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An enhanced heat dissipation system and a method to extract heat from an integrated circuit device include a thermally conductive core having upper and lower outer surface areas. The system further includes a first conductive ring having a first array of radially extending fins. The first conductive

An enhanced heat dissipation system and a method to extract heat from an integrated circuit device include a thermally conductive core having upper and lower outer surface areas. The system further includes a first conductive ring having a first array of radially extending fins. The first conductive ring is thermally coupled to the upper outer surface area. The first array and the lower outer surface area of the thermally conductive core are of sufficient size to allow components on a motherboard to encroach around and onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device.

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An enhanced heat dissipation system and a method to extract heat from an integrated circuit device include a thermally conductive core having upper and lower outer surface areas. The system further includes a first conductive ring having a first array of radially extending fins. The first conductive

An enhanced heat dissipation system and a method to extract heat from an integrated circuit device include a thermally conductive core having upper and lower outer surface areas. The system further includes a first conductive ring having a first array of radially extending fins. The first conductive ring is thermally coupled to the upper outer surface area. The first array and the lower outer surface area of the thermally conductive core are of sufficient size to allow components on a motherboard to encroach around and onto the integrated circuit device when the heat dissipation device is mounted onto the integrated circuit device. 9950900, Morehouse; US-5452159, 19950900, Stefansky; US-5463527, 19951000, Hager et al.; US-5479285, 19951200, Burke; US-5502604, 19960300, Furay; US-5532889, 19960700, Stefansky et al.; US-5532891, 19960700, Tsujino; US-5550712, 19960800, Crockett; US-5585986, 19961200, Parkin; US-5615070, 19970300, Bordes; US-5631788, 19970500, Richards, 360/245.9; US-5644454, 19970700, Arya et al.; US-5663855, 19970900, Kim et al.; US-5715169, 19980200, Noguchi, 360/132; US-5724216, 19980300, Iftikar et al.; US-5739995, 19980400, Ohmi et al.; US-5754357, 19980500, Anderson et al.; US-5793207, 19980800, Gill; US-5808830, 19980900, Stefansky; US-5808866, 19980900, Porter; US-5809520, 19980900, Edwards et al., 360/097.01; US-5812373, 19980900, Hwang; US-5818029, 19981000, Thomson; US-5831788, 19981100, Hofland, 360/097.01; US-5837934, 19981100, Valavanis et al.; US-5928347, 19990700, Jones; US-5943193, 19990800, Thayne et al.; US-5943208, 19990800, Kato et al.; US-5949630, 19990900, Yamamoto et al.; US-5969901, 19991000, Eckberg et al.; US-5995365, 19991100, Broder et al.; US-5999406, 19991200, McKain et al.; US-6021029, 20000200, Mamiya et al.; US-6025973, 20000200, Mizoshita et al.; US-6028744, 20000200, Amirkiai et al.; US-6082543, 20000700, Beliveau; US-6128670, 20001000, Hashimoto et al.; US-6144552, 20001100, Whitcher