A pressure-sensitive adhesive comprising a blend of at least two components, wherein the first component is at least one pressure-sensitive adhesive and second component is at least one thermoplastic material, wherein the components form a blended composition having more than one domain and, wherein
A pressure-sensitive adhesive comprising a blend of at least two components, wherein the first component is at least one pressure-sensitive adhesive and second component is at least one thermoplastic material, wherein the components form a blended composition having more than one domain and, wherein one domain is substantially continuous (generally, the pressure-sensitive adhesive) and the other domain is substantially fibrillous to schistose (generally, the thermoplastic material). The second component can be (a) at least one thermoplastic elastomer, (b) at least one elastomer with a tackifying resin or (c) at least one elastomer.
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A pressure-sensitive adhesive comprising a blend of at least two components, wherein the first component is at least one pressure-sensitive adhesive and second component is at least one thermoplastic material, wherein the components form a blended composition having more than one domain and, wherein
A pressure-sensitive adhesive comprising a blend of at least two components, wherein the first component is at least one pressure-sensitive adhesive and second component is at least one thermoplastic material, wherein the components form a blended composition having more than one domain and, wherein one domain is substantially continuous (generally, the pressure-sensitive adhesive) and the other domain is substantially fibrillous to schistose (generally, the thermoplastic material). The second component can be (a) at least one thermoplastic elastomer, (b) at least one elastomer with a tackifying resin or (c) at least one elastomer. rs. 19. The filled prepreg of claim 14 wherein the multicellular polymeric microspheres have a mean diameter less than 10 micrometers and 95% have a diameter which is no greater than 70 micrometers. 20. The filled prepreg of claim 1 wherein the multicellular polymeric microspheres have a liquid density of about 0.1 g/ml. 21. The filled prepreg of claim 1 wherein the multicellular polymeric microspheres have a liquid density of about 0.1 to about 1.1 g/ml. 22. The filled prepreg of claim 1 wherein the multicellular polymeric microspheres display a compressive strength between 400 and 4,000 lbs/in2(27.5 Bar and about 275 Bar). 23. The filled prepreg of claim 1 wherein the multicellular polymeric microspheres comprise a vinyl, polyacrylate, polyamide, polyimide, polyurethane, polyester, polyether, cresolic, or phenolic polymer. 24. The filled prepreg of claim 23 wherein 95% of the multicellular polymeric microspheres have a diameter which is no greater than 70 micrometers. 25. The filled prepreg of claim 23 wherein 95% of the multicellular polymeric microspheres have a diameter which is no greater than 25 micrometers. 26. The filled prepreg of claim 23 wherein the multicellular polymeric microspheres have a mean diameter which is no greater than 10 micrometers. 27. The filled prepreg of claim 23 wherein the multicellular polymeric microspheres have a mean diameter less than 25 micrometers and 95% have a diameter which is no greater than 70 micrometers. 28. The filled prepreg of claim 23 wherein the multicellular polymeric microspheres have a mean diameter less than 10 micrometers and 95% have a diameter which is no greater than 70 micrometers. 29. The filled prepreg of claim 23 wherein 95% of the multicellular polymeric microspheres have a diameter which is no greater than 70 micrometers and the pre-preg comprises a flame retardant composition. 30. The filled prepreg of claim 23 wherein the pre-preg comprises a flame retardant composition. 31. The filled prepreg of claim 1 wherein the pre-preg comprises a flame retardant composition. 32. The filled prepreg of claim 31 wherein the flame retardant composition comprises a halogenated compound. 33. The filled prepreg of claim 31 wherein the flame retardant composition comprises a brominated epoxy or brominated filler. 34. The filled prepreg of claim 31 wherein the flame retardant composition comprises a phosphorus, nitrogen, or boron containing compound. 35. The filled prepreg of claim 1 wherein the pre-preg comprises an epoxy resin containing about 15% to 60% by weight bromine. 36. The filled prepreg of claim 1 wherein the pre-preg comprises a UV blocking dye. 37. The filled prepreg of claim 1 wherein the pre-preg comprises pigments. 38. The filled prepreg of claim 1 wherein the pre-preg comprises a flow modifier. 39. The filled prepreg of claim 1 wherein said polymeric resin is selected from the group consisting of epoxy, phenolic, benzoxazine, polyimide, cyanate ester, bismaleimide triazine, polyester, and polyphenylene ether resins. 