltage sources, nor does it use a costly transfer switch, the power supply in accordance with the present invention is more cost effective than conventional redundant power supplies. electrically connected to the ones of the first array of solder connections; an interposer supporting portions of the plurality of conductive traces; and an adhesive having a thickness less than the diameter of ones of the first array of solder connections before reflow, the adhesive adhering the integrated circuit to the interposer such that before reflow of the first array of solder connections, unsupported portions of the plurality of conductive traces are deflected into pockets of the interposer. 5. The BGA package of claim 4, wherein the unsupported portions comprise a plurality of unsupported portions for each of the plurality of conductive traces and wherein each of the plurality of unsupported portions extends into one of the pockets of the interposer. 6. The BGA package of claim 5, wherein the plurality of unsupported portions oppose one another. 7. The BGA package of claim 5, wherein the plurality of unsupported portions are difference sizes. 8. The BGA package of claim 5, wherein the plurality of unsupported portions comprise flaps. 9. A ball grid array (BGA) package for an integrated circuit, the BGA package comprising: a first side; a second side comprising an array of solder balls; and an interior portion comprising: an integrated circuit, an array of solder bumps connected to ports of the integrated circuit, a flexible tape including pockets and including interconnect connecting ones of the array of solder bumps to ones of the array of solder balls, a plurality of deflectable cantilevers extended over each of the pockets in the flexible tape, wherein each of the plurality of deflectable cantilevers has sprung toward an original non-deflected position within the ones of the array of the solder bumps, and an attachment layer having a thickness less than a diameter of each of the solder bumps before reflow, the attachment layer attaching the integrated circuit to the flexible tape. 10. The BGA package of claim 9, wherein the plurality of deflectable cantilevers comprise flaps. 11. The BGA package of claim 9, wherein the attachment layer comprises adhesive. 12. The BGA package of claim 9, wherein the attachment layer comprises flexible tape. 13. The BGA package of claim 12, wherein the flexible tape comprises polymide tape. 14. The BGA package of claim 12, wherein the flexible tape comprises insulating material. 15. The BGA package of claim 12, wherein the flexible tape comprises at least one of thermoplastic, thermoplast, epoxy, flex circuit material, printed circuit board material, and fiber material. 16. A ball grid array (BGA) package comprising a plurality of deflectable conductive flaps used to electrically connect portions of the BGA package, the BGA package comprising: an integrated circuit; a pocket in a tape; an adhesive adhering the integrated circuit to the tape; a plurality of deflectable conductive flaps extended over the pocket; interconnect electrically connected to each of the plurality of deflectable conductive flaps; a solder connection electrically connected to the integrated circuit and applying a deflecting force to the plurality of deflectable conductive flaps after the adhesion of the integrated circuit to the tape and before reflow of the solder connection; and a solder ball electrically connected to the interconnect. 17. The ball grid array package of claim 16, wherein the deflecting force is reduced and the plurality of deflectable conductive flaps spring into the solder connection and toward their non-deflected position when the solder connection is reflown.