IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0761014
(2001-01-16)
|
우선권정보 |
JP-0277266 (2000-08-10) |
발명자
/ 주소 |
- Higuchi, Tetsuya
- Uchibori, Takahiro
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
1 인용 특허 :
14 |
초록
▼
A self-contained photosensitive material comprising: a support; an imaging layer on the support, the imaging layer comprising a developer material and a plurality of photosensitive microcapsules encapsulating a photosensitive composition and a color precursor; and a protective coating on the imaging
A self-contained photosensitive material comprising: a support; an imaging layer on the support, the imaging layer comprising a developer material and a plurality of photosensitive microcapsules encapsulating a photosensitive composition and a color precursor; and a protective coating on the imaging layer, the protective coating comprising a cured film of a water-soluble or water-dispersible resin, wherein upon image-wise exposing the imaging layer to actinic radiation and rupturing the microcapsules, the color precursor is released from the microcapsules and reacts with the developer material to form a color image is disclosed.
대표청구항
▼
A self-contained photosensitive material comprising: a support; an imaging layer on the support, the imaging layer comprising a developer material and a plurality of photosensitive microcapsules encapsulating a photosensitive composition and a color precursor; and a protective coating on the imaging
A self-contained photosensitive material comprising: a support; an imaging layer on the support, the imaging layer comprising a developer material and a plurality of photosensitive microcapsules encapsulating a photosensitive composition and a color precursor; and a protective coating on the imaging layer, the protective coating comprising a cured film of a water-soluble or water-dispersible resin, wherein upon image-wise exposing the imaging layer to actinic radiation and rupturing the microcapsules, the color precursor is released from the microcapsules and reacts with the developer material to form a color image is disclosed. otonics, Inc., MIT Lincoln Lab, ARCH Chemicals, Finle Technologies, KLATencor Corp. (10 pages). Ronse, K., et al., "Thin Film Interference Effects in Phase Shifting Masks Causing Phase and Transmittance Errors", IMEC (15 pages). Rosenbluth, A., et al., "Optimum Mask and Source Patterns to Print a Given Shape", IBM (17 pages). Sakata, M., et al., "A Novel Radiaion Sensitive Spin-on-Glass Convertible into SiO2 and the Simple Fabrication Process Using It", Oki Electric Industry Co. Ltd. (3 pages). Schmidt, R., et al., "Impact of Coma on CD Control for Multiphase PSM Designs", AMD, ASML (10 pages). Sewell, H., et al., "An Evaluation of the Dual Exposure Technique", SVG Lithography Systems Inc. (11 pages). Spence, C., et al., "Optimization of Phase-Shift Mask Designs Including Defocus Effects", AMD, Princeton University, Vecor Technologies Inc. (8 pages). Suzuki, A., et al., "Multilevel Imaging System Realizing k1=-.3 Lithogrpahy", Canon Inc. (13 pages). Vandenberghe, G., et al., "(Sub-)100nm Gate Patterning Using 248nm Alternating PSM", IMEC, Mentor Graphics (9 pages). Fritze, M., et al., "100-nm Node Lithography with KrF?", MIT Lincoln Lab, Numberical Technologies, Photronics, Arch Chemicals (14 pages). Fukuda, H., et al., "Patterning of Random Interconnect Using Double Exposure of Strong-Type PSMs", Hitachi Central Research Lab (8 pages). Ferguson, R., et al., "Pattern-Dependent Correction of Mask Topography Effects for Alternating Phase-Shifting Masks", IBM Microelectronics, University of California Berkeley (12 pages). Toublan, O., et al., "Phase and Transmission Errors Aware OPC Solution for PSM: Feasibility Demonstration", Mentor Graphics Corp. (7 pages). Yanagishita, Y., et al., "Phase-Shifting Photolithography Applicable to Real IC Patterns", Fuitsu Limited (11 pages). Levenson, M., et al., "The Phase-Shifting Mask II: Imaging Simulations and Submicrometer Resist Exposures", IEEE Transactions on Electron Devices, vol. ED-31, No. 6, pp. 753-763, Jun. 1984. IBM, "Method to Produce Sizes in Openings in Photo Images Smaller Than Lithographic Minimum Size", IBM Technical Disclosure Bulletin, vol. 29, No. 3, p. 1328, Aug. 1986. Buraschi, M., et al., "Optical-Diffraction-Based Modulation of Photoresist Profile or Microl
※ AI-Helper는 부적절한 답변을 할 수 있습니다.