40. The filled prepreg of claim 39 wherein the multicellular polymeric microspheres comprise a vinyl, polyacrylate, polyamide, polyimide, polyurethane, polyester, polyether, cresolic, or phenolic polymer. 41. The filled prepreg of claim 40 wherein 95% of the multicellular polymeric microspheres have a diameter which is no greater than 70 micrometers. 42. The filled prepreg of claim 40 wherein 95% of the multicellular polymeric microspheres have a diameter which is no greater than 25 micrometers. 43. The filled prepreg of claim 40 wherein the multicellular polymeric microspheres have a mean diameter which is no greater than 10 micrometers. 44. The filled prepreg of claim 40 wherein the multicellular polymeric microspheres have a mean diameter less than 25 micrometers and 95% have a diameter which is no greater than 70 micrometers. 45. The filled prepreg of claim 40 wherein the multicellular polymeric microspheres have a mean diameter less th an 10 micrometers and 95% have a diameter which is no greater than 70 micrometers. 46. The filled prepreg of claim 40 wherein the reinforcing material is selected from the group consisting of electronics grade glass, quartz, aramid, paper and PTFE. 47. The filled prepreg of claim 39 wherein the reinforcing material is selected from the group consisting of electronics grade glass, quartz, aramid, paper and PTFE. 48. The filled prepreg of claim 1 wherein the reinforcing material is selected from the group consisting of electronics grade glass, quartz, aramid, paper and PTFE. 49. A conductor-clad substrate comprising the composition of claim 1, 2, 3, 8, 9, 22, 23, 24, 31, 32, 39, 40, 41, 46, 47, or 48. 50. A printed circuit board comprising the composition of claim 1, 2, 3, 8, 9, 22, 23, 24, 31, 32, 39, 40, 41, 46, 47, or 48. 51. A process for the preparation of a filled prepreg composition, the process comprising the following steps in the specified order: (i) impregnating a reinforcing material with a varnish, the varnish containing a solvent, multicellular polymeric microspheres composing at least two open or closed cavities as a filler, and a monomer or a polymeric resin which is partially cured, (ii) evaporating solvent from the impregnated reinforcing material, and (iii) optionally heating the impregnated material to cure the monomer or further cure the polymeric resin to form a pre-preg. 52. The process of claim 51 wherein the polymeric resin comprises a surfactant. 53. The process of claim 51 wherein 95% of the multicellular polymeric microspheres have a diameter which is no greater than 70 micrometers. 54. The process of claim 51 wherein 95% of the multicellular polymeric microspheres have a diameter which is no greater than 25 micrometers. 55. The process of claim 51 wherein the multicellular polymeric microspheres have a mean diameter which is no greater than 10 micrometers. 56. The process of claim 51 wherein the multicellular polymeric microspheres have a mean diameter less than 25 micrometers and 95% have a diameter which is no greater than 70 micrometers. 57. The process of claim 51 wherein the multicellular polymeric microspheres have a mean diameter less than 10 micrometers and 95% have a diameter which is no greater than 70 micrometers. 58. The process of claim 51 wherein the multicellular polymeric microspheres have a liquid density of no more than 1.4 g/ml. 59. The process of claim 51 wherein the multicellular polymeric microspheres have a liquid density of no more than 0.6 g/ml. 60. The process of claim 51 wherein the multicellular polymeric microspheres have a liquid density of about 0.1 g/ml. 61. The process of claim 51 wherein the multicellular polymeric microspheres have a liquid density of about 0.1 to about 1.1 g/ml. 62. The process of claim 51 wherein the multicellular polymeric microspheres display a compressive strength between 400 and 4,000 lbs/in2(27.5 Bar and about 275 Bar). 63. The process of claim 51 wherein the multicellular polymeric microspheres comprise a vinyl, polyacrylate, polyamide, polyimide, polyurethane, polyester, polyether, cresolic, or phenolic polymer. 64. The process of claim 51 wherein the varnish contains a polymeric resin selected from the group consisting of epoxy, phenolic, benzoxazine, polyimide, cyanate ester, bismaleimide triazine, polyester, and polyphenylene ether resins. 65. The process of claim 51 wherein the varnish contains a monomer or a mixture of monomers which, upon polymerization, form a polymeric resin selected from the group consisting of epoxy, phenolic, benzoxazine, polyimide, cyanate ester, bismaleimide triazine, polyester, and polyphenylene ether resins. ted organic molecules on silicon surfaces; Fresenius' Journal of Analytical Chemistry; Jun. 24-27, 1996; pp. 258-262. K. Suzuki; Deposition of triazine dithiol organic thin films on Fe substrate and their evaluation; Chemical Abstracts; Dec. 21, 1998; p. 1250.
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