초록 ▼

Multilayered metal oxide coated substrates are disclosed comprising a three dimensional inorganic substrate having a coating of metal oxide on at least a portion of all three dimensions thereof, produced by a unique process having particular applicability to the manufacture of tin oxide coated three

Multilayered metal oxide coated substrates are disclosed comprising a three dimensional inorganic substrate having a coating of metal oxide on at least a portion of all three dimensions thereof, produced by a unique process having particular applicability to the manufacture of tin oxide coated three dimensional substrates. Certain novel coated substrates, such as flakes, spheres and porous substrates are disclosed. The coated substrates are useful in polymers, catalysis, heating and shielding applications.

대표청구항 ▼

Multilayered metal oxide coated substrates are disclosed comprising a three dimensional inorganic substrate having a coating of metal oxide on at least a portion of all three dimensions thereof, produced by a unique process having particular applicability to the manufacture of tin oxide coated three

Multilayered metal oxide coated substrates are disclosed comprising a three dimensional inorganic substrate having a coating of metal oxide on at least a portion of all three dimensions thereof, produced by a unique process having particular applicability to the manufacture of tin oxide coated three dimensional substrates. Certain novel coated substrates, such as flakes, spheres and porous substrates are disclosed. The coated substrates are useful in polymers, catalysis, heating and shielding applications. idth of a semispherical or semicylindrical microstructure is approximately in a range from 1 μm to 200 μm. 10. A method for fabricating a mold comprising the steps of: forming a microstructure array as set forth in claim 4; forming a mold on the substrate having the first plated or electrodeposited layer, and the second plated layer and the third plated layer; and separating the mold from the substrate. 11. A method for fabricating a microlens array comprising the steps of: forming a microstructure array as set forth in claim 7; coating the substrate having the first plated or electrodeposited layer, the second plated layer with a first resin; hardening the first resin; separating the first resin from the substrate; and coating the hardened first resin with a second resin having a refractive index different from a refractive index of the first resin. 12. A fabrication method according to claim 1, wherein the opening has a circular shape and the microstructures of the microstructure array are semispherical microstructures. 13. A fabrication method according to claim 1, wherein the opening has an elongated stripe shape and the microstructures of the microstructure array are semicylindrical microstructures. 14. A fabrication method according to claim 1, wherein the first plated layer is formed by electroplating. 15. A fabrication method according to claim 1, wherein the first electrodeposited layer is formed by electrodeposition using an electrodepositable organic compound. 16. A fabrication method according to claim 1, wherein microstructures of the array are continuously formed at their bottom portions. 17. A fabrication method according to claim 1, wherein the first plated or electrodeposited layer and the second plated layer are formed such that a bottom diameter or width of a semispherical or semicylindrical microstructure is approximately in a range from 1 μm to 200 μm. 18. A method for fabricating a mold comprising the steps of: forming a microstructure array as set forth in claim 1; forming a mold on the substrate having the first plated or electrodeposited layer and the second plated layer; and separating the mold from the substrate. 19. A method for fabricating a microlens array comprising the steps of: forming a microstructure array as set forth in claim 1; coating the substrate having the first plated or electrodeposited layer and the second plated layer with a first resin; hardening the first resin; separating the first resin from the substrate; and coating the hardened first resin with a second resin having a refractive index different from a refractive index of the first resin. 20. A method of fabricating an array of microstructures comprising the steps of: preparing a substrate with an electrically-conductive portion; forming an insulating mask layer on the electrically-conductive portion; forming a plurality of openings in the insulating mask layer; electroplating a first plated layer or electrodepositing an electrodeposited layer in the plurality of openings and extending onto an adjacent portion of the insulating mask layer to form a semispherical or semicylindrical layer forming a second plated layer on the first plated layer or electrodeposited layer and on the electrically-conductive portion by electroless plating to thereby form a microstructure array comprising semispherical or semicylindrical microstructures; optionally forming a third plated layer on the second plated layer by electroless plating; and forming the first plated layer or electrodeposited layer such that a ratio of a diameter or width of the first plated layer or electrodeposited layer to a bottom diameter or width of a semispherical or semicylindrical microstructure is less than about 0.5. 21. A fabrication method according to claim 20, wherein the first plated layer or electrodeposited layer is formed such that a diameter or width of the first plated layer or electrodeposited layer is less tha