초록 ▼

A method and apparatus for controlling a centrifuge system, the centrifuge system including a rotor and a motor operatively coupled to the rotor, the apparatus including an accelerometer coupled to the centrifuge system so as to measure an acceleration of at least a portion of the centrifuge system

A method and apparatus for controlling a centrifuge system, the centrifuge system including a rotor and a motor operatively coupled to the rotor, the apparatus including an accelerometer coupled to the centrifuge system so as to measure an acceleration of at least a portion of the centrifuge system during operation of the centrifuge system to provide an acceleration signal, a filter that receives the acceleration signal and provides a filtered acceleration signal, and a controller that receives the displacement signal and controls the centrifuge system in response to the displacement signal.

대표청구항 ▼

A method and apparatus for controlling a centrifuge system, the centrifuge system including a rotor and a motor operatively coupled to the rotor, the apparatus including an accelerometer coupled to the centrifuge system so as to measure an acceleration of at least a portion of the centrifuge system

A method and apparatus for controlling a centrifuge system, the centrifuge system including a rotor and a motor operatively coupled to the rotor, the apparatus including an accelerometer coupled to the centrifuge system so as to measure an acceleration of at least a portion of the centrifuge system during operation of the centrifuge system to provide an acceleration signal, a filter that receives the acceleration signal and provides a filtered acceleration signal, and a controller that receives the displacement signal and controls the centrifuge system in response to the displacement signal. t for spraying and cleaning solvent. 6. A method for preventing metal corrosion on a wafer during a chemical mechanical polishing (CMP) process when the process is temporarily halted according to claim 1 further comprising the step of disengaging said wafer from said polishing pad such that said top surface of the wafer is exposed after said polishing process is stopped. 7. A method for preventing metal corrosion on a wafer during a chemical mechanical polishing (CMP) process when the process is temporarily halted according to claim 1, wherein said metal layer on said top surface of the wafer is a copper layer.