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특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Method of forming integral passive electrical components on organic circuit board substrates

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01C-017/06   
미국특허분류(USC) 029/620; 029/846; 029/848; 338/258; 338/308
출원번호 US-0105611 (1998-06-26)
발명자 / 주소
  • Bowles, Philip Harbaugh
  • Mobley, Washington Morris
  • Parker, Richard Dixon
  • Ellis, Marion Edmond
출원인 / 주소
  • Delphi Technologies, Inc.
대리인 / 주소
    Funke, Jimmy L.Chmielewski, Stefan V.
인용정보 피인용 횟수 : 32  인용 특허 : 10
초록
▼

A process for forming stable integrated resistors (14) and capacitors (28) on organic substrates (12). The resistors (14) and capacitors (28) are capable of a wide range of resistance and capacitance values, yet can be processed in a manner that does not detrimentally effect the organic substrate (12) or entail complicated processing. The method generally entails the use of thick-film materials usually of the types used to form resistors and capacitors on ceramic substrates. The thick-film materials are applied to an electrically-conductive foil (20) and...

대표
청구항
▼

A process for forming stable integrated resistors (14) and capacitors (28) on organic substrates (12). The resistors (14) and capacitors (28) are capable of a wide range of resistance and capacitance values, yet can be processed in a manner that does not detrimentally effect the organic substrate (12) or entail complicated processing. The method generally entails the use of thick-film materials usually of the types used to form resistors and capacitors on ceramic substrates. The thick-film materials are applied to an electrically-conductive foil (20) and...

이 특허에 인용된 특허 (10)

  1. Howard James R. (Santa Clara CA) Lucas Gregory L. (Newark CA) Bryan Scott K. (San Jose CA) Choe Jin S. (San Jose CA), Annular resistor coupled with printed circuit board through-hole.
  2. Howard James R. (Los Gatos CA) Lucas Gregory L. (Newark CA), Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture.
  3. Howard James R. (Sacramento CA) Lucas Gregory L. (Newark CA), Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture.
  4. Lee Joseph Y. (Agoura CA) Kriegel Michael H. (Santa Monica CA) Chuh Thomas Y. (Encinitas CA), Low noise polycrystalline semiconductor resistors by hydrogen passivation.
  5. Patel Daxesh K. (Hatfield PA) Baker Jay D. (Detroit MI), Method for laser scribing substrates.
  6. Chant Peter R. (Burlington CAX), Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby.
  7. Klaser John J. (Springfield MO), Method of making a multilayer printed circuit board having screened-on resistors.
  8. Sisler John R. (Scott\s Valley CA), Method of making multilayer printed circuit board.
  9. Ohkubo Toshio (Tokyo JPX) Katoh Hidehiko (Tokyo JPX) Kajiwara Yuji (Tokyo JPX), Method of manufacturing an integrated thermal printing head.
  10. Bowker Christopher D. (San Jose CA), Selective plasma etching during formation of integrated circuitry.

이 특허를 인용한 특허 (32)

  1. Suh, Seigi; Borland, William J., Acceptor doped barium titanate based thin film capacitors on metal foils and methods of making thereof.
  2. Roth,Weston; Searls,Damion T.; Jackson,James D., Apparatus and method for improving AC coupling on circuit boards.
  3. Langhorn,Jason; Ernsberger,Craig, Ball grid array resistor capacitor network.
  4. Ernsberger, Craig; Langhorn, Jason B.; Tu, Yinggang, Ball grid array resistor network.
  5. Borland,William J., Co-fired ceramic capacitor and method for forming ceramic capacitors for use in printed wiring boards.
  6. Borland, William J.; Ferguson, Saul; Majumdar, Diptarka; Traylor, Richard Ray, Electrodes, inner layers, capacitors, electronic devices and methods of making thereof.
  7. Mruz, John, Electronic component and method of making.
  8. Palanduz, Cengiz A., High-k thin film grain size control.
  9. Borland, William J.; Ferguson, Saul; Majumdar, Diptarka; Snogren, Matthew C.; Snogren, Richard H., Innerlayer panels and printed wiring boards with embedded fiducials.
  10. Fukuoka,Yoshitaka; Serizawa,Tooru; Yagi,Hiroshi; Shimada,Osamu; Hirai,Hiroyuki; Yamaguchi,Yuji, Method for fabricating wiring board provided with passive element.
  11. Fukuoka, Yoshitaka; Serizawa, Tooru; Yagi, Hiroshi; Shimada, Osamu; Hirai, Hiroyuki; Yamaguchi, Yuji, Method for fabricating wiring board provided with passive element, and wiring board provided with passive element.
  12. Tung, I-Chung, Method for making a multilayer circuit board having embedded passive components.
  13. Palanduz,Cengiz A.; Min,Yongki, Method for making a passive device structure.
  14. Schmitz,Gerd, Method for producing a large-mass ohmic resistor for protecting electronic assemblies from surges, and an electronic assembly.
  15. Mruz,John, Method of making an orientation-insensitive ultra-wideband coupling capacitor.
  16. Borland,William J.; Ferguson,Saul; Majumdar,Diptarka; Snogren,Matthew C.; Snogren,Richard H., Method of making interlayer panels.
  17. Borland,William J.; Ferguson,Saul; Pyada,Hena, Methods of forming printed circuit boards having embedded thick film capacitors.
  18. Borland, William; Drozdyk, Lorri, Methods of making high capacitance density ceramic capacitors.
  19. Palanduz, Cengiz A., Methods of making thin film capacitors.
  20. Borland, William; Burn, Ian; Ihlefeld, Jon Fredrick; Maria, Jon Paul; Suh, Seigi, Methods of making thin film capacitors comprising a manganese doped barium titantate dielectric.
  21. Palanduz, Cengiz A.; Min, Yongki, Passive device structure.
  22. Jung, Kyung Hun; Kim, Ik Soo; Jeon, Yuck Hwan; Jung, Hee Seok; Koo, Hwang Sub; Kim, Hyun Je, Printed circuit board including linking extended contact pad.
  23. Summers, John D., Resistor compositions for electronic circuitry applications.
  24. Amey, Jr., Daniel Irwin; Borland, William J., Thick film capacitors on ceramic interconnect substrates.
  25. Borland, William J.; Jones, III, Alton Bruce; Renovales, Olga L.; Hang, Kenneth Warren, Thick-film dielectric and conductive compositions.
  26. Palanduz, Cengiz A., Thin film capacitors and methods of making the same.
  27. Palanduz,Cengiz A., Thin film capacitors and methods of making the same.
  28. Borland,William J.; Ihlefeld,Jon Fredrick; Kingon,Angus Ian; Maria,Jon Paul, Thin film dielectrics for capacitors and methods of making thereof.
  29. Fukuoka, Yoshitaka; Serizawa, Tooru; Yagi, Hiroshi; Shimada, Osamu; Hirai, Hiroyuki; Yamaguchi, Yuji, Wiring board provided with passive element and cone shaped bumps.
  30. Palanduz, Cengiz A.; Wood, Dustin P., iTFC with optimized C(T).
  31. Palanduz, Cengiz A.; Wood, Dustin P., iTFC with optimized C(T).
  32. Palanduz,Cengiz A.; Wood,Dustin P., iTFC with optimized C(T).

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