초록 ▼

The present invention relates to a process for the fast and efficient filling of voids of both simple and complex shape which can be carried out at room temperature. In particular, the present invention consists of the use of free flowing thermally expanding and curing powders which are poured into

The present invention relates to a process for the fast and efficient filling of voids of both simple and complex shape which can be carried out at room temperature. In particular, the present invention consists of the use of free flowing thermally expanding and curing powders which are poured into the voids and then heated causing the powder to expand, coalesce and cure and thus filling or partially filling the void space as required. The process according to the present invention is particularly suitable for filling the spaces in, around and between honeycomb or pre-formed foam cores as required to produce a filled or partially filled honeycomb or foam core or any other material used in sandwich panel construction. This process is also a simple and efficient method for filling moulds suitable for use in cellular artefact production. The filled or partially filled mould or honeycomb core can then be cured to produce bonded sandwich panels or moulded cellular artefacts. In sandwich panel construction the core material can be bounded by one or more surface skins and the cured bonded panel can be cut to provide a panel having pre-sealed edges.

대표청구항 ▼

1. A process for completely filling a void having an open face with a coherent low density solid comprising the steps of adding a free flowing thermally expanding, foamable and curing powder to the void to completely fill the void with the powder, and heating the powder causing the powder to expand,

1. A process for completely filling a void having an open face with a coherent low density solid comprising the steps of adding a free flowing thermally expanding, foamable and curing powder to the void to completely fill the void with the powder, and heating the powder causing the powder to expand, sinter and cure, wherein said free flowing thermally expanding, foamable and curing powder is an epoxy resin composition, and wherein the heating step provides a completely filled void. 2. A process according to claim 1 in which the void is a cavity in a mould. 3. A process according to claim 1 wherein the foamable powder is nonsintering in the temperature range of from 0° C. to about 50° C. 4. A process according to claim 1 wherein the foamable powder is prepared by grinding a solid thermally expandable resin, having a softening point of at least about 55° C., into a powder having a particle size of from between about 100 to 2000 μm. 5. A process according to claim 1 wherein the free flowing thermally expanding, foamable and curing powder is an epoxy resin manufactured from 2,2-bis-(4-hydroxyphenyl)propane and epichlorohydrin. 6. A process for the manufacture of a sandwich panel construction by filling, reinforcing and/or joining core materials of said construction comprising an internal core material, characterized in that at least some of the voids, these being either inside the core material having voids, or in between the same or different core materials, or the core materials and any other solid surfaces included in the sandwich panel construction, are filled according to the process of claim 1. 7. A process according to claim 6 further comprising, after the filling step and before the heating step, the step of pressing a facing material against the open face. 8. A process according to claim 7 wherein a film or liquid adhesive, is additionally present between the core material and the facing material. 9. A process according to claim 6 wherein the filled voids are fully filled with the foamable powder under no external applied pressure during the filling step. 10. A process according to claim 6 wherein the core material is selected from rigid foams, cellulose paper honeycomb, polyamide paper honeycomb, fabric based honeycomb, or metal honeycomb. 11. A process according to claim 7 wherein the facing material is either a preformed sheet of metal, glass, wood, plain or reinforced plastics, laminates and combinations thereof or a sheet formed in-situ from resin prepregs or fibres and further comprising the step of applying liquid curable resins to the facing material or combinations of facing materials. 12. A process according to claim 6 wherein the filled, sandwich panel is cured at a temperature range of from about 80° C. to about 200° C. 13. A sandwich panel obtained according to the process of claim 6